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HM-65642
8K x 8 Asynchronous
CMOS Static RAM
Description
The HM-65642 is a CMOS 8192 x 8-bit Static Random
Access Memory. The pinout is the JEDEC 28 pin, 8-bit wide
standard, which allows easy memory board layouts which
accommodate a variety of industry standard ROM, PROM,
EPROM, EEPROM and RAMs. The HM-65642 is ideally
suited for use in microprocessor based systems. In particu-
lar, interfacing with the Intersil 80C86 and 80C88 micropro-
cessors is simplified by the convenient output enable (G)
input.
The HM-65642 is a full CMOS RAM which utilizes an array
of six transistor (6T) memory cells for the most stable and
lowest possible standby supply current over the full military
temperature range.
May 2002
Features
• Full CMOS Design
• Six Transistor Memory Cell
• Low Standby Supply Current . . . . . . . . . . . . . . . . 100µA
• Low Operating Supply Current. . . . . . . . . . . . . . . 20mA
• Fast Address Access Time . . . . . . . . . . . . . . . . . . 150ns
• Low Data Retention Supply Voltage . . . . . . . . . . . 2.0V
• CMOS/TTL Compatible Inputs/Outputs
• JEDEC Approved Pinout
• Equal Cycle and Access Times
• No Clocks or Strobes Required
• Gated Inputs
• No Pull-Up or Pull-Down Resistors Required
• Easy Microprocessor Interfacing
• Dual Chip Enable Control
Ordering Information
PACKAGE
CERDIP
JAN#
TEMPERATURE
RANGE
-40
o
C to +85
o
C
-55
o
C to +125
o
C
29205BXA
(NOTE 1)
150ns/75µA
-
(NOTE 1)
150ns/150µA
HM1-65642-9
-
(NOTE 1)
200ns/250µA
-
-
PKG. NO.
F28.6
F28.6
NOTE:
1. Access Time/Data Retention Supply Current.
Pinout
HM-65642 (CERDIP)
TOP VIEW
NC 1
A12 2
A7 3
A6 4
A5 5
A4 6
A3 7
A2 8
A1 9
A0 10
DQ0 11
DQ1 12
DQ2 13
GND 14
28 V
CC
27 W
26 E2
25 A8
24 A9
23 A11
22 G
21 A10
20 E1
19 DQ7
18 DQ6
17 DQ5
16 DQ4
15 DQ3
PIN
A
DQ
E1
E2
W
G
NC
GND
V
CC
DESCRIPTION
Address Input
Data Input/Output
Chip Enable
Chip Enable
Write Enable
Output Enable
No Connections
Ground
Power
CAUTION: These devices are sensitive to electrostatic discharge; follow proper IC Handling Procedures.
1-888-INTERSIL or 321-724-7143
|
Intersil (and design) is a registered trademark of Intersil Americas Inc.
Copyright © Intersil Americas Inc. 2002. All Rights Reserved
FN3005.2
1
HM-65642
Functional Diagram
A9
ROW
ADDRESS BUFFERS
A8
A12
A7
A6
A5
A4
A3
A
ROW
DECODER
8
256
256 x 256
MEMORY ARRAY
A
8
256
COLUMN
ADDRESS BUFFERS
A2
A1
A0
A10
A11
A
5
A
5
COLUMN SELECT
(8 OF 256)
8
W
G
E1
8
E2
1 OF 8
DQ
TRUTH TABLE
MODE
Standby (CMOS)
Standby (TTL)
E1
X
V
IH
X
Enable (High Z)
Write
Read
V
IL
V
IL
V
IL
E2
GND
X
V
IL
V
IH
V
IH
V
IH
W
X
X
X
V
IH
V
IL
V
IH
G
X
X
X
V
IH
X
V
IL
2
HM-65642
Absolute Maximum Ratings
Supply Voltage . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . +7.0V
Input or Output Voltage Applied for All Grades . . . . . . GND -0.3V to
V
CC
+0.3V
Typical Derating Factor . . . . . . . . . . . 5mA/MHz Increase in ICCOP
ESD Classification . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Class 1
Thermal Information
θ
JC
Thermal Resistance (Typical)
θ
JA
o
C/W
o
C/W
CERDIP Package . . . . . . . . . . . . . . . . 45
8
Maximum Storage Temperature Range . . . . . . . . .-65
o
C to +150
o
C
Maximum Junction Temperature. . . . . . . . . . . . . . . . . . . . . . +175
o
C
Maximum Lead Temperature (Soldering 10s). . . . . . . . . . . . +300
o
C
Die Characteristics
Gate Count . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 101,000 Gates
CAUTION: Stresses above those listed in “Absolute Maximum Ratings” may cause permanent damage to the device. This is a stress only rating and operation
of the device at these or any other conditions above those indicated in the operational sections of this specification is not implied.
