IC IC,D/A CONVERTER,SINGLE,12-BIT,CMOS,DIP,24PIN, Digital to Analog Converter
| 参数名称 | 属性值 |
| 是否Rohs认证 | 不符合 |
| 厂商名称 | ADI(亚德诺半导体) |
| Reach Compliance Code | unknow |
| 转换器类型 | D/A CONVERTER |
| 输入位码 | BINARY, OFFSET BINARY |
| JESD-30 代码 | R-XDIP-T24 |
| 最大线性误差 (EL) | 0.006% |
| 位数 | 12 |
| 功能数量 | 1 |
| 端子数量 | 24 |
| 最高工作温度 | 125 °C |
| 最低工作温度 | -55 °C |
| 封装主体材料 | CERAMIC |
| 封装代码 | DIP |
| 封装等效代码 | DIP24,.6 |
| 封装形状 | RECTANGULAR |
| 封装形式 | IN-LINE |
| 电源 | 5/15,-15 V |
| 认证状态 | Not Qualified |
| 筛选级别 | 38535Q/M;38534H;883B |
| 最大压摆率 | 25 mA |
| 表面贴装 | NO |
| 技术 | CMOS |
| 温度等级 | MILITARY |
| 端子形式 | THROUGH-HOLE |
| 端子节距 | 2.54 mm |
| 端子位置 | DUAL |
| 5962-01-107-2127 | AD562SD/BIN/883B | AD562KN/BIN | AD563SD/883B | AD563TD/883B | PM562GV | |
|---|---|---|---|---|---|---|
| 描述 | IC IC,D/A CONVERTER,SINGLE,12-BIT,CMOS,DIP,24PIN, Digital to Analog Converter | AD562SD/BIN/883B | IC IC,D/A CONVERTER,SINGLE,12-BIT,BIPOLAR,DIP,24PIN, Digital to Analog Converter | IC IC,D/A CONVERTER,SINGLE,12-BIT,CMOS,DIP,24PIN, Digital to Analog Converter | IC IC,D/A CONVERTER,SINGLE,12-BIT,CMOS,DIP,24PIN, Digital to Analog Converter | IC IC,D/A CONVERTER,SINGLE,12-BIT,BIPOLAR,DIP,24PIN, Digital to Analog Converter |
| 是否Rohs认证 | 不符合 | 不符合 | 不符合 | 不符合 | 不符合 | 不符合 |
| Reach Compliance Code | unknow | compliant | unknown | unknown | unknown | unknown |
| 转换器类型 | D/A CONVERTER | D/A CONVERTER | D/A CONVERTER | D/A CONVERTER | D/A CONVERTER | D/A CONVERTER |
| 输入位码 | BINARY, OFFSET BINARY | BINARY, OFFSET BINARY | BINARY, OFFSET BINARY | BINARY, OFFSET BINARY | BINARY, OFFSET BINARY | BINARY, OFFSET BINARY |
| JESD-30 代码 | R-XDIP-T24 | R-XDIP-T24 | R-PDIP-T24 | R-XDIP-T24 | R-XDIP-T24 | R-XDIP-T24 |
| 最大线性误差 (EL) | 0.006% | 0.006% | 0.012% | 0.006% | 0.006% | 0.006% |
| 位数 | 12 | 12 | 12 | 12 | 12 | 12 |
| 功能数量 | 1 | 1 | 1 | 1 | 1 | 1 |
| 端子数量 | 24 | 24 | 24 | 24 | 24 | 24 |
| 最高工作温度 | 125 °C | 125 °C | 70 °C | 125 °C | 125 °C | 70 °C |
| 最低工作温度 | -55 °C | -55 °C | - | -55 °C | -55 °C | - |
| 封装主体材料 | CERAMIC | CERAMIC | PLASTIC/EPOXY | CERAMIC | CERAMIC | CERAMIC |
| 封装代码 | DIP | DIP | DIP | DIP | DIP | DIP |
| 封装等效代码 | DIP24,.6 | DIP24,.6 | DIP24,.6 | DIP24,.6 | DIP24,.6 | DIP24,.6 |
| 封装形状 | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR |
| 封装形式 | IN-LINE | IN-LINE | IN-LINE | IN-LINE | IN-LINE | IN-LINE |
| 电源 | 5/15,-15 V | 5/15,-15 V | 5/15,-15 V | 5/15,-15 V | 5/15,-15 V | 5/15,-15 V |
| 认证状态 | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified |
| 表面贴装 | NO | NO | NO | NO | NO | NO |
| 技术 | CMOS | BIPOLAR | BIPOLAR | CMOS | CMOS | BIPOLAR |
| 温度等级 | MILITARY | MILITARY | COMMERCIAL | MILITARY | MILITARY | COMMERCIAL |
| 端子形式 | THROUGH-HOLE | THROUGH-HOLE | THROUGH-HOLE | THROUGH-HOLE | THROUGH-HOLE | THROUGH-HOLE |
| 端子节距 | 2.54 mm | 2.54 mm | 2.54 mm | 2.54 mm | 2.54 mm | 2.54 mm |
| 端子位置 | DUAL | DUAL | DUAL | DUAL | DUAL | DUAL |
| 厂商名称 | ADI(亚德诺半导体) | - | ADI(亚德诺半导体) | ADI(亚德诺半导体) | ADI(亚德诺半导体) | ADI(亚德诺半导体) |
| 筛选级别 | 38535Q/M;38534H;883B | 38535Q/M;38534H;883B | - | 38535Q/M;38534H;883B | 38535Q/M;38534H;883B | - |
| 最大压摆率 | 25 mA | 25 mA | - | 25 mA | 25 mA | - |
| JESD-609代码 | - | e0 | e0 | e0 | e0 | e0 |
| 端子面层 | - | Tin/Lead (Sn63Pb37) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) |
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