电子工程世界电子工程世界电子工程世界

关键词

搜索

型号

搜索

1812CC133MAX9A

产品描述CAPACITOR, CERAMIC, MULTILAYER, 600V, X7R, 0.013uF, SURFACE MOUNT, 1812, CHIP
产品类别无源元件    电容器   
文件大小92KB,共2页
制造商AVX
下载文档 详细参数 全文预览

1812CC133MAX9A概述

CAPACITOR, CERAMIC, MULTILAYER, 600V, X7R, 0.013uF, SURFACE MOUNT, 1812, CHIP

1812CC133MAX9A规格参数

参数名称属性值
是否无铅含铅
是否Rohs认证不符合
厂商名称AVX
包装说明, 1812
Reach Compliance Code_compli
ECCN代码EAR99
电容0.013 µF
电容器类型CERAMIC CAPACITOR
介电材料CERAMIC
高度2.54 mm
JESD-609代码e0
长度4.5 mm
制造商序列号1812
安装特点SURFACE MOUNT
多层Yes
负容差20%
端子数量2
最高工作温度125 °C
最低工作温度-55 °C
封装形状RECTANGULAR PACKAGE
封装形式SMT
包装方法BULK
正容差20%
额定(直流)电压(URdc)600 V
系列1812(600V,X7R)FLEX
尺寸代码1812
表面贴装YES
温度特性代码X7R
温度系数15% ppm/°C
端子面层Tin/Lead (Sn/Pb)
端子形状WRAPAROUND
宽度3.2 mm

