4M X 1 CONFIGURATION MEMORY, PQFP44
4M × 1 配置存储器, PQFP44
| 参数名称 | 属性值 |
| 是否无铅 | 不含铅 |
| 是否Rohs认证 | 符合 |
| 厂商名称 | Atmel (Microchip) |
| 零件包装代码 | QFP |
| 包装说明 | 10 X 10 MM, 1 MM HEIGHT, 0.80 MM PITCH, GREEN, PLASTIC, MS-026ACB, TQFP-44 |
| 针数 | 44 |
| Reach Compliance Code | unknow |
| ECCN代码 | EAR99 |
| Is Samacsys | N |
| 其他特性 | IT CAN OPERATES ON 4.75-5.25 RANGE SUPPLY VOLTAGE ALSO |
| 最大时钟频率 (fCLK) | 10 MHz |
| JESD-30 代码 | S-PQFP-G44 |
| JESD-609代码 | e3 |
| 长度 | 10 mm |
| 内存密度 | 4194304 bi |
| 内存集成电路类型 | CONFIGURATION MEMORY |
| 内存宽度 | 1 |
| 湿度敏感等级 | 3 |
| 功能数量 | 1 |
| 端子数量 | 44 |
| 字数 | 4194304 words |
| 字数代码 | 4000000 |
| 工作模式 | SYNCHRONOUS |
| 最高工作温度 | 85 °C |
| 最低工作温度 | -40 °C |
| 组织 | 4MX1 |
| 封装主体材料 | PLASTIC/EPOXY |
| 封装代码 | TQFP |
| 封装等效代码 | TQFP44,.47SQ,32 |
| 封装形状 | SQUARE |
| 封装形式 | FLATPACK, THIN PROFILE |
| 并行/串行 | SERIAL |
| 峰值回流温度（摄氏度） | 260 |
| 电源 | 3.3 V |
| 认证状态 | Not Qualified |
| 座面最大高度 | 1.2 mm |
| 最大待机电流 | 0.0001 A |
| 最大压摆率 | 0.005 mA |
| 最大供电电压 (Vsup) | 3.6 V |
| 最小供电电压 (Vsup) | 3 V |
| 标称供电电压 (Vsup) | 3.3 V |
| 表面贴装 | YES |
| 技术 | CMOS |
| 温度等级 | INDUSTRIAL |
| 端子面层 | Matte Tin (Sn) |
| 端子形式 | GULL WING |
| 端子节距 | 0.8 mm |
| 端子位置 | QUAD |
| 处于峰值回流温度下的最长时间 | 40 |
| 宽度 | 10 mm |
| 写保护 | HARDWARE |
| Base Number Matches | 1 |
| AT17LV040-10TQU | AT17LV002-10CU | AT17LV002-10JU | AT17LV010-10CU | AT17LV256-10CU | AT17LV256-10JU | AT17LV512-10CU | AT17LV512-10JU | |
|---|---|---|---|---|---|---|---|---|
| 描述 | 4M X 1 CONFIGURATION MEMORY, PQFP44 | 2M X 1 CONFIGURATION MEMORY, DSO8 | 2M X 1 CONFIGURATION MEMORY, PQCC20 | 1M X 1 CONFIGURATION MEMORY, DSO8 | 2M X 1 CONFIGURATION MEMORY, DSO8 | 256K X 1 CONFIGURATION MEMORY, PQCC20 | 512K X 1 CONFIGURATION MEMORY, DSO8 | 512K X 1 CONFIGURATION MEMORY, PQCC20 |
| 是否无铅 | 不含铅 | 不含铅 | 不含铅 | 不含铅 | 不含铅 | 不含铅 | 不含铅 | 不含铅 |
| 是否Rohs认证 | 符合 | 符合 | 符合 | 符合 | 符合 | 符合 | 符合 | 符合 |
| 零件包装代码 | QFP | SOIC | LPCC | SOIC | SOIC | LPCC | SOIC | LPCC |
| 包装说明 | 10 X 10 MM, 1 MM HEIGHT, 0.80 MM PITCH, GREEN, PLASTIC, MS-026ACB, TQFP-44 | SON, SOLCC8,.25 | QCCJ, LDCC20,.4SQ | SON, SOLCC8,.25 | SON, SOLCC8,.25 | QCCJ, LDCC20,.4SQ | SON, SOLCC8,.25 | QCCJ, LDCC20,.4SQ |
| 针数 | 44 | 8 | 20 | 8 | 8 | 20 | 8 | 20 |
