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W25Q32BWSFIP: 产品描述Flash, 4MX8, PDSO16, 0.300 INCH, GREEN, PLASTIC, SOIC-16; 产品类别存储存储; 文件大小2MB，共72页; 制造商Winbond(华邦电子); 官网地址http://www.winbond.com.tw; 标准

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W25Q32BWSFIP概述

Flash, 4MX8, PDSO16, 0.300 INCH, GREEN, PLASTIC, SOIC-16

W25Q32BWSFIP规格参数

参数名称	属性值
是否Rohs认证	符合
厂商名称	Winbond(华邦电子)
零件包装代码	SOIC
包装说明	SOP, SOP16,.4
针数	16
Reach Compliance Code	compli
ECCN代码	3A991.B.1.B.1
最大时钟频率 (fCLK)	80 MHz
数据保留时间-最小值	20
耐久性	100000 Write/Erase Cycles
JESD-30 代码	R-PDSO-G16
长度	10.285 mm
内存密度	33554432 bi
内存集成电路类型	FLASH
内存宽度	8
功能数量	1
端子数量	16
字数	4194304 words
字数代码	4000000
工作模式	SYNCHRONOUS
最高工作温度	85 °C
最低工作温度	-40 °C
组织	4MX8
封装主体材料	PLASTIC/EPOXY
封装代码	SOP
封装等效代码	SOP16,.4
封装形状	RECTANGULAR
封装形式	SMALL OUTLINE
并行/串行	SERIAL
电源	1.8 V
编程电压	1.8 V
认证状态	Not Qualified
座面最大高度	2.64 mm
串行总线类型	SPI
最大待机电流	0.000005 A
最大压摆率	0.025 mA
最大供电电压 (Vsup)	1.95 V
最小供电电压 (Vsup)	1.65 V
标称供电电压 (Vsup)	1.8 V
表面贴装	YES
技术	CMOS
温度等级	INDUSTRIAL
端子形式	GULL WING
端子节距	1.27 mm
端子位置	DUAL
类型	NOR TYPE
宽度	7.49 mm
写保护	HARDWARE/SOFTWARE

