ANT-2.45-CHP-x
2.45GHz ULTRA COMPACT CHIP ANTENNA DATA GUIDE
DESCRIPTION
The exciting ANT-2.45-CHP is of the one of the
world’s smallest, high-performance 2.4 Ghz Chip
Antennas. It is ideal for all 2.4GHz applications
including Bluetooth, 802.11, home RF, ZigBee
and other popular and emerging standards. The
antenna uses an advanced multilayer LTCC
Technology and a proprietary hybrid spiral
element to achieve size and performance
characteristics superior to other designs. The
incredibly compact SMD package measures a
mere 6.5mm (L) x 2.2mm (W) x 1.0mm (H) and
is fully compatible with hand- and reflow-
attachment processes. The antenna's favorable
electrical specifications, stability and cost-
effectiveness make it the logical choice for a
wide variety of applications.
PHYSICAL DIMENSIONS
2.4
1.0mm
0.4mm
6.5mm
2.2mm
Actual Size
Pad Layout
0.260"
0.100"
0.040"
FEATURES
■
■
■
■
■
■
■
Incredibly Compact SMD Package
Superior LTCC Technology
50Ω Characteristic Impedance
Low Loss
Wide Bandwidth
Favorable Linear Polarization
> Unity Gain
■
■
■
■
No External Matching Required
Highly Stable Over Temp. and
Humidity
Fully Hand- and Reflow-Assembly
Compatible
Cost-Effective
APPLICATIONS
Any 2.4GHz Wireless Product Including:
■
Bluetooth
■
802.11
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ZigBee
■
Wireless PCMCIA Cards
■
Telemetry
■
Data Collection
■
Industrial Process Monitoring
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Compact Wireless Products
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External Antenna Elimination
ORDERING INFORMATION
PART #
ANT-2.45-CHP-x
DESCRIPTION
2.45GHz Ultra-Compact
Chip Antenna
x= "T" for Tape/Reel, "B" for Bulk
Standard Reel is 3,000 pcs. Quantities less
than 3,000 pcs. supplied in Bulk.
Revised 5/2/03
SPECIFICATIONS
PHYSICAL SPECIFICATIONS
Dimensions
6.5 x 2.2 x 1.0
Operating Temperature
-25~85°C
Construction
LTCC
ELECTRICAL PERFORMANCE
Polarization
Linear
Operating Frequency
2,400~2,488
Center Frequency
2,450 MHz
Bandwidth
180.0 MHz
Maximum Gain
0.8dBi
Impedance
50Ω
CHARACTERISTICS
Impedance
Return Loss
Radiation Pattern
0
0
-10
-20
-30
300
60
2.4
[deg.]
30
330
E_pl.(y-x)
H_pl.(x-z)
ref Dipole
y
dB
-40
-30
-20
-10
0
270
90
x
z
240
120
210
180
150
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SOLDERING CONSIDERATIONS
Hand Soldering
This antenna is designed for high-volume automated assembly, however, it may be
successfully attached by hand assembly techniques. A hand-solder temperature of
225° or lower should be used. Do not exceed a 10 sec. heating time.
Reflow Temperature Profile
The single most critical stage in the automated assembly process is the reflow
process. The reflow profile below should be closely followed since excessive
temperatures or transport times during reflow will irreparably damage the antennas.
Assembly personnel will need to pay careful attention to the oven's profile to insure
that it meets the requirements necessary to successfully reflow all components while
still meeting the limits mandated by the antennas themselves.
REFLOW SOLDERING PROFILE
preheating
100sec max
230
°C
soldering
10sec max
cooling
60sec min
200
°C
20sec min
150
°C
60sec min
FLOW SOLDERING PROFILE
preheating
100sec
dipping
2
±0.5sec
cooling
60sec min
235¡ C
150¡ C
60sec min
Page 3
U.S. CORPORATE HEADQUARTERS:
LINX TECHNOLOGIES, INC.
575 S.E. ASHLEY PLACE
GRANTS PASS, OR 97526
Phone: (541) 471-6256
FAX: (541) 471-6251
http://www.linxtechnologies.com
Disclaimer
Linx Technologies is continually striving to improve the quality and function of its products; for
this reason, we reserve the right to make changes without notice. The information contained in
this Data Sheet is believed to be accurate as of the time of publication. Specifications are based
on representative lot samples. Values may vary from lot to lot and are not guaranteed. Linx
Technologies makes no guarantee, warranty, or representation regarding the suitability of any
product for use in a specific application. None of these devices is intended for use in
applications of a critical nature where the safety of life or property is at risk. The user assumes
full liability for the use of product in such applications. Under no conditions will Linx Technologies
be responsible for losses arising from the use or failure of the device in any application, other
than the repair, replacement, or refund limited to the original product purchase price. Some
devices described in this publication are patented. Under no circumstances shall any user be
conveyed any license or right to the use or ownership of these patents.
© 2002 by Linx Technologies, Inc. The stylized
Linx logo, Linx, and “Wireless Made Simple”
are the trademarks of Linx Technologies, Inc.
Printed in U.S.A.
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