Operating Conditions
Operating Voltage Range . . . . . . . . . . . . . . . . . . . . . +4.5V to +5.5V
Operating Temperature Range
HM-65642-9 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . -40
o
C to +85
o
C
Input Low Voltage . . . . . . . . . . . . . . . . . . . . . . . . . . . .-0.3V to +0.8V
Input High Voltage. . . . . . . . . . . . . . . . . . . . . . . +2.2V to V
CC
+0.3V
DC Electrical Specifications
SYMBOL
ICCSB1
ICCSB2
ICCDR
ICCEN
ICCOP
II
IIOZ
VCCDR
VOH1
VOH2
VOL
V
CC
= 5V
±10%;
T
A
= -40
o
C to +85
o
C (HM-65642-9)
LIMITS
PARAMETER
Standby Supply Current (CMOS)
Standby Supply Current (TTL)
Data Retention Supply Current
Enabled Supply Current
Operating Supply Current (Note 1)
Input Leakage Current
Input/Output Leakage Current
Data Retention Supply Voltage
Output High Voltage
Output High Voltage (Note 2)
Output Low Voltage
T
A
= +25
o
C
PARAMETER
Input Capacitance (Note 2)
Input/Output Capacitance (Note 2)
MIN
-
-
-
-
-
-1.0
-1.0
2.0
2.4
V
CC
-0.4
-
MAX
250
5
150
5
20
+1.0
+1.0
-
-
-
0.4
UNITS
µA
mA
µA
mA
mA
µA
µA
V
V
V
V
TEST CONDITIONS
E2 = GND, V
CC
= 5.5V
E2 = 0.8V or E1 = 2.2V, V
CC
= 5.5V
E2 = GND, V
CC
= 2.0V
E2 = 2.2V, E1 = 0.8V, V
CC
= 5.5V,
IIO = 0mA
f = 1MHz, E1 = 0.8V, E2 = 2.2V,
V
CC
= 5.5V, IIO = 0mA
VI = V
CC
or GND, V
CC
= 5.5V
E2 = GND, VIO = V
CC
or GND,
V
CC
= 5.5V
IOH = -1.0mA, V
CC
= 4.5V
IOH = -100µA, V
CC
= 4.5V
IOL = 4.0mA, V
CC
= 4.5V
Capacitance
SYMBOL
CI
CIO
NOTES:
MAX
12
14
UNITS
pF
pF
TEST CONDITIONS
f = 1MHz, All measurements are
referenced to device GND
1. Typical derating 5mA/MHz increase in ICCOP.
2. Tested at initial design and after major design changes.
3
HM-65642
AC Electrical Specifications
SYMBOL
READ CYCLE
(1) TAVAX
(2) TAVQV
(3) TE1LQV
(4) TE2HQV
(5) TGLQV
(6) TE1LQX
(7) TE2HQX
(8) TGLQX
(9) TE1HQZ
(10) TE2LQZ
(11) TGHQZ
(12) TAXQX
WRITE CYCLE
(13) TAVAX
(14) TWLWH
(15) TE1LE1H
(16) TE2HE2L
(17) TAVWL
(18) TAVE1L
(19) TAVE2H
(20) TWHAX
(21) TE1HAX
(22) TE2LAX
(23) TDVWH
(24) TDVE1H
(25) TDVE2L
(26) TWHDX
(27) TE1HDX
(28) TE2LDX
(29) TWLQZ
(30) TWHQX
NOTES:
1. Input pulse levels: 0V to 3.0V; Input rise and fall times: 5ns (max); Input and output timing reference level: 1.5V; Output load:
1 TTL gate equivalent, C
L
= 50pF (min) - for C
L
greater than 50pF, access time is derated by 0.15ns per pF.
2. Tested at initial design and after major design changes.
3. V
CC
= 4.5V and 5.5V.
Write Cycle Time
Write Pulse Width
Chip Enable to End of Write
Chip Enable to End of Write
Address Setup Time
Address Setup Time
Address Setup Time
Write Recovery Time
Write Recovery Time
Write Recovery Time
Data Setup Time
Data Setup Time
Data Setup Time
Data Hold Time
Data Hold Time
Data Hold Time
Write Enable Low to Output Off
Write Enable High to Output On
Late Write
Early Write
Early Write
Late Write
Early Write
Early Write
Late Write
Early Write
Early Write
Late Write
Early Write
Early Write
E1
E2
E1
E2
E1
E2
E1
E2
E1
E2
150
90
90
90
0
0
0
10
10
10
60
60
60
5
10
10
-
5
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
50
-
ns
ns
ns
ns
ns
ns
ns
ns
ns
ns
ns
-
ns
ns
ns
ns
ns
ns
(Notes 1, 3)
(Notes 1, 3)
(Notes 1, 3)
(Notes 1, 3)
(Notes 1, 3)
(Notes 1, 3)
(Notes 1, 3)
(Notes 1, 3)
(Notes 1, 3)
(Notes 1, 3)
(Notes 1, 3)
(Notes 1, 3)
(Notes 1, 3)
(Notes 1, 3)
(Notes 1, 3)
(Notes 1, 3)
(Notes 2, 3)
(Notes 2, 3)
Read Cycle Time
Address Access Time
Chip Enable Access Time
Chip Enable Access Time
Output Enable Access Time
Chip Enable Valid to Output On
Chip Enable Valid to Output On
Output Enable Valid to Output On
Chip Enable Not Valid to Output Off
Chip Enable Not Valid to Output Off
Output Enable Not Valid to Output Off
Output Hold From Address Change
E1
E2
E1
E2
E1
E2
150
-
-
-
-
10
10
5
-
-
-
10
-
150
150
150
70
-
-
-
50
60
50
-
ns
ns
ns
ns
ns
ns
ns
ns
ns
ns
ns
ns
(Notes 1, 3)
(Notes 1, 3)
(Notes 2, 3)
(Notes 1, 3)
(Notes 1, 3)
(Notes 2, 3)
(Notes 2, 3)
(Notes 2, 3)
(Notes 2, 3)
(Notes 2, 3)
(Notes 2, 3)
(Notes 2, 3)
V
CC
= 5V
±10%;
T
A
= -40
o
C to +85
o
C (HM-65642-9)
LIMITS
PARAMETER
MIN
MAX
UNITS
TEST
CONDITIONS
4
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