Fast Page DRAM Module, 1MX36, 70ns, CMOS, PSMA72,
| 参数名称 | 属性值 |
| 厂商名称 | LAPIS Semiconductor Co Ltd |
| 包装说明 | SIMM, SSIM72 |
| Reach Compliance Code | unknow |
| 最长访问时间 | 70 ns |
| I/O 类型 | COMMON |
| JESD-30 代码 | R-PSMA-N72 |
| 内存密度 | 37748736 bi |
| 内存集成电路类型 | FAST PAGE DRAM MODULE |
| 内存宽度 | 36 |
| 端子数量 | 72 |
| 字数 | 1048576 words |
| 字数代码 | 1000000 |
| 最高工作温度 | 70 °C |
| 最低工作温度 | |
| 组织 | 1MX36 |
| 输出特性 | 3-STATE |
| 封装主体材料 | PLASTIC/EPOXY |
| 封装代码 | SIMM |
| 封装等效代码 | SSIM72 |
| 封装形状 | RECTANGULAR |
| 封装形式 | MICROELECTRONIC ASSEMBLY |
| 电源 | 5 V |
| 认证状态 | Not Qualified |
| 刷新周期 | 1024 |
| 座面最大高度 | 25.4 mm |
| 最大待机电流 | 0.0024 A |
| 最大压摆率 | 1.04 mA |
| 标称供电电压 (Vsup) | 5 V |
| 表面贴装 | NO |
| 技术 | CMOS |
| 温度等级 | COMMERCIAL |
| 端子形式 | NO LEAD |
| 端子节距 | 1.27 mm |
| 端子位置 | SINGLE |
| MSC23136BL-70BS12 | MSC23136BL-10BS12 | MSC23136B-60DS12 | MSC23136B-10DS12 | MSC23136BL-80DS12 | MSC23136BL-10DS12 | MSC23136B-70BS12 | MSC23136BL-70DS12 | |
|---|---|---|---|---|---|---|---|---|
| 描述 | Fast Page DRAM Module, 1MX36, 70ns, CMOS, PSMA72, | Fast Page DRAM Module, 1MX36, 100ns, CMOS, PSMA72, | Fast Page DRAM Module, 1MX36, 60ns, CMOS, PSMA72, | Fast Page DRAM Module, 1MX36, 100ns, CMOS, PSMA72, | Fast Page DRAM Module, 1MX36, 80ns, CMOS, PSMA72, | Fast Page DRAM Module, 1MX36, 100ns, CMOS, PSMA72, | Fast Page DRAM Module, 1MX36, 70ns, CMOS, PSMA72, | Fast Page DRAM Module, 1MX36, 70ns, CMOS, PSMA72, |
| 包装说明 | SIMM, SSIM72 | SIMM, SSIM72 | SIMM, SSIM72 | SIMM, SSIM72 | SIMM, SSIM72 | SIMM, SSIM72 | SIMM, SSIM72 | SIMM, SSIM72 |
| Reach Compliance Code | unknow | unknown | unknown | unknown | unknown | unknown | unknown | unknown |
| 最长访问时间 | 70 ns | 100 ns | 60 ns | 100 ns | 80 ns | 100 ns | 70 ns | 70 ns |
| I/O 类型 | COMMON | COMMON | COMMON | COMMON | COMMON | COMMON | COMMON | COMMON |
| JESD-30 代码 | R-PSMA-N72 | R-PSMA-N72 | R-PSMA-N72 | R-PSMA-N72 | R-PSMA-N72 | R-PSMA-N72 | R-PSMA-N72 | R-PSMA-N72 |
| 内存密度 | 37748736 bi | 37748736 bit | 37748736 bit | 37748736 bit | 37748736 bit | 37748736 bit | 37748736 bit | 37748736 bit |
| 内存集成电路类型 | FAST PAGE DRAM MODULE | FAST PAGE DRAM MODULE | FAST PAGE DRAM MODULE | FAST PAGE DRAM MODULE | FAST PAGE DRAM MODULE | FAST PAGE DRAM MODULE | FAST PAGE DRAM MODULE | FAST PAGE DRAM MODULE |
| 内存宽度 | 36 | 36 | 36 | 36 | 36 | 36 | 36 | 36 |
| 端子数量 | 72 | 72 | 72 | 72 | 72 | 72 | 72 | 72 |