| Reach Compliance Code | unknow | compli | unknow | compli | compli | unknow | compli | unknow |
| ECCN代码 | EAR99 | EAR99 | EAR99 | EAR99 | EAR99 | EAR99 | EAR99 | EAR99 |
| 其他特性 | IT CAN OPERATES ON 4.75-5.25 RANGE SUPPLY VOLTAGE ALSO | IT CAN OPERATES ON 4.75-5.25 RANGE SUPPLY VOLTAGE ALSO | IT CAN OPERATES ON 4.75-5.25 RANGE SUPPLY VOLTAGE ALSO | IT CAN OPERATES ON 4.75-5.25 RANGE SUPPLY VOLTAGE ALSO | IT CAN OPERATES ON 4.75-5.25 RANGE SUPPLY VOLTAGE ALSO | IT CAN OPERATES ON 4.75-5.25 RANGE SUPPLY VOLTAGE ALSO | IT CAN OPERATES ON 4.75-5.25 RANGE SUPPLY VOLTAGE ALSO | IT CAN OPERATES ON 4.75-5.25 RANGE SUPPLY VOLTAGE ALSO |
| 最大时钟频率 (fCLK) | 10 MHz | 10 MHz | 10 MHz | 10 MHz | 10 MHz | 10 MHz | 10 MHz | 10 MHz |
| JESD-30 代码 | S-PQFP-G44 | S-XDSO-N8 | S-PQCC-J20 | S-XDSO-N8 | S-XDSO-N8 | S-PQCC-J20 | S-XDSO-N8 | S-PQCC-J20 |
| JESD-609代码 | e3 | e4 | e3 | e4 | e4 | e3 | e4 | e3 |
| 长度 | 10 mm | 5.99 mm | 8.9662 mm | 5.99 mm | 5.99 mm | 8.9662 mm | 5.99 mm | 8.9662 mm |
| 内存密度 | 4194304 bi | 2097152 bi | 2097152 bi | 1048576 bi | 262144 bi | 262144 bi | 524288 bi | 524288 bi |
| 内存集成电路类型 | CONFIGURATION MEMORY | CONFIGURATION MEMORY | CONFIGURATION MEMORY | CONFIGURATION MEMORY | CONFIGURATION MEMORY | CONFIGURATION MEMORY | CONFIGURATION MEMORY | CONFIGURATION MEMORY |
| 内存宽度 | 1 | 1 | 1 | 1 | 1 | 1 | 1 | 1 |
| 湿度敏感等级 | 3 | 3 | 2 | 3 | 3 | 2 | 3 | 2 |
| 功能数量 | 1 | 1 | 1 | 1 | 1 | 1 | 1 | 1 |
| 端子数量 | 44 | 8 | 20 | 8 | 8 | 20 | 8 | 20 |
| 字数 | 4194304 words | 2097152 words | 2097152 words | 1048576 words | 262144 words | 262144 words | 524288 words | 524288 words |
| 字数代码 | 4000000 | 2000000 | 2000000 | 1000000 | 256000 | 256000 | 512000 | 512000 |
| 工作模式 | SYNCHRONOUS | SYNCHRONOUS | SYNCHRONOUS | SYNCHRONOUS | SYNCHRONOUS | SYNCHRONOUS | SYNCHRONOUS | SYNCHRONOUS |
| 最高工作温度 | 85 °C | 85 °C | 85 °C | 85 °C | 85 °C | 85 °C | 85 °C | 85 °C |
| 最低工作温度 | -40 °C | -40 °C | -40 °C | -40 °C | -40 °C | -40 °C | -40 °C | -40 °C |
| 组织 | 4MX1 | 2MX1 | 2MX1 | 1MX1 | 256KX1 | 256KX1 | 512KX1 | 512KX1 |
| 封装主体材料 | PLASTIC/EPOXY | UNSPECIFIED | PLASTIC/EPOXY | UNSPECIFIED | UNSPECIFIED | PLASTIC/EPOXY | UNSPECIFIED | PLASTIC/EPOXY |
| 封装代码 | TQFP | SON | QCCJ | SON | SON | QCCJ | SON | QCCJ |
