DISK DRIVE MOTOR CONTROLLER, 1.3 A, PDSO25
| 参数名称 | 属性值 |
| 是否无铅 | 不含铅 |
| 是否Rohs认证 | 符合 |
| 零件包装代码 | SOIC |
| 包装说明 | HSSOP, SOP34,.3,32 |
| 针数 | 25 |
| Reach Compliance Code | compli |
| ECCN代码 | EAR99 |
| 模拟集成电路 - 其他类型 | DISK DRIVE MOTOR CONTROLLER |
| JESD-30 代码 | R-PDSO-G25 |
| JESD-609代码 | e2 |
| 长度 | 13.6 mm |
| 功能数量 | 1 |
| 端子数量 | 25 |
| 最高工作温度 | 75 °C |
| 最低工作温度 | -20 °C |
| 最大输出电流 | 1.3 A |
| 封装主体材料 | PLASTIC/EPOXY |
| 封装代码 | HSSOP |
| 封装等效代码 | SOP34,.3,32 |
| 封装形状 | RECTANGULAR |
| 封装形式 | SMALL OUTLINE, HEAT SINK/SLUG, SHRINK PITCH |
| 峰值回流温度（摄氏度） | 260 |
| 电源 | 5,3/14 V |
| 认证状态 | Not Qualified |
| 座面最大高度 | 2.11 mm |
| 最大供电电流 (Isup) | 8.5 mA |
| 最大供电电压 (Vsup) | 5.5 V |
| 最小供电电压 (Vsup) | 4.5 V |
| 标称供电电压 (Vsup) | 5 V |
| 表面贴装 | YES |
| 技术 | BIPOLAR |
| 温度等级 | COMMERCIAL EXTENDED |
| 端子面层 | Tin/Copper (Sn/Cu) |
| 端子形式 | GULL WING |
| 端子节距 | 0.8 mm |
| 端子位置 | DUAL |
| 处于峰值回流温度下的最长时间 | 10 |
| 宽度 | 5.4 mm |
| Base Number Matches | 1 |
| BA6859AFP-Y | BA6858AFM | BA6858AFP | GS1010FL | BA6859AFP | BA6859AFS | |
|---|---|---|---|---|---|---|
| 描述 | DISK DRIVE MOTOR CONTROLLER, 1.3 A, PDSO25 | DISK DRIVE MOTOR CONTROLLER, 1.3 A, PDSO28 | DISK DRIVE MOTOR CONTROLLER, 1.3 A, PDSO28 | SURFACE MOUNT RECTIFIER DIODES | DISK DRIVE MOTOR CONTROLLER, 1.3 A, PDSO28 | DISK DRIVE MOTOR CONTROLLER, 1.3 A, PDSO28 |
| 是否Rohs认证 | 符合 | 符合 | 符合 | - | 符合 | 符合 |
| 零件包装代码 | SOIC | SOIC | SOIC | - | SOIC | SSOP |
| 包装说明 | HSSOP, SOP34,.3,32 | HSSOP, SOP28/42,.4,32 | HSSOP, SOP28/42,.4,32 | - | HSOP-28 | SSOP, SOP24,.3,32 |
| 针数 | 25 | 28 | 28 | - | 28 | 24 |
| Reach Compliance Code | compli | unknow | unknow | - | compli | compli |
| ECCN代码 | EAR99 | EAR99 | EAR99 | - | EAR99 | EAR99 |
| 模拟集成电路 - 其他类型 | DISK DRIVE MOTOR CONTROLLER | DISK DRIVE MOTOR CONTROLLER | DISK DRIVE MOTOR CONTROLLER | - | DISK DRIVE MOTOR CONTROLLER | DISK DRIVE MOTOR CONTROLLER |
| JESD-30 代码 | R-PDSO-G25 | R-PDSO-G28 | R-PDSO-G28 | - | R-PDSO-G28 | R-PDSO-G24 |
| 长度 | 13.6 mm | 18.5 mm | 18.5 mm | - | 18.5 mm | 10 mm |
| 功能数量 | 1 | 1 | 1 | - | 1 | 1 |
| 端子数量 | 25 | 28 | 28 | - | 28 | 24 |
| 最高工作温度 | 75 °C | 75 °C | 75 °C | - | 75 °C | 75 °C |
| 最低工作温度 | -20 °C | -20 °C | -20 °C | - | -20 °C | -20 °C |
| 最大输出电流 | 1.3 A | 1.3 A | 1.3 A | - | 1.3 A | 1.3 A |
| 封装主体材料 | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | - | PLASTIC/EPOXY | PLASTIC/EPOXY |
| 封装代码 | HSSOP | HSSOP | HSSOP | - | HSSOP | SSOP |
| 封装等效代码 | SOP34,.3,32 | SOP28/42,.4,32 | SOP28/42,.4,32 | - | SOP28/42,.4,32 | SOP24,.3,32 |
| 封装形状 | RECTANGULAR | RECTANGULAR | RECTANGULAR | - | RECTANGULAR | RECTANGULAR |
| 封装形式 | SMALL OUTLINE, HEAT SINK/SLUG, SHRINK PITCH | SMALL OUTLINE, HEAT SINK/SLUG, SHRINK PITCH | SMALL OUTLINE, HEAT SINK/SLUG, SHRINK PITCH | - | SMALL OUTLINE, HEAT SINK/SLUG, SHRINK PITCH | SMALL OUTLINE, SHRINK PITCH |
| 峰值回流温度（摄氏度） | 260 | NOT SPECIFIED | NOT SPECIFIED | - | 260 | 260 |
| 电源 | 5,3/14 V | 5,3/14 V | 5,3/14 V | - | 5,3/14 V | 5,3/14 V |
| 认证状态 | Not Qualified | Not Qualified | Not Qualified | - | Not Qualified | Not Qualified |
| 座面最大高度 | 2.11 mm | 2.41 mm | 2.41 mm | - | 2.41 mm | 1.9 mm |
| 最大供电电流 (Isup) | 8.5 mA | 8.5 mA | 8.5 mA | - | 8.5 mA | 8.5 mA |
| 最大供电电压 (Vsup) | 5.5 V | 5.5 V | 5.5 V | - | 5.5 V | 5.5 V |
| 最小供电电压 (Vsup) | 4.5 V | 4.5 V | 4.5 V | - | 4.5 V | 4.5 V |
| 标称供电电压 (Vsup) | 5 V | 5 V | 5 V | - | 5 V | 5 V |
| 表面贴装 | YES | YES | YES | - | YES | YES |
| 技术 | BIPOLAR | BIPOLAR | BIPOLAR | - | BIPOLAR | BIPOLAR |
| 温度等级 | COMMERCIAL EXTENDED | COMMERCIAL EXTENDED | COMMERCIAL EXTENDED | - | COMMERCIAL EXTENDED | COMMERCIAL EXTENDED |
| 端子形式 | GULL WING | GULL WING | GULL WING | - | GULL WING | GULL WING |
| 端子节距 | 0.8 mm | 0.8 mm | 0.8 mm | - | 0.8 mm | 0.8 mm |
| 端子位置 | DUAL | DUAL | DUAL | - | DUAL | DUAL |
| 处于峰值回流温度下的最长时间 | 10 | NOT SPECIFIED | NOT SPECIFIED | - | 10 | 10 |
| 宽度 | 5.4 mm | 7.5 mm | 7.5 mm | - | 7.5 mm | 5.4 mm |
| 厂商名称 | - | ROHM(罗姆半导体) | ROHM(罗姆半导体) | - | ROHM(罗姆半导体) | ROHM(罗姆半导体) |
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