Material Content Data Sheet
Sales Product Name
MA#
Package
Construction Element
chip
leadframe
SAK-XC2298H-200F100L AB
MA001049040
PG-LQFP-176-12
Material Group
inorganic material
inorganic material
non noble metal
non noble metal
non noble metal
noble metal
organic material
plastics
inorganic material
non noble metal
noble metal
plastics
noble metal
< 10%
Substances
silicon
phosphorus
zinc
iron
copper
gold
carbon black
epoxy resin
silicondioxide
tin
silver
epoxy resin
silver
CAS#
if applicable
7440-21-3
7723-14-0
7440-66-6
7439-89-6
7440-50-8
7440-57-5
1333-86-4
-
60676-86-0
7440-31-5
7440-22-4
-
7440-22-4
Issued
Weight*
Weight
[mg]
71.686
0.149
0.594
11.887
482.643
4.995
7.063
190.712
1214.905
15.144
2.988
3.600
10.800
Average
Mass
[%]
3.55
0.01
0.03
0.59
23.93
0.25
0.35
9.45
60.22
0.75
0.15
0.18
0.54
29. August 2013
2017.17 mg
Sum
[%]
3.55
Average
Mass
[ppm]
35538
74
295
5893
24.56
0.25
239268
2476
3502
94544
70.02
0.75
0.15
602282
7507
1482
1785
0.72
5354
7139
1000000
700328
7507
1482
245530
2476
Sum
[ppm]
35538
wire
encapsulation
leadfinish
plating
glue
*deviation
Sum in total: 100,00
Important Remarks:
1.
2.
3.
Infineon Technologies AG provides full material declaration based on information provided by third parties and
has taken and continues to take reasonable steps to provide representative and accurate information.
Infineon Technologies AG and Infineon Technologies AG suppliers consider certain information to be
proprietary, and thus CAS numbers and other limited information may not be available for release.
All statements are based on our present knowledge, are provided 'as is' and may be subject to change at any
time due to technical requirements and development without notification.
Company
Address
Internet
Infineon Technologies AG
81726 München
www.infineon.com