Ceramic Capacitor, Multilayer, Ceramic, 200V, 0% +Tol, 0% -Tol, C0G, 30ppm/Cel TC, 0.047uF, Through Hole Mount, RADIAL LEADED
参数名称 | 属性值 |
是否无铅 | 含铅 |
是否Rohs认证 | 不符合 |
厂商名称 | AVX |
包装说明 | , |
Reach Compliance Code | compli |
ECCN代码 | EAR99 |
电容 | 0.047 µF |
电容器类型 | CERAMIC CAPACITOR |
介电材料 | CERAMIC |
JESD-609代码 | e0 |
制造商序列号 | MR |
安装特点 | THROUGH HOLE MOUNT |
多层 | Yes |
负容差 | |
端子数量 | 2 |
最高工作温度 | 125 °C |
最低工作温度 | -55 °C |
封装形状 | RECTANGULAR PACKAGE |
正容差 | |
额定(直流)电压(URdc) | 200 V |
表面贴装 | NO |
温度特性代码 | C0G |
温度系数 | -/+30ppm/Cel ppm/°C |
端子面层 | Tin/Lead (Sn/Pb) |
端子形状 | WIRE |
MR072A473DAA | MR072A223JAA | MR072A473FAA | MR072A273KAA | MR072A473GAA | MR072A473KAA | |
---|---|---|---|---|---|---|
描述 | Ceramic Capacitor, Multilayer, Ceramic, 200V, 0% +Tol, 0% -Tol, C0G, 30ppm/Cel TC, 0.047uF, Through Hole Mount, RADIAL LEADED | Ceramic Capacitor, Multilayer, Ceramic, 200V, 5% +Tol, 5% -Tol, C0G, 30ppm/Cel TC, 0.022uF, Through Hole Mount, 4949, RADIAL LEADED | Ceramic Capacitor, Multilayer, Ceramic, 200V, 1% +Tol, 1% -Tol, C0G, 30ppm/Cel TC, 0.047uF, Through Hole Mount, 4949, RADIAL LEADED | Ceramic Capacitor, Multilayer, Ceramic, 200V, 10% +Tol, 10% -Tol, C0G, 30ppm/Cel TC, 0.027uF, Through Hole Mount, RADIAL LEADED | Ceramic Capacitor, Multilayer, Ceramic, 200V, 2% +Tol, 2% -Tol, C0G, 30ppm/Cel TC, 0.047uF, Through Hole Mount, RADIAL LEADED | Ceramic Capacitor, Multilayer, Ceramic, 200V, 10% +Tol, 10% -Tol, C0G, 30ppm/Cel TC, 0.047uF, Through Hole Mount, RADIAL LEADED |
是否无铅 | 含铅 | 含铅 | 含铅 | 含铅 | 含铅 | 含铅 |
是否Rohs认证 | 不符合 | 不符合 | 不符合 | 不符合 | 不符合 | 不符合 |
厂商名称 | AVX | AVX | AVX | AVX | AVX | AVX |
Reach Compliance Code | compli | not_compliant | not_compliant | compli | compli | compli |
ECCN代码 | EAR99 | EAR99 | EAR99 | EAR99 | EAR99 | EAR99 |
电容 | 0.047 µF | 0.022 µF | 0.047 µF | 0.027 µF | 0.047 µF | 0.047 µF |
电容器类型 | CERAMIC CAPACITOR | CERAMIC CAPACITOR | CERAMIC CAPACITOR | CERAMIC CAPACITOR | CERAMIC CAPACITOR | CERAMIC CAPACITOR |
介电材料 | CERAMIC | CERAMIC | CERAMIC | CERAMIC | CERAMIC | CERAMIC |
JESD-609代码 | e0 | e0 | e0 | e0 | e0 | e0 |
制造商序列号 | MR | MR | MR | MR | MR | MR |
安装特点 | THROUGH HOLE MOUNT | THROUGH HOLE MOUNT | THROUGH HOLE MOUNT | THROUGH HOLE MOUNT | THROUGH HOLE MOUNT | THROUGH HOLE MOUNT |
多层 | Yes | Yes | Yes | Yes | Yes | Yes |
负容差 | - | 5% | 1% | 10% | 2% | 10% |
端子数量 | 2 | 2 | 2 | 2 | 2 | 2 |
最高工作温度 | 125 °C | 125 °C | 125 °C | 125 °C | 125 °C | 125 °C |
最低工作温度 | -55 °C | -55 °C | -55 °C | -55 °C | -55 °C | -55 °C |
封装形状 | RECTANGULAR PACKAGE | RECTANGULAR PACKAGE | RECTANGULAR PACKAGE | RECTANGULAR PACKAGE | RECTANGULAR PACKAGE | RECTANGULAR PACKAGE |
正容差 | - | 5% | 1% | 10% | 2% | 10% |
额定(直流)电压(URdc) | 200 V | 200 V | 200 V | 200 V | 200 V | 200 V |
表面贴装 | NO | NO | NO | NO | NO | NO |
温度特性代码 | C0G | C0G | C0G | C0G | C0G | C0G |
温度系数 | -/+30ppm/Cel ppm/°C | -/+30ppm/Cel ppm/°C | -/+30ppm/Cel ppm/°C | -/+30ppm/Cel ppm/°C | -/+30ppm/Cel ppm/°C | -/+30ppm/Cel ppm/°C |
端子面层 | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) |
端子形状 | WIRE | WIRE | WIRE | WIRE | WIRE | WIRE |
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