Material Content Data Sheet
Sales Product Name
MA#
Package
Construction Element
chip
leadframe
SPA17N80C3
MA001044374
PG-TO220-3-121
Material Group
inorganic material
non noble metal
inorganic material
non noble metal
non noble metal
organic material
plastics
inorganic material
non noble metal
non noble metal
inorganic material
non noble metal
noble metal
non noble metal
inorganic material
non noble metal
non noble metal
< 10%
Substances
silicon
iron
phosphorus
copper
aluminium
carbon black
epoxy resin
silicondioxide
tin
nickel
phosphorus
antimony
silver
tin
phosphorus
iron
copper
CAS#
if applicable
7440-21-3
7439-89-6
7723-14-0
7440-50-8
7429-90-5
1333-86-4
-
60676-86-0
7440-31-5
7440-02-0
7723-14-0
7440-36-0
7440-22-4
7440-31-5
7723-14-0
7439-89-6
7440-50-8
Issued
Weight*
Weight
[mg]
12.969
0.687
0.206
686.221
2.577
2.187
205.581
885.748
7.942
0.305
0.001
0.558
1.395
3.626
0.130
0.433
432.110
Average
Mass
[%]
0.58
0.03
0.01
30.60
0.11
0.10
9.17
39.50
0.35
0.01
0.00
0.02
0.06
0.16
0.01
0.02
19.27
29. August 2013
2242.68 mg
Sum
[%]
0.58
Average
Mass
[ppm]
5783
306
92
30.64
0.11
305984
1149
975
91668
48.77
0.35
394950
3541
136
0.01
1
249
622
0.24
1617
58
193
19.30
192676
192927
1000000
2488
136
487594
3541
306382
1149
Sum
[ppm]
5783
wire
encapsulation
leadfinish
plating
solder
heatspreader
*deviation
Sum in total: 100,00
Important Remarks:
1.
2.
3.
Infineon Technologies AG provides full material declaration based on information provided by third parties and
has taken and continues to take reasonable steps to provide representative and accurate information.
Infineon Technologies AG and Infineon Technologies AG suppliers consider certain information to be
proprietary, and thus CAS numbers and other limited information may not be available for release.
All statements are based on our present knowledge, are provided 'as is' and may be subject to change at any
time due to technical requirements and development without notification.
Company
Address
Internet
Infineon Technologies AG
81726 München
www.infineon.com