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IDT71V65803S166PF

产品描述ZBT SRAM, 512KX18, 3.5ns, CMOS, PQFP100, TQFP-100
产品类别存储    存储   
文件大小307KB,共23页
制造商IDT (Integrated Device Technology)
下载文档 详细参数 选型对比 全文预览

IDT71V65803S166PF概述

ZBT SRAM, 512KX18, 3.5ns, CMOS, PQFP100, TQFP-100

IDT71V65803S166PF规格参数

参数名称属性值
是否无铅含铅
是否Rohs认证不符合
厂商名称IDT (Integrated Device Technology)
零件包装代码QFP
包装说明QFP,
针数100
Reach Compliance Codecompli
ECCN代码3A991.B.2.A
最长访问时间3.5 ns
JESD-30 代码R-PQFP-G100
JESD-609代码e0
内存密度9437184 bi
内存集成电路类型ZBT SRAM
内存宽度18
湿度敏感等级3
功能数量1
端子数量100
字数524288 words
字数代码512000
工作模式SYNCHRONOUS
最高工作温度70 °C
最低工作温度
组织512KX18
封装主体材料PLASTIC/EPOXY
封装代码QFP
封装形状RECTANGULAR
封装形式FLATPACK
并行/串行PARALLEL
峰值回流温度(摄氏度)240
认证状态Not Qualified
最大供电电压 (Vsup)3.465 V
最小供电电压 (Vsup)3.135 V
标称供电电压 (Vsup)3.3 V
表面贴装YES
技术CMOS
温度等级COMMERCIAL
端子面层Tin/Lead (Sn/Pb)
端子形式GULL WING
端子位置QUAD
处于峰值回流温度下的最长时间20

文档预览

下载PDF文档
256K x 36, 512K x 18
3.3V Synchronous ZBT™ SRAMs
ZBT™ Feature
3.3V I/O, Burst Counter
Pipelined Outputs
x
x
x
x
x
x
x
x
x
x
x
x
x
Preliminary
IDT71V65603
IDT71V65803
Features
256K x 36, 512K x 18 memory configurations
Supports high performance system speed - 166MHz (3.5ns
Clock-to-Data Access)
ZBT
TM
Feature - No dead cycles between write and read
cycles
Internally synchronized output buffer enable eliminates the
need to control
OE
Single R/W (READ/WRITE) control pin
W
Positive clock-edge triggered address, data, and control
signal registers for fully pipelined applications
4-word burst capability (interleaved or linear)
Individual byte write (BW
1
-
BW
4
) control (May tie active)
BW
Three chip enables for simple depth expansion
3.3V power supply (±5%)
3.3V I/O Supply (V
DDQ
)
Power down controlled by ZZ input
Packaged in a JEDEC standard 100-lead plastic thin quad
flatpack (TQFP) and 119-lead ball grid array (BGA)
Description
The IDT71V65603/5803 are 3.3V high-speed 9,437,184-bit
(9 Megabit) synchronous SRAMS. They are designed to eliminate dead bus
cycles when turning the bus around between reads and writes, or writes and
reads. Thus, they have been given the name ZBT
TM
, or Zero Bus Turnaround.
Address and control signals are applied to the SRAM during one clock
cycle, and two cycles later the associated data cycle occurs, be it read or write.
The IDT71V65603/5803 contain data I/O, address and control signal
registers. Output enable is the only asynchronous signal and can be used
to disable the outputs at any given time.
A Clock Enable (CEN) pin allows operation of the IDT71V65603/5803 to
be suspended as long as necessary. All synchronous inputs are ignored when
(CEN) is high and the internal device registers will hold their previous values.
There are three chip enable pins (CE1, CE2,
CE2)
that allow the user
to deselect the device when desired. If any one of these three are not asserted
when ADV/LD is low, no new memory operation can be initiated. However,
any pending data transfers (reads or writes) will be completed. The data bus
will tri-state two cycles after chip is deselected or a write is initiated.
The IDT71V65603/5803 have an on-chip burst counter. In the burst
mode, the IDT71V65603/5803 can provide four cycles of data for a single
address presented to the SRAM. The order of the burst sequence is
defined by the
LBO
input pin. The
LBO
pin selects between linear and
interleaved burst sequence. The ADV/LD signal is used to load a new
external address (ADV/LD = LOW) or increment the internal burst counter
(ADV/LD = HIGH).
The IDT71V65603/5803 SRAM utilize IDT's latest high-performance
CMOS process, and are packaged in a JEDEC Standard 14mm x 20mm 100-
lead thin plastic quad flatpack (TQFP) as well as a 119-lead ball grid array (BGA).
Pin Description Summary
A
0
-A
18
CE
1
, CE
2
,
CE
2
OE
R/W
CEN
BW
1
,
BW
2
,
BW
3
,
BW
4
CLK
ADV/LD
LBO
TMS
TDI
TCK
TDO
ZZ
I/O
0
-I/O
31
, I/O
P1
-I/O
P4
V
DD
, V
DDQ
V
SS
Address Inputs
Chip Enables
Output Enable
Read/Write Signal
Clock Enable
Individual Byte Write Selects
Clock
Advance burst address / Load new address
Linear / Interleaved Burst Order
Test Mode Select
Test Data input
Test Clock
Test Data Output
Sleep Mode
Data Input / Output
Core Power, I/O Power
Ground
Input
Input
Input
Input
Input
Input
Input
Input
Input
Input
Input
Input
Output
Input
I/O
Supply
Supply
Synchronous
Synchronous
Asynchronous
Synchronous
Synchronous
Synchronous
N/A
Synchronous
Static
N/A
N/A
N/A
N/A
Asynchronous
Synchronous
Static
Static
ZBT and Zero Bus Turnaround are trademarks of Integrated Device Technology, Inc. and the architecture is supported by Micron Technology and Motorola, Inc.
DECEMBER 1999
DSC-5304/00
5304 tbl 01
1
©1999 Integrated Device Technology, Inc.