| 字数 | 1048576 words | 1048576 words | 1048576 words | 1048576 words | 1048576 words | 1048576 words | 1048576 words | 1048576 words |
| 字数代码 | 1000000 | 1000000 | 1000000 | 1000000 | 1000000 | 1000000 | 1000000 | 1000000 |
| 最高工作温度 | 70 °C | 70 °C | 70 °C | 70 °C | 70 °C | 70 °C | 70 °C | 70 °C |
| 组织 | 1MX36 | 1MX36 | 1MX36 | 1MX36 | 1MX36 | 1MX36 | 1MX36 | 1MX36 |
| 输出特性 | 3-STATE | 3-STATE | 3-STATE | 3-STATE | 3-STATE | 3-STATE | 3-STATE | 3-STATE |
| 封装主体材料 | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY |
| 封装代码 | SIMM | SIMM | SIMM | SIMM | SIMM | SIMM | SIMM | SIMM |
| 封装等效代码 | SSIM72 | SSIM72 | SSIM72 | SSIM72 | SSIM72 | SSIM72 | SSIM72 | SSIM72 |
| 封装形状 | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR |
| 封装形式 | MICROELECTRONIC ASSEMBLY | MICROELECTRONIC ASSEMBLY | MICROELECTRONIC ASSEMBLY | MICROELECTRONIC ASSEMBLY | MICROELECTRONIC ASSEMBLY | MICROELECTRONIC ASSEMBLY | MICROELECTRONIC ASSEMBLY | MICROELECTRONIC ASSEMBLY |
| 电源 | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V |
| 认证状态 | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified |
| 刷新周期 | 1024 | 1024 | 1024 | 1024 | 1024 | 1024 | 1024 | 1024 |
| 座面最大高度 | 25.4 mm | 25.4 mm | 25.4 mm | 25.4 mm | 25.4 mm | 25.4 mm | 25.4 mm | 25.4 mm |
| 最大待机电流 | 0.0024 A | 0.0024 A | 0.012 A | 0.012 A | 0.0024 A | 0.0024 A | 0.012 A | 0.0024 A |
| 最大压摆率 | 1.04 mA | 0.8 mA | 1.16 mA | 0.8 mA | 0.92 mA | 0.8 mA | 1.04 mA | 1.04 mA |
| 标称供电电压 (Vsup) | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V |
| 表面贴装 | NO | NO | NO | NO | NO | NO | NO | NO |
| 技术 | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS |
| 温度等级 | COMMERCIAL | COMMERCIAL | COMMERCIAL | COMMERCIAL | COMMERCIAL | COMMERCIAL | COMMERCIAL | COMMERCIAL |
| 端子形式 | NO LEAD | NO LEAD | NO LEAD | NO LEAD | NO LEAD | NO LEAD | NO LEAD | NO LEAD |
| 端子节距 | 1.27 mm | 1.27 mm | 1.27 mm | 1.27 mm | 1.27 mm | 1.27 mm | 1.27 mm | 1.27 mm |
| 端子位置 | SINGLE | SINGLE | SINGLE | SINGLE | SINGLE | SINGLE | SINGLE | SINGLE |
| 厂商名称 | LAPIS Semiconductor Co Ltd | - | - | LAPIS Semiconductor Co Ltd | LAPIS Semiconductor Co Ltd | LAPIS Semiconductor Co Ltd | LAPIS Semiconductor Co Ltd | LAPIS Semiconductor Co Ltd |
电子工程世界版权所有
京B2-20211791
京ICP备10001474号-1
电信业务审批[2006]字第258号函
京公网安备 11010802033920号
Copyright © 2005-2024 EEWORLD.com.cn, Inc. All rights reserved
电子工程世界