W25Q32BWSFIP相似产品对比

	W25Q32BWSFIP	W25Q32BWZPIP	W25Q32BWSSIP	W25Q32BWSSIG	W25Q32BWZEIP	W25Q32BWZPIG	W25Q32BWSFIG	W25Q32BWSNIP	W25Q32BWZEIG	W25Q32BWSNIG
描述	Flash, 4MX8, PDSO16, 0.300 INCH, GREEN, PLASTIC, SOIC-16	Flash, 4MX8, 6 X 5 MM, GREEN, WSON-8	Flash, 4MX8, PDSO8, 0.208 INCH, GREEN, PLASTIC, SOIC-8	Flash, 4MX8, PDSO8, 0.208 INCH, GREEN, PLASTIC, SOIC-8	Flash, 4MX8, 8 X 6 MM, GREEN, WSON-8	Flash, 4MX8, 6 X 5 MM, GREEN, WSON-8	Flash, 4MX8, PDSO16, 0.300 INCH, GREEN, PLASTIC, SOIC-16	Flash, 4MX8, 0.150 INCH, GREEN, PLASTIC, SOIC-8	Flash, 4MX8, 8 X 6 MM, GREEN, WSON-8	Flash, 4MX8, 0.150 INCH, GREEN, PLASTIC, SOIC-8
是否Rohs认证	符合	符合	符合	符合	符合	符合	符合	符合	符合	符合
零件包装代码	SOIC	SON	SOIC	SOIC	SON	SON	SOIC	SOIC	SON	SOIC
包装说明	SOP, SOP16,.4	VSON, SOLCC8,.25	SOP, SOP8,.3	SOIC-8	VSON, SOLCC8,.3	WSON-8	SOIC-16	SON, SOP8,.25	VSON, SOLCC8,.3	SON, SOP8,.25
针数	16	8	8	8	8	8	16	8	8	8
Reach Compliance Code	compli	compliant	compliant	compliant	compliant	compliant	compliant	compli	compli	compliant
ECCN代码	3A991.B.1.B.1	3A991.B.1.B.1	3A991.B.1.B.1	3A991.B.1.B.1	3A991.B.1.B.1	3A991.B.1.B.1	3A991.B.1.B.1	3A991.B.1.B.1	3A991.B.1.B.1	EAR99
最大时钟频率 (fCLK)	80 MHz	80 MHz	80 MHz	80 MHz	80 MHz	80 MHz	80 MHz	80 MHz	80 MHz	80 MHz
数据保留时间-最小值	20	20	20	20	20	20	20	20	20	20
耐久性	100000 Write/Erase Cycles	100000 Write/Erase Cycles	100000 Write/Erase Cycles	100000 Write/Erase Cycles	100000 Write/Erase Cycles	100000 Write/Erase Cycles	100000 Write/Erase Cycles	100000 Write/Erase Cycles	100000 Write/Erase Cycles	100000 Write/Erase Cycles
JESD-30 代码	R-PDSO-G16	R-XDSO-N8	S-PDSO-G8	S-PDSO-G8	R-XDSO-N8	R-XDSO-N8	R-PDSO-G16	R-XDSO-N8	R-XDSO-N8	R-XDSO-N8
长度	10.285 mm	6 mm	5.28 mm	5.28 mm	8 mm	6 mm	10.285 mm	4.85 mm	8 mm	4.85 mm
内存密度	33554432 bi	33554432 bit	33554432 bit	33554432 bit	33554432 bit	33554432 bit	33554432 bit	33554432 bi	33554432 bi	33554432 bit
内存集成电路类型	FLASH	FLASH	FLASH	FLASH	FLASH	FLASH	FLASH	FLASH	FLASH	FLASH
内存宽度	8	8	8	8	8	8	8	8	8	8
功能数量	1	1	1	1	1	1	1	1	1	1
端子数量	16	8	8	8	8	8	16	8	8	8
字数	4194304 words	4194304 words	4194304 words	4194304 words	4194304 words	4194304 words	4194304 words	4194304 words	4194304 words	4194304 words
字数代码	4000000	4000000	4000000	4000000	4000000	4000000	4000000	4000000	4000000	4000000
工作模式	SYNCHRONOUS	SYNCHRONOUS	SYNCHRONOUS	SYNCHRONOUS	SYNCHRONOUS	SYNCHRONOUS	SYNCHRONOUS	SYNCHRONOUS	SYNCHRONOUS	SYNCHRONOUS
最高工作温度	85 °C	85 °C	85 °C	85 °C	85 °C	85 °C	85 °C	85 °C	85 °C	85 °C
最低工作温度	-40 °C	-40 °C	-40 °C	-40 °C	-40 °C	-40 °C	-40 °C	-40 °C	-40 °C	-40 °C
组织	4MX8	4MX8	4MX8	4MX8	4MX8	4MX8	4MX8	4MX8	4MX8	4MX8
