Field Programmable Gate Array, 18720 CLBs, 1265MHz, 239616-Cell, CMOS, PBGA1738, 42.50 X 42.50 MM, FBGA-1738
参数名称 | 属性值 |
是否Rohs认证 | 不符合 |
厂商名称 | XILINX(赛灵思) |
零件包装代码 | BGA |
包装说明 | BGA-1738 |
针数 | 1738 |
Reach Compliance Code | _compli |
CLB-Max的组合延迟 | 0.77 ns |
JESD-30 代码 | S-PBGA-B1738 |
JESD-609代码 | e0 |
长度 | 42.5 mm |
湿度敏感等级 | 4 |
可配置逻辑块数量 | 18720 |
输入次数 | 960 |
逻辑单元数量 | 239616 |
输出次数 | 960 |
端子数量 | 1738 |
最高工作温度 | 100 °C |
最低工作温度 | -40 °C |
组织 | 18720 CLBS |
封装主体材料 | PLASTIC/EPOXY |
封装代码 | BGA |
封装等效代码 | BGA1738,42X42,40 |
封装形状 | SQUARE |
封装形式 | GRID ARRAY |
峰值回流温度(摄氏度) | 225 |
电源 | 1,2.5 V |
可编程逻辑类型 | FPGA |
认证状态 | Not Qualified |
座面最大高度 | 3.25 mm |
最大供电电压 | 1.05 V |
最小供电电压 | 0.95 V |
标称供电电压 | 1 V |
表面贴装 | YES |
温度等级 | INDUSTRIAL |
端子面层 | Tin/Lead (Sn63Pb37) |
端子形式 | BALL |
端子节距 | 1 mm |
端子位置 | BOTTOM |
处于峰值回流温度下的最长时间 | 30 |
宽度 | 42.5 mm |
XC5VSX240T-2FF1738I | XC5VLX330T-2FF1738I | XC5VLX330T-2FFG1738I | 2104LHME140GSN3110 | XC5VFX200T-2FF1738I | XC5VLX330-2FFG1760I | XC5VLX330-2FF1760I | XC5VSX240T-2FFG1738I | |
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描述 | Field Programmable Gate Array, 18720 CLBs, 1265MHz, 239616-Cell, CMOS, PBGA1738, 42.50 X 42.50 MM, FBGA-1738 | Field Programmable Gate Array, 25920 CLBs, 1265MHz, 331776-Cell, CMOS, PBGA1738, 42.50 X 42.50 MM, FBGA-1738 | Field Programmable Gate Array, 25920 CLBs, 1265MHz, 331776-Cell, CMOS, PBGA1738, 42.50 X 42.50 MM, LEAD FREE, FBGA-1738 | CAP,AL2O3,100MF,80VDC,20% -TOL,20% +TOL | Field Programmable Gate Array, 16320 CLBs, 1265MHz, 196608-Cell, CMOS, PBGA1738, 42.50 X 42.50 MM, FBGA-1738 | Field Programmable Gate Array, 25920 CLBs, 1265MHz, 331776-Cell, CMOS, PBGA1760, 42.50 X 42.50 MM, LEAD FREE, FBGA-1760 | Field Programmable Gate Array, 25920 CLBs, 1265MHz, 331776-Cell, CMOS, PBGA1760, 42.50 X 42.50 MM, FBGA-1760 | Field Programmable Gate Array, 18720 CLBs, 1265MHz, 239616-Cell, CMOS, PBGA1738, 42.50 X 42.50 MM, LEAD FREE, FBGA-1738 |
包装说明 | BGA-1738 | BGA, BGA1738,42X42,40 | BGA, BGA1738,42X42,40 | , | BGA-1738 | BGA-1760 | BGA-1760 | BGA-1738 |
Reach Compliance Code | _compli | not_compliant | not_compliant | unknown | not_compliant | not_compliant | not_compliant | _compli |
长度 | 42.5 mm | 42.5 mm | 42.5 mm | 140 mm | 42.5 mm | 42.5 mm | 42.5 mm | 42.5 mm |
端子数量 | 1738 | 1738 | 1738 | 2 | 1738 | 1760 | 1760 | 1738 |
最高工作温度 | 100 °C | 100 °C | 100 °C | 105 °C | 100 °C | 100 °C | 100 °C | 100 °C |
最低工作温度 | -40 °C | -40 °C | -40 °C | -40 °C | -40 °C | -40 °C | -40 °C | -40 °C |
封装形式 | GRID ARRAY | GRID ARRAY | GRID ARRAY | Screw Ends | GRID ARRAY | GRID ARRAY | GRID ARRAY | GRID ARRAY |
是否Rohs认证 | 不符合 | 不符合 | 符合 | - | 不符合 | 符合 | 不符合 | 符合 |
