4K X 8 SPI BUS SERIAL EEPROM, PDSO8, TSSOP-14
| 参数名称 | 属性值 |
| 是否无铅 | 不含铅 |
| 是否Rohs认证 | 符合 |
| 零件包装代码 | TSSOP |
| 包装说明 | TSSOP-14 |
| 针数 | 8 |
| Reach Compliance Code | compli |
| ECCN代码 | EAR99 |
| 其他特性 | 1M ENDURANCE CYCLE; 200 YEARS DATA RETENTION |
| 最大时钟频率 (fCLK) | 3 MHz |
| 数据保留时间-最小值 | 200 |
| 耐久性 | 1000000 Write/Erase Cycles |
| JESD-30 代码 | R-PDSO-G8 |
| JESD-609代码 | e3 |
| 内存密度 | 32768 bi |
| 内存集成电路类型 | EEPROM |
| 内存宽度 | 8 |
| 湿度敏感等级 | 1 |
| 功能数量 | 1 |
| 端子数量 | 8 |
| 字数 | 4096 words |
| 字数代码 | 4000 |
| 工作模式 | SYNCHRONOUS |
| 最高工作温度 | 70 °C |
| 最低工作温度 | |
| 组织 | 4KX8 |
| 封装主体材料 | PLASTIC/EPOXY |
| 封装代码 | SOP |
| 封装形状 | RECTANGULAR |
| 封装形式 | SMALL OUTLINE |
| 并行/串行 | SERIAL |
| 峰值回流温度（摄氏度） | 260 |
| 认证状态 | Not Qualified |
| 串行总线类型 | SPI |
| 最大供电电压 (Vsup) | 5.5 V |
| 最小供电电压 (Vsup) | 4.5 V |
| 标称供电电压 (Vsup) | 5 V |
| 表面贴装 | YES |
| 技术 | CMOS |
| 温度等级 | COMMERCIAL |
| 端子面层 | Matte Tin (Sn) |
| 端子形式 | GULL WING |
| 端子位置 | DUAL |
| 处于峰值回流温度下的最长时间 | 40 |
| 最长写入周期时间 (tWC) | 5 ms |
| Base Number Matches | 1 |
| 25C320T/STG | 25C320/STG | 25C320/ST | 25LC320/STG | 25LC320T/ST | 25LC320T/STG | 25LC320/ST | 25C320T/ST | |
|---|---|---|---|---|---|---|---|---|
| 描述 | 4K X 8 SPI BUS SERIAL EEPROM, PDSO8, TSSOP-14 | 4K X 8 SPI BUS SERIAL EEPROM, PDSO8, TSSOP-14 | 4K X 8 SPI BUS SERIAL EEPROM, PDSO8, TSSOP-14 | 4K X 8 SPI BUS SERIAL EEPROM, PDSO8, TSSOP-14 | 4K X 8 SPI BUS SERIAL EEPROM, PDSO8, TSSOP-14 | 4K X 8 SPI BUS SERIAL EEPROM, PDSO8, TSSOP-14 | 4K X 8 SPI BUS SERIAL EEPROM, PDSO8, TSSOP-14 | 4K X 8 SPI BUS SERIAL EEPROM, PDSO8, TSSOP-14 |
| 是否无铅 | 不含铅 | 不含铅 | 不含铅 | 不含铅 | 不含铅 | 不含铅 | 不含铅 | 不含铅 |
| 是否Rohs认证 | 符合 | 符合 | 符合 | 符合 | 符合 | 符合 | 符合 | 符合 |
| 零件包装代码 | TSSOP | TSSOP | TSSOP | TSSOP | TSSOP | TSSOP | TSSOP | TSSOP |
| 包装说明 | TSSOP-14 | TSSOP-14 | TSSOP-14 | TSSOP-14 | TSSOP-14 | TSSOP-14 | SOP, TSSOP14,.25 | TSSOP-14 |
| 针数 | 8 | 8 | 8 | 8 | 8 | 8 | 8 | 8 |
| Reach Compliance Code | compli | compli | compli | compli | compli | compli | compli | compli |
| ECCN代码 | EAR99 | EAR99 | EAR99 | EAR99 | EAR99 | EAR99 | EAR99 | EAR99 |
| 其他特性 | 1M ENDURANCE CYCLE; 200 YEARS DATA RETENTION | 1M ENDURANCE CYCLE; 200 YEARS DATA RETENTION | 1M ENDURANCE CYCLE; 200 YEARS DATA RETENTION | 1M ENDURANCE CYCLE; 200 YEARS DATA RETENTION | 1M ENDURANCE CYCLE; 200 YEARS DATA RETENTION | 1M ENDURANCE CYCLE; 200 YEARS DATA RETENTION | 1M ENDURANCE CYCLE; 200 YEARS DATA RETENTION | 1M ENDURANCE CYCLE; 200 YEARS DATA RETENTION |
| 最大时钟频率 (fCLK) | 3 MHz | 3 MHz | 3 MHz | 2 MHz | 2 MHz | 2 MHz | 2 MHz | 3 MHz |
| 数据保留时间-最小值 | 200 | 200 | 200 | 200 | 200 | 200 | 200 | 200 |