封装主体材料	PLASTIC/EPOXY	UNSPECIFIED	PLASTIC/EPOXY	PLASTIC/EPOXY	UNSPECIFIED	UNSPECIFIED	PLASTIC/EPOXY	UNSPECIFIED	UNSPECIFIED	UNSPECIFIED
封装代码	SOP	VSON	SOP	SOP	VSON	VSON	SOP	SON	VSON	SON
封装等效代码	SOP16,.4	SOLCC8,.25	SOP8,.3	SOP8,.3	SOLCC8,.3	SOLCC8,.25	SOP16,.4	SOP8,.25	SOLCC8,.3	SOP8,.25
封装形状	RECTANGULAR	RECTANGULAR	SQUARE	SQUARE	RECTANGULAR	RECTANGULAR	RECTANGULAR	RECTANGULAR	RECTANGULAR	RECTANGULAR
封装形式	SMALL OUTLINE	SMALL OUTLINE, VERY THIN PROFILE	SMALL OUTLINE	SMALL OUTLINE	SMALL OUTLINE, VERY THIN PROFILE	SMALL OUTLINE, VERY THIN PROFILE	SMALL OUTLINE	SMALL OUTLINE	SMALL OUTLINE, VERY THIN PROFILE	SMALL OUTLINE
并行/串行	SERIAL	SERIAL	SERIAL	SERIAL	SERIAL	SERIAL	SERIAL	SERIAL	SERIAL	SERIAL
电源	1.8 V	1.8 V	1.8 V	1.8 V	1.8 V	1.8 V	1.8 V	1.8 V	1.8 V	1.8 V
编程电压	1.8 V	1.8 V	1.8 V	1.8 V	1.8 V	1.8 V	1.8 V	1.8 V	1.8 V	1.8 V
认证状态	Not Qualified	Not Qualified	Not Qualified	Not Qualified	Not Qualified	Not Qualified	Not Qualified	Not Qualified	Not Qualified	Not Qualified
座面最大高度	2.64 mm	0.8 mm	2.16 mm	2.16 mm	0.8 mm	0.8 mm	2.64 mm	1.72 mm	0.8 mm	1.72 mm
串行总线类型	SPI	SPI	SPI	SPI	SPI	SPI	SPI	SPI	SPI	SPI
最大待机电流	0.000005 A	0.000005 A	0.000005 A	0.000005 A	0.000005 A	0.000005 A	0.000005 A	0.000005 A	0.000005 A	0.000005 A
最大压摆率	0.025 mA	0.024 mA	0.024 mA	0.024 mA	0.024 mA	0.024 mA	0.024 mA	0.024 mA	0.024 mA	0.024 mA
最大供电电压 (Vsup)	1.95 V	1.95 V	1.95 V	1.95 V	1.95 V	1.95 V	1.95 V	1.95 V	1.95 V	1.95 V
最小供电电压 (Vsup)	1.65 V	1.65 V	1.65 V	1.65 V	1.65 V	1.65 V	1.65 V	1.65 V	1.65 V	1.65 V
标称供电电压 (Vsup)	1.8 V	1.8 V	1.8 V	1.8 V	1.8 V	1.8 V	1.8 V	1.8 V	1.8 V	1.8 V
表面贴装	YES	YES	YES	YES	YES	YES	YES	YES	YES	YES
技术	CMOS	CMOS	CMOS	CMOS	CMOS	CMOS	CMOS	CMOS	CMOS	CMOS
温度等级	INDUSTRIAL	INDUSTRIAL	INDUSTRIAL	INDUSTRIAL	INDUSTRIAL	INDUSTRIAL	INDUSTRIAL	INDUSTRIAL	INDUSTRIAL	INDUSTRIAL
端子形式	GULL WING	NO LEAD	GULL WING	GULL WING	NO LEAD	NO LEAD	GULL WING	NO LEAD	NO LEAD	NO LEAD
端子节距	1.27 mm	1.27 mm	1.27 mm	1.27 mm	1.27 mm	1.27 mm	1.27 mm	1.27 mm	1.27 mm	1.27 mm
端子位置	DUAL	DUAL	DUAL	DUAL	DUAL	DUAL	DUAL	DUAL	DUAL	DUAL
类型	NOR TYPE	NOR TYPE	NOR TYPE	NOR TYPE	NOR TYPE	NOR TYPE	NOR TYPE	NOR TYPE	NOR TYPE	NOR TYPE
宽度	7.49 mm	5 mm	5.28 mm	5.28 mm	6 mm	5 mm	7.49 mm	3.9 mm	6 mm	3.9 mm
写保护	HARDWARE/SOFTWARE	HARDWARE/SOFTWARE	HARDWARE/SOFTWARE	HARDWARE/SOFTWARE	HARDWARE/SOFTWARE	HARDWARE/SOFTWARE	HARDWARE/SOFTWARE	HARDWARE/SOFTWARE	HARDWARE/SOFTWARE	HARDWARE/SOFTWARE
厂商名称	Winbond(华邦电子)	-	Winbond(华邦电子)	Winbond(华邦电子)	Winbond(华邦电子)	Winbond(华邦电子)	Winbond(华邦电子)	Winbond(华邦电子)	Winbond(华邦电子)	Winbond(华邦电子)

W25Q32BWSFIP

W25Q32BWSFIP概述

W25Q32BWSFIP规格参数

W25Q32BWSFIP相似产品对比

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