厂商名称 | XILINX(赛灵思) | XILINX(赛灵思) | XILINX(赛灵思) | - | XILINX(赛灵思) | XILINX(赛灵思) | XILINX(赛灵思) | XILINX(赛灵思) |
零件包装代码 | BGA | BGA | BGA | - | BGA | BGA | BGA | BGA |
针数 | 1738 | 1738 | 1738 | - | 1738 | 1760 | 1760 | 1738 |
CLB-Max的组合延迟 | 0.77 ns | 0.77 ns | 0.77 ns | - | 0.77 ns | 0.77 ns | 0.77 ns | 0.77 ns |
JESD-30 代码 | S-PBGA-B1738 | S-PBGA-B1738 | S-PBGA-B1738 | - | S-PBGA-B1738 | S-PBGA-B1760 | S-PBGA-B1760 | S-PBGA-B1738 |
JESD-609代码 | e0 | e0 | e1 | - | e0 | e1 | e0 | e1 |
湿度敏感等级 | 4 | 4 | 4 | - | 4 | 4 | 4 | 4 |
可配置逻辑块数量 | 18720 | 25920 | 25920 | - | 15360 | 25920 | 25920 | 18720 |
输入次数 | 960 | 960 | 960 | - | 960 | 1200 | 1200 | 960 |
逻辑单元数量 | 239616 | 331776 | 331776 | - | 196608 | 331776 | 331776 | 239616 |
输出次数 | 960 | 960 | 960 | - | 960 | 1200 | 1200 | 960 |
组织 | 18720 CLBS | 25920 CLBS | 25920 CLBS | - | 15360 CLBS | 25920 CLBS | 25920 CLBS | 18720 CLBS |
封装主体材料 | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | - | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY |
封装代码 | BGA | BGA | BGA | - | BGA | BGA | BGA | BGA |
封装等效代码 | BGA1738,42X42,40 | BGA1738,42X42,40 | BGA1738,42X42,40 | - | BGA1738,42X42,40 | BGA1760,42X42,40 | BGA1760,42X42,40 | BGA1738,42X42,40 |
封装形状 | SQUARE | SQUARE | SQUARE | - | SQUARE | SQUARE | SQUARE | SQUARE |
峰值回流温度(摄氏度) | 225 | 225 | 245 | - | 225 | 245 | 225 | 245 |
电源 | 1,2.5 V | 1,2.5 V | 1,2.5 V | - | 1,2.5 V | 1,2.5 V | 1,2.5 V | 1,2.5 V |
可编程逻辑类型 | FPGA | FPGA | FPGA | - | FPGA | FPGA | FPGA | FPGA |
认证状态 | Not Qualified | Not Qualified | Not Qualified | - | Not Qualified | Not Qualified | Not Qualified | Not Qualified |
座面最大高度 | 3.25 mm | 3.25 mm | 3.25 mm | - | 3.25 mm | 3.5 mm | 3.5 mm | 3.25 mm |
最大供电电压 | 1.05 V | 1.05 V | 1.05 V | - | 1.05 V | 1.05 V | 1.05 V | 1.05 V |
最小供电电压 | 0.95 V | 0.95 V | 0.95 V | - | 0.95 V | 0.95 V | 0.95 V | 0.95 V |
标称供电电压 | 1 V | 1 V | 1 V | - | 1 V | 1 V | 1 V | 1 V |
表面贴装 | YES | YES | YES | - | YES | YES | YES | YES |
温度等级 | INDUSTRIAL | INDUSTRIAL | INDUSTRIAL | - | INDUSTRIAL | INDUSTRIAL | INDUSTRIAL | INDUSTRIAL |
端子面层 | Tin/Lead (Sn63Pb37) | Tin/Lead (Sn63Pb37) | Tin/Silver/Copper (Sn95.5Ag4.0Cu0.5) | - | Tin/Lead (Sn63Pb37) | Tin/Silver/Copper (Sn95.5Ag4.0Cu0.5) | Tin/Lead (Sn63Pb37) | Tin/Silver/Copper (Sn95.5Ag4.0Cu0.5) |
端子形式 | BALL | BALL | BALL | - | BALL | BALL | BALL | BALL |
端子节距 | 1 mm | 1 mm | 1 mm | - | 1 mm | 1 mm | 1 mm | 1 mm |
端子位置 | BOTTOM | BOTTOM | BOTTOM | - | BOTTOM | BOTTOM | BOTTOM | BOTTOM |
处于峰值回流温度下的最长时间 | 30 | 30 | 30 | - | 30 | 30 | 30 | 30 |
宽度 | 42.5 mm | 42.5 mm | 42.5 mm | - | 42.5 mm | 42.5 mm | 42.5 mm | 42.5 mm |
ECCN代码 | - | 3A001.A.7.A | 3A001.A.7.A | EAR99 | 3A001.A.7.A | 3A001.A.7.A | 3A001.A.7.A | - |
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