文档预览

下载PDF文档
High Voltage MLC Chips FLEXITERM
®
For 600V to 5000V Applications
High value, low leakage and small size are difficult parameters to obtain
in capacitors for high voltage systems. AVX special high voltage MLC
chips capacitors meet these performance characteristics and are
designed for applications such as snubbers in high frequency power
converters, resonators in SMPS, and high voltage coupling/DC blocking.
These high voltage chip designs exhibit low ESRs at high frequencies.
To make high voltage chips, larger physical sizes than are normally
encountered are necessary. These larger sizes require that special pre-
cautions be taken in applying these chips in surface mount assemblies.
In response to this, and to follow from the success of the FLEXITERM
®
range of low voltage parts, AVX is delighted to offer a FLEXITERM
®
high
voltage range of capacitors, FLEXITERM
®
.
The FLEXITERM
®
layer is designed to enhance the mechanical flexure
and temperature cycling performance of a standard ceramic capacitor,
giving customers a solution where board flexure or temperature cycle
damage are concerns.
HOW TO ORDER
1808
AVX
Style
0805
1206
1210
1808
1812
1825
2220
2225
***
A
Voltage
600V/630V =
1000V =
1500V =
2000V =
2500V =
3000V =
4000V =
5000V =
C
A
S
G
W
H
J
K
C
272
K
A
Z
1
A
Temperature Capacitance Code Capacitance
Test Level
Termination*
Coefficient
(2 significant digits
Tolerance
A = Standard Z = FLEXITERM
®
C0G: J = ±5%
100% Tin
C0G = A
+ no. of zeros)
(RoHS Compliant)
K = ±10%
X7R = C
Examples:
X = FLEXITERM
®
M = ±20%
10 pF = 100
5% min. Pb
100 pF = 101 X7R: K = ±10%
M = ±20%
1,000 pF = 102
Z = +80%,
22,000 pF = 223
-20%
220,000 pF = 224
1 µF = 105
Packaging
Special
1 = 7" Reel
Code
3 = 13" Reel A = Standard
9 = Bulk
Notes: Capacitors with X7R dielectrics are not intended for applications across AC supply mains or AC line filtering with polarity reversal. Contact plant for recommendations.
Contact factory for availability of Termination and Tolerance options for Specific Part Numbers.
***
AVX offers nonstandard chip sizes. Contact factory for details.
W
L
T
t
DIMENSIONS
SIZE
(L) Length
0805
1206
3.20 ± 0.20
(0.126 ± 0.008)
1.60 ± 0.20
(0.063 ± 0.008)
1.52
(0.060)
0.25 (0.010)
0.75 (0.030)
1210*
3.20 ± 0.20
(0.126 ± 0.008)
2.50 ± 0.20
(0.098 ± 0.008)
1.70
(0.067)
0.25 (0.010)
0.75 (0.030)
1808*
4.57 ± 0.25
(0.180 ± 0.010)
2.03 ± 0.25
(0.080 ± 0.010)
2.03
(0.080)
0.25 (0.010)
1.02 (0.040)
1812*
4.50 ± 0.30
(0.177 ± 0.012)
3.20 ± 0.20
(0.126 ± 0.008)
2.54
(0.100)
0.25 (0.010)
1.02 (0.040)
1825*
4.50 ± 0.30
(0.177 ± 0.012)
6.40 ± 0.30
(0.252 ± 0.012)
2.54
(0.100)
0.25 (0.010)
1.02 (0.040)
2.01 ± 0.20
(0.079 ± 0.008)
(W) Width
1.25 ± 0.20
(0.049 ± 0.008)
(T) Thickness
1.30
Max.
(0.051)
(t) terminal min. 0.50 ± 0.25
max. (0.020 ± 0.010)
millimeters (inches)
2220*
5.7 ± 0.40
(0.224 ± 0.016)
5.0 ± 0.40
(0.197 ± 0.016)
3.30
(0.130)
0.25 (0.010)
1.02 (0.040)
2225*
5.72 ± 0.25
(0.225 ± 0.010)
6.35 ± 0.25
(0.250 ± 0.010)
2.54
(0.100)
0.25 (0.010)
1.02 (0.040)
*Reflow Soldering Only
83
evc串口编程详解
evc串口编程详解...
jiki119 单片机
【设计工具】赛灵思文档导航器
80989...
keaaron FPGA/CPLD
MAGIC嵌入式操作系统
一 MAGIC嵌入式操作系统背景 02年大学计算机应用专业毕业,参加实习工作进行UNIX下的应用软件开发,当时就发现自己在大学学习的知识只能达到软件这个行业的基本入门,而且所学的知识支离破碎 ......
os_magic 嵌入式系统
求CCS6.1license
本帖最后由 dl04110514 于 2015-9-21 15:30 编辑 新手,刚买了TMS570LS31X的TI原厂的开发套件,TI官网下了 CC6.1,哪位有CCS6.1的license,发一个!谢谢!QQ:845467848@qq.com...
dl04110514 微控制器 MCU
请教各位,USB接口能否分离输出输入信号
我不是搞硬件的,现在有个朋友问我这个问题,他想将USB数据线的中间线体部份用光纤代替,由于光纤是单向传输,这就需要分离出USB的输出输入信号,我想知道USB能否分离出输出输入信号,是不是每 ......
guiyi518 嵌入式系统
Grace图形化界面配置MSP430
用CCS开发的朋友们注意了,Ti推出了图形化的MSP430配置界面,来感受下图形化配置的快捷,下面是Grace的介绍http://processors.wiki.ti.com/index.php/Grace_Quick_Start_Guide?DCMP=Grace&HQS=O ......
wstt 微控制器 MCU

 
EEWorld订阅号

 
EEWorld服务号

 
汽车开发圈

 
机器人开发圈

About Us 关于我们 客户服务 联系方式 器件索引 网站地图 最新更新 手机版

站点相关: 大学堂 TI培训 Datasheet 电子工程 索引文件: 1694  2548  1056  758  2477  35  52  22  16  50 

器件索引   0 1 2 3 4 5 6 7 8 9 A B C D E F G H I J K L M N O P Q R S T U V W X Y Z

北京市海淀区中关村大街18号B座15层1530室 电话:(010)82350740 邮编:100190

电子工程世界版权所有 京B2-20211791 京ICP备10001474号-1 电信业务审批[2006]字第258号函 京公网安备 11010802033920号 Copyright © 2005-2026 EEWORLD.com.cn, Inc. All rights reserved