Standard SRAM, 128KX32, 15ns, CMOS, CQFP68, CERAMIC, QFP-68
参数名称 | 属性值 |
厂商名称 | Cobham Semiconductor Solutions |
零件包装代码 | QFP |
包装说明 | GQFF, |
针数 | 68 |
Reach Compliance Code | unknow |
ECCN代码 | 3A001.A.2.C |
最长访问时间 | 15 ns |
JESD-30 代码 | S-CQFP-F68 |
长度 | 37.084 mm |
内存密度 | 4194304 bi |
内存集成电路类型 | STANDARD SRAM |
内存宽度 | 32 |
功能数量 | 1 |
端子数量 | 68 |
字数 | 131072 words |
字数代码 | 128000 |
工作模式 | ASYNCHRONOUS |
最高工作温度 | 125 °C |
最低工作温度 | -55 °C |
组织 | 128KX32 |
封装主体材料 | CERAMIC, METAL-SEALED COFIRED |
封装代码 | GQFF |
封装形状 | SQUARE |
封装形式 | FLATPACK, GUARD RING |
并行/串行 | PARALLEL |
认证状态 | Not Qualified |
座面最大高度 | 3.2766 mm |
最大供电电压 (Vsup) | 1.9 V |
最小供电电压 (Vsup) | 1.7 V |
标称供电电压 (Vsup) | 1.8 V |
表面贴装 | YES |
技术 | CMOS |
温度等级 | MILITARY |
端子形式 | FLAT |
端子节距 | 1.27 mm |
端子位置 | QUAD |
宽度 | 37.084 mm |
UT8R128K32-15XCX | UT8R128K32-15XCC | UT8R128K32-15XPC | UT8R128K32-10XPC | UT8R128K32-10XCC | UT8R128K32-15XCA | |
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描述 | Standard SRAM, 128KX32, 15ns, CMOS, CQFP68, CERAMIC, QFP-68 | Standard SRAM, 128KX32, 15ns, CMOS, CQFP68, CERAMIC, QFP-68 | Standard SRAM, 128KX32, 15ns, CMOS, CQFP68, CERAMIC, QFP-68 | Standard SRAM, 128KX32, 10ns, CMOS, CQFP68, CERAMIC, QFP-68 | Standard SRAM, 128KX32, 10ns, CMOS, CQFP68, CERAMIC, QFP-68 | Standard SRAM, 128KX32, 15ns, CMOS, CQFP68, CERAMIC, QFP-68 |
零件包装代码 | QFP | QFP | QFP | QFP | QFP | QFP |
包装说明 | GQFF, | GQFF, | GQFF, | GQFF, | GQFF, | GQFF, |
针数 | 68 | 68 | 68 | 68 | 68 | 68 |
Reach Compliance Code | unknow | unknown | unknown | unknown | unknow | unknow |
ECCN代码 | 3A001.A.2.C | 3A001.A.2.C | 3A001.A.2.C | 3A001.A.2.C | 3A001.A.2.C | 3A001.A.2.C |
最长访问时间 | 15 ns | 15 ns | 15 ns | 10 ns | 10 ns | 15 ns |
JESD-30 代码 | S-CQFP-F68 | S-CQFP-F68 | S-CQFP-F68 | S-CQFP-F68 | S-CQFP-F68 | S-CQFP-F68 |
长度 | 37.084 mm | 37.084 mm | 37.084 mm | 37.084 mm | 37.084 mm | 37.084 mm |
内存密度 | 4194304 bi | 4194304 bit | 4194304 bit | 4194304 bit | 4194304 bi | 4194304 bi |
内存集成电路类型 | STANDARD SRAM | STANDARD SRAM | STANDARD SRAM | STANDARD SRAM | STANDARD SRAM | STANDARD SRAM |
内存宽度 | 32 | 32 | 32 | 32 | 32 | 32 |
功能数量 | 1 | 1 | 1 | 1 | 1 | 1 |
端子数量 | 68 | 68 | 68 | 68 | 68 | 68 |
字数 | 131072 words | 131072 words | 131072 words | 131072 words | 131072 words | 131072 words |
字数代码 | 128000 | 128000 | 128000 | 128000 | 128000 | 128000 |
工作模式 | ASYNCHRONOUS | ASYNCHRONOUS | ASYNCHRONOUS | ASYNCHRONOUS | ASYNCHRONOUS | ASYNCHRONOUS |
最高工作温度 | 125 °C | 125 °C | 125 °C | 125 °C | 125 °C | 125 °C |
最低工作温度 | -55 °C | -55 °C | -55 °C | -55 °C | -55 °C | -55 °C |
组织 | 128KX32 | 128KX32 | 128KX32 | 128KX32 | 128KX32 | 128KX32 |
封装主体材料 | CERAMIC, METAL-SEALED COFIRED | CERAMIC, METAL-SEALED COFIRED | CERAMIC, METAL-SEALED COFIRED | CERAMIC, METAL-SEALED COFIRED | CERAMIC, METAL-SEALED COFIRED | CERAMIC, METAL-SEALED COFIRED |
封装代码 | GQFF | GQFF | GQFF | GQFF | GQFF | GQFF |
封装形状 | SQUARE | SQUARE | SQUARE | SQUARE | SQUARE | SQUARE |
封装形式 | FLATPACK, GUARD RING | FLATPACK, GUARD RING | FLATPACK, GUARD RING | FLATPACK, GUARD RING | FLATPACK, GUARD RING | FLATPACK, GUARD RING |
并行/串行 | PARALLEL | PARALLEL | PARALLEL | PARALLEL | PARALLEL | PARALLEL |
认证状态 | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified |
座面最大高度 | 3.2766 mm | 3.2766 mm | 3.2766 mm | 3.2766 mm | 3.2766 mm | 3.2766 mm |
最大供电电压 (Vsup) | 1.9 V | 1.9 V | 1.9 V | 1.9 V | 1.9 V | 1.9 V |
最小供电电压 (Vsup) | 1.7 V | 1.7 V | 1.7 V | 1.7 V | 1.7 V | 1.7 V |
标称供电电压 (Vsup) | 1.8 V | 1.8 V | 1.8 V | 1.8 V | 1.8 V | 1.8 V |
表面贴装 | YES | YES | YES | YES | YES | YES |
技术 | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS |
温度等级 | MILITARY | MILITARY | MILITARY | MILITARY | MILITARY | MILITARY |
端子形式 | FLAT | FLAT | FLAT | FLAT | FLAT | FLAT |
端子节距 | 1.27 mm | 1.27 mm | 1.27 mm | 1.27 mm | 1.27 mm | 1.27 mm |
端子位置 | QUAD | QUAD | QUAD | QUAD | QUAD | QUAD |
宽度 | 37.084 mm | 37.084 mm | 37.084 mm | 37.084 mm | 37.084 mm | 37.084 mm |
厂商名称 | Cobham Semiconductor Solutions | - | Cobham Semiconductor Solutions | Cobham Semiconductor Solutions | Cobham Semiconductor Solutions | Cobham Semiconductor Solutions |
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