IDT71V65803S166PF相似产品对比

IDT71V65803S166PF MCA1206-500.5%P51K11 IDT71V65803S166BG
描述 ZBT SRAM, 512KX18, 3.5ns, CMOS, PQFP100, TQFP-100 Fixed Resistor, Thin Film, 0.25W, 1110ohm, 200V, 0.5% +/-Tol, -50,50ppm/Cel, 1206, ZBT SRAM, 512KX18, 3.5ns, CMOS, PBGA119, BGA-119
是否Rohs认证 不符合 符合 不符合
Reach Compliance Code compli compliant compliant
ECCN代码 3A991.B.2.A EAR99 3A991.B.2.A
JESD-609代码 e0 e3 e0
端子数量 100 2 119
最高工作温度 70 °C 125 °C 70 °C
封装形状 RECTANGULAR RECTANGULAR PACKAGE RECTANGULAR
封装形式 FLATPACK SMT GRID ARRAY
技术 CMOS THIN FILM CMOS
端子面层 Tin/Lead (Sn/Pb) Tin (Sn) - with Nickel (Ni) barrier Tin/Lead (Sn/Pb)
是否无铅 含铅 - 含铅
厂商名称 IDT (Integrated Device Technology) - IDT (Integrated Device Technology)
零件包装代码 QFP - BGA
包装说明 QFP, - BGA,
针数 100 - 119
最长访问时间 3.5 ns - 3.5 ns
JESD-30 代码 R-PQFP-G100 - R-PBGA-B119
内存密度 9437184 bi - 9437184 bit
内存集成电路类型 ZBT SRAM - ZBT SRAM
内存宽度 18 - 18
湿度敏感等级 3 - 3
功能数量 1 - 1
字数 524288 words - 524288 words
字数代码 512000 - 512000
工作模式 SYNCHRONOUS - SYNCHRONOUS
组织 512KX18 - 512KX18
封装主体材料 PLASTIC/EPOXY - PLASTIC/EPOXY
封装代码 QFP - BGA
并行/串行 PARALLEL - PARALLEL
峰值回流温度(摄氏度) 240 - 225
认证状态 Not Qualified - Not Qualified
最大供电电压 (Vsup) 3.465 V - 3.465 V
最小供电电压 (Vsup) 3.135 V - 3.135 V
标称供电电压 (Vsup) 3.3 V - 3.3 V
表面贴装 YES - YES
温度等级 COMMERCIAL - COMMERCIAL
端子形式 GULL WING - BALL
端子位置 QUAD - BOTTOM
处于峰值回流温度下的最长时间 20 - 20
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