| 封装等效代码 | TQFP44,.47SQ,32 | SOLCC8,.25 | LDCC20,.4SQ | SOLCC8,.25 | SOLCC8,.25 | LDCC20,.4SQ | SOLCC8,.25 | LDCC20,.4SQ |
| 封装形状 | SQUARE | SQUARE | SQUARE | SQUARE | SQUARE | SQUARE | SQUARE | SQUARE |
| 封装形式 | FLATPACK, THIN PROFILE | SMALL OUTLINE | CHIP CARRIER | SMALL OUTLINE | SMALL OUTLINE | CHIP CARRIER | SMALL OUTLINE | CHIP CARRIER |
| 并行/串行 | SERIAL | SERIAL | SERIAL | SERIAL | SERIAL | SERIAL | SERIAL | SERIAL |
| 峰值回流温度（摄氏度） | 260 | 260 | 245 | 260 | 260 | NOT SPECIFIED | 260 | 245 |
| 电源 | 3.3 V | 3.3/5 V | 3.3/5 V | 3.3/5 V | 3.3 V | 3.3 V | 3.3/5 V | 3.3 V |
| 认证状态 | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified |
| 座面最大高度 | 1.2 mm | 1.14 mm | 4.572 mm | 1.14 mm | 1.14 mm | 4.572 mm | 1.14 mm | 4.572 mm |
| 最大压摆率 | 0.005 mA | 0.01 mA | 0.01 mA | 0.01 mA | 0.005 mA | 0.005 mA | 0.01 mA | 0.005 mA |
| 最大供电电压 (Vsup) | 3.6 V | 3.6 V | 3.6 V | 3.6 V | 3.6 V | 3.6 V | 3.6 V | 3.6 V |
| 最小供电电压 (Vsup) | 3 V | 3 V | 3 V | 3 V | 3 V | 3 V | 3 V | 3 V |
| 标称供电电压 (Vsup) | 3.3 V | 3.3 V | 3.3 V | 3.3 V | 3.3 V | 3.3 V | 3.3 V | 3.3 V |
| 表面贴装 | YES | YES | YES | YES | YES | YES | YES | YES |
| 技术 | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS |
| 温度等级 | INDUSTRIAL | INDUSTRIAL | INDUSTRIAL | INDUSTRIAL | INDUSTRIAL | INDUSTRIAL | INDUSTRIAL | INDUSTRIAL |
| 端子面层 | Matte Tin (Sn) | Copper/Nickel/Gold (Cu/Ni/Au) | Matte Tin (Sn) | Gold (Au) - with Nickel (Ni) barrie | Copper/Nickel/Gold (Cu/Ni/Au) | Matte Tin (Sn) | Copper/Nickel/Gold (Cu/Ni/Au) | Matte Tin (Sn) |
| 端子形式 | GULL WING | NO LEAD | J BEND | NO LEAD | NO LEAD | J BEND | NO LEAD | J BEND |
| 端子节距 | 0.8 mm | 1.27 mm | 1.27 mm | 1.27 mm | 1.27 mm | 1.27 mm | 1.27 mm | 1.27 mm |
| 端子位置 | QUAD | DUAL | QUAD | DUAL | DUAL | QUAD | DUAL | QUAD |
| 处于峰值回流温度下的最长时间 | 40 | 40 | 40 | 40 | 40 | NOT SPECIFIED | 40 | 40 |
| 宽度 | 10 mm | 5.99 mm | 8.9662 mm | 5.99 mm | 5.99 mm | 8.9662 mm | 5.99 mm | 8.9662 mm |
| 厂商名称 | Atmel (Microchip) | Atmel (Microchip) | Atmel (Microchip) | Atmel (Microchip) | Atmel (Microchip) | - | Atmel (Microchip) | - |
| 最大待机电流 | 0.0001 A | 0.00015 A | 0.00015 A | - | 0.0001 A | 0.0001 A | 0.0001 A | - |
电子工程世界版权所有
京B2-20211791
京ICP备10001474号-1
电信业务审批[2006]字第258号函
京公网安备 11010802033920号
Copyright © 2005-2024 EEWORLD.com.cn, Inc. All rights reserved
电子工程世界