| 耐久性 | 1000000 Write/Erase Cycles | 1000000 Write/Erase Cycles | 1000000 Write/Erase Cycles | 1000000 Write/Erase Cycles | 1000000 Write/Erase Cycles | 1000000 Write/Erase Cycles | 1000000 Write/Erase Cycles | 1000000 Write/Erase Cycles |
| JESD-30 代码 | R-PDSO-G8 | R-PDSO-G8 | R-PDSO-G8 | R-PDSO-G8 | R-PDSO-G8 | R-PDSO-G8 | R-PDSO-G8 | R-PDSO-G8 |
| JESD-609代码 | e3 | e3 | e3 | e3 | e3 | e3 | e3 | e3 |
| 内存密度 | 32768 bi | 32768 bi | 32768 bi | 32768 bi | 32768 bi | 32768 bi | 32768 bi | 32768 bi |
| 内存集成电路类型 | EEPROM | EEPROM | EEPROM | EEPROM | EEPROM | EEPROM | EEPROM | EEPROM |
| 内存宽度 | 8 | 8 | 8 | 8 | 8 | 8 | 8 | 8 |
| 湿度敏感等级 | 1 | 1 | 1 | 1 | 1 | 1 | 1 | 1 |
| 功能数量 | 1 | 1 | 1 | 1 | 1 | 1 | 1 | 1 |
| 端子数量 | 8 | 8 | 8 | 8 | 8 | 8 | 8 | 8 |
| 字数 | 4096 words | 4096 words | 4096 words | 4096 words | 4096 words | 4096 words | 4096 words | 4096 words |
| 字数代码 | 4000 | 4000 | 4000 | 4000 | 4000 | 4000 | 4000 | 4000 |
| 工作模式 | SYNCHRONOUS | SYNCHRONOUS | SYNCHRONOUS | SYNCHRONOUS | SYNCHRONOUS | SYNCHRONOUS | SYNCHRONOUS | SYNCHRONOUS |
| 最高工作温度 | 70 °C | 70 °C | 70 °C | 70 °C | 70 °C | 70 °C | 70 °C | 70 °C |
| 组织 | 4KX8 | 4KX8 | 4KX8 | 4KX8 | 4KX8 | 4KX8 | 4KX8 | 4KX8 |
| 封装主体材料 | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY |
| 封装代码 | SOP | SOP | SOP | SOP | SOP | SOP | SOP | SOP |
| 封装形状 | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR |
| 封装形式 | SMALL OUTLINE | SMALL OUTLINE | SMALL OUTLINE | SMALL OUTLINE | SMALL OUTLINE | SMALL OUTLINE | SMALL OUTLINE | SMALL OUTLINE |
| 并行/串行 | SERIAL | SERIAL | SERIAL | SERIAL | SERIAL | SERIAL | SERIAL | SERIAL |
| 峰值回流温度（摄氏度） | 260 | 260 | 260 | 260 | 260 | 260 | 260 | 260 |
| 认证状态 | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified |
| 串行总线类型 | SPI | SPI | SPI | SPI | SPI | SPI | SPI | SPI |
| 最大供电电压 (Vsup) | 5.5 V | 5.5 V | 5.5 V | 5.5 V | 5.5 V | 5.5 V | 5.5 V | 5.5 V |
| 最小供电电压 (Vsup) | 4.5 V | 4.5 V | 4.5 V | 2.5 V | 2.5 V | 2.5 V | 2.5 V | 4.5 V |
| 表面贴装 | YES | YES | YES | YES | YES | YES | YES | YES |
| 技术 | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS |
| 温度等级 | COMMERCIAL | COMMERCIAL | COMMERCIAL | COMMERCIAL | COMMERCIAL | COMMERCIAL | COMMERCIAL | COMMERCIAL |
| 端子面层 | Matte Tin (Sn) | Matte Tin (Sn) | Matte Tin (Sn) | Matte Tin (Sn) | Matte Tin (Sn) | Matte Tin (Sn) | Matte Tin (Sn) | Matte Tin (Sn) |
| 端子形式 | GULL WING | GULL WING | GULL WING | GULL WING | GULL WING | GULL WING | GULL WING | GULL WING |
| 端子位置 | DUAL | DUAL | DUAL | DUAL | DUAL | DUAL | DUAL | DUAL |
| 处于峰值回流温度下的最长时间 | 40 | 40 | 40 | 40 | 40 | 40 | 40 | 40 |
| 最长写入周期时间 (tWC) | 5 ms | 5 ms | 5 ms | 5 ms | 5 ms | 5 ms | 5 ms | 5 ms |
| Base Number Matches | 1 | 1 | 1 | 1 | 1 | 1 | 1 | 1 |
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