CYStech Electronics Corp.
16Amp. Ultrafast Plastic Rectifiers
Spec. No. : C471FP
Issued Date : 2012.02.24
Revised Date :
Page No. : 1/4
MUR1660FP
Features
•
175℃ operating junction temperature
•
Low leakage current
•
Low switching loss, high efficiency
•
High forward surge capability
•
Insulating package, insulating voltage=2500V AC
•
High temperature soldering guaranteed : 260℃/40s, 0.25”(6.35mm) from case
•
Pb-free lead plating package
I
F(AV)
V
RRM
I
FSM
trr
Tj
V
F(MAX)
2
×
8A
600V
100A
50ns
175°C
1.5V
Mechanical Data
•
Case: TO-220FP molded plastic
•
Mounting Position: Any
•
Weight: 2.2 grams, 0.078 ounce approximately
•
Terminals: Pure tin plated, solderable per MIL-STD-750 method 2026
•
Epoxy: UL 94V-0 rate flame retardant
•
Mounting torque: 5 in.-lb. maximum
Equivalent Circuit
MUR1660FP
Outline
TO-220FP
AKA
MUR1660FP
CYStek Product Specification
CYStech Electronics Corp.
Spec. No. : C471FP
Issued Date : 2012.02.24
Revised Date :
Page No. : 2/4
Maximum Ratings and Electrical Characteristics (Per Diode Leg)
(
Rating at 25°C ambient temperature unless otherwise specified.
resistive or inductive load.
Single phase, half wave, 60Hz,
For capacitive load, derate current by 20%.)
Symbol
V
RRM
V
RMS
V
DC
V
F
Min.
Typ.
Max.
600
420
600
1.5
1.3
1.8
1.7
Parameter
Maximum Recurrent peak reverse voltage
Maximum RMS voltage
Maximum DC blocking voltage
Maximum instantaneous
forward voltage at
I
F
=8A, T
C
=25°C
I
F
=8A, T
C
=150°C
I
F
=16A, T
C
=25°C
I
F
=16A, T
C
=150°C
Per Diode
Units
V
V
V
V
1.23
1.06
1.41
1.35
Maximum Average forward
rectified current @ T
C
=100℃ Per Device
Non-repetitive peak forward surge current @
8.3ms single half sine wave superimposed on
rated load (JEDEC method)
V
R
=600 V, T
C
=25℃
Maximum instantaneous
reverse current at
V
R
=600 V, T
C
=125℃
Maximum reverse
I
F
=1A, V
R
=30V,
dI
F
/dt=100A/μs
recovery time
I
F(AV)
I
FSM
I
R
trr
C
J
V
AC
T
stg
T
J
2500
-65
-65
50
8
16
100
10
100
50
A
A
μA
ns
pF
Typical junction capacitance @ f=1MHz and applied
4V reverse voltage
Isolation voltage from terminal to heatsink, t=1minute
Storage temperature range
Operating junction temperature range
+175
+175
V
℃
℃
Thermal Data
Parameter
Maximum Thermal Resistance, Junction-to-case
Maximum Thermal Resistance, Junction-to-ambient
Lead Temperature for Soldering Purposes : 1/8” from Case for 5 seconds
Symbol
R
th,j-c
R
th,j-a
T
L
Value
5
60
300
Unit
°C/W
°C/W
°C
Ordering Information
Device
MUR1660FP
Package
TO-220FP
(RoHS compliant package)
Shipping
50 pcs / Tube, 40 Tubes/Box
MUR1660FP
CYStek Product Specification
CYStech Electronics Corp.
Typical Characteristics
Forward Current Derating Curve
9
Average Forward Current---Io(A)
8
7
6
5
4
3
2
1
0
0
25
50
75
100
125
150
175
Case Temperature---T
C
(℃)
Per leg
Spec. No. : C471FP
Issued Date : 2012.02.24
Revised Date :
Page No. : 3/4
Forward Current vs Forward Voltage
100000
Instantaneous Forward Current---I
F
(mA)
Per leg
10000
1000
100
Tj=150℃
Tj=25℃
10
resistive or inductive load
Pulse width=300μs,
1% Duty cycle
1
0
0.2
0.4
0.6
0.8
1
1.2
Forward Voltage---V
F
(V)
1.4
Reverse Leakage Current vs Reverse Voltage
100
Junction Capacitance vs Reverse Voltage
1000
Reverse Leakage Current---I
R
(μA)
10
Tj=125℃
1
Tj=75℃
Junction Capacitance---C
J
(pF)
100
0.1
Tj=25℃
0.01
Per leg
Tj=25℃, f=1.0MHz
Per leg
0.001
0
100
200
300
400
500
600
Reverse Voltage---V
R
(V)
10
0.1
1
10
100
Reverse Voltage---V
R
(V)
MUR1660FP
CYStek Product Specification
CYStech Electronics Corp.
TO-220FP Dimension
Marking:
Spec. No. : C471FP
Issued Date : 2012.02.24
Revised Date :
Page No. : 4/4
Device Name
Date Code
3-Lead TO-220FP Plastic Package
CYStek Package Code: FP
Style: Pin 1.Anode 2.Cathode 3.Anode
*Typical
DIM
A
A1
A2
A3
b
b1
b2
c
D
E
e
F
Inches
Min.
Max.
0.171
0.183
0.051 REF
0.112
0.124
0.102
0.110
0.020
0.030
0.031
0.041
0.047 REF
0.020
0.030
0.396
0.404
0.583
0.598
0.100 *
0.106 REF
Millimeters
Min.
Max.
4.35
4.65
1.300 REF
2.85
3.15
2.60
2.80
0.50
0.75
0.80
1.05
1.20 REF
0.500
0.750
10.06
10.26
14.80
15.20
2.54*
2.70 REF
DIM
G
H
H1
H2
J
K
L
L1
L2
M
N
Inches
Min.
Max.
0.246
0.258
0.138 REF
0.055 REF
0.256
0.272
0.031 REF
0.020
1.102
1.118
0.043
0.051
0.036
0.043
0.067 REF
0.012 REF
Millimeters
Min.
Max.
6.25
6.55
3.50 REF
1.40 REF
6.50
6.90
0.80 REF
0.50 REF
28.00
28.40
1.10
1.30
0.92
1.08
1.70 REF
0.30 REF
Notes:
1.Controlling dimension: millimeters.
2.Maximum lead thickness includes lead finish thickness, and minimum lead thickness is the minimum thickness of base material.
3.If there is any question with packing specification or packing method, please contact your local CYStek sales office.
Material:
•
Lead: Pure tin plated.
•
Mold Compound: Epoxy resin family, flammability solid burning class: UL94V-0.
Important Notice:
•
All rights are reserved. Reproduction in whole or in part is prohibited without the prior written approval of CYStek.
•
CYStek reserves the right to make changes to its products without notice.
•
CYStek
semiconductor products are not warranted to be suitable for use in Life-Support Applications, or systems.
•
CYStek assumes no liability for any consequence of customer product design, infringement of patents, or application assistance.
MUR1660FP
CYStek Product Specification
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