Material Content Data Sheet
Sales Product Name
MA#
Package
Construction Element
chip
leadframe
IDP30E60
MA000694754
PG-TO220-2-1
Material Group
inorganic material
non noble metal
inorganic material
non noble metal
non noble metal
organic material
plastics
inorganic material
non noble metal
non noble metal
inorganic material
non noble metal
noble metal
non noble metal
inorganic material
non noble metal
non noble metal
< 10%
Substances
silicon
iron
phosphorus
copper
aluminium
carbon black
epoxy resin
silicondioxide
tin
nickel
phosphorus
antimony
silver
tin
phosphorus
iron
copper
CAS#
if applicable
7440-21-3
7439-89-6
7723-14-0
7440-50-8
7429-90-5
1333-86-4
-
60676-86-0
7440-31-5
7440-02-0
7723-14-0
7440-36-0
7440-22-4
7440-31-5
7723-14-0
7439-89-6
7440-50-8
Issued
Weight*
Weight
[mg]
1.468
0.753
0.226
751.797
2.576
6.011
114.214
480.900
14.487
0.198
0.000
0.127
0.317
0.825
0.177
0.590
589.466
Average
Mass
[%]
0.07
0.04
0.01
38.27
0.13
0.31
5.82
24.48
0.74
0.01
0.00
0.01
0.02
0.04
0.01
0.03
30.01
29. August 2013
1964.13 mg
Sum
[%]
0.07
Average
Mass
[ppm]
747
383
115
38.32
0.13
382761
1312
3061
58150
30.61
0.74
244841
7376
101
0.01
1
65
162
0.07
420
90
301
30.05
300114
300505
1000000
647
101
306052
7376
383260
1312
Sum
[ppm]
747
wire
encapsulation
leadfinish
plating
solder
heatspreader
*deviation
Sum in total: 100,00
Important Remarks:
1.
2.
3.
Infineon Technologies AG provides full material declaration based on information provided by third parties and
has taken and continues to take reasonable steps to provide representative and accurate information.
Infineon Technologies AG and Infineon Technologies AG suppliers consider certain information to be
proprietary, and thus CAS numbers and other limited information may not be available for release.
All statements are based on our present knowledge, are provided 'as is' and may be subject to change at any
time due to technical requirements and development without notification.
Company
Address
Internet
Infineon Technologies AG
81726 München
www.infineon.com