HPC0402A
Vishay
High Performance, High Precision
Surface Mount 0402 Capacitor
FEATURES
∑
New technology surface mount capacitor based on a
special semiconductor process
∑
Construction reduces the parasitic inductance and brings
the SRF values to ultra-high frequencies
∑
Capacitance is extremely stable in a wide range of
frequencies from 1 MHz to several GHz.
∑
High Q and low ESR
∑
Tight tolerance to ± 1 % or 0.05 pF
∑
Ultra high SRF
∑
Low parasitic inductance ( ~ 0.032nH)
PATENTED
∑
Capacitance range : 0.1 pF to 180 pF
∑
Lead (Pb)-free solder available
ELECTRICAL SPECIFICATIONS
Operating Temperature:
- 55 °C to + 125 °C
Temperature Coefficient
of Capacitance (TCC):
0 ± 30 ppm/°C
Insulation Resistance:
Voltage:
Ageing:
10
11
W
min
2.5 x rated voltage for 5 seconds
none
APPLICATIONS
∑
Wireless communications
∑
Mobile phones
∑
Cordless phones
∑
GPS
∑
VCO
∑
Filter Networks
∑
Matching Networks
ENVIRONMENTAL SPECIFICATIONS
Life Test:
Thermal Shock:
Moisture Resistance:
1000 hours, + 125 °C at
2 x rated voltage
100 Cycles, - 55 °C/+ 125 °C
240 hours, 85 % RH, + 85 °C
CAPACITANCE TOLERANCE CODE
FOR LESS THAN 10 pF
A
B
C
± 0.05 pF ± 0.10 pF ± 0.25 pF
FOR 10 pF AND HIGHER
F
±1%
G
±2%
J
±5%
ORDERING INFORMATION
HPC
MODEL
0402
SIZE
A
TYPE
100
CAPACITANCE VALUE
G
CAPACITANCE
TOLERANCE
see chart above
X
TERMINATION
X
VOLTAGE
T
PACKAGING
The first two digits are
significant, the third is a
multiplier. An “R”
indicates a decimal point.
Examples: 101 = 100 pF
4R7 = 4.7 pF
X = Tin/Lead
termination
1=6V
Z = 10 V
Y = 16 V
X = 25 V
M = 50V
T = 10000 pcs
T5 = 5000 pcs
T1 = 1000 pcs
tape and reel
For Lead (Pb)-free solder please contact factory.
Document Number: 10117
Revision: 12-Oct-04
For technical questions, contact siliconRFcap@vishay.com
www.vishay.com
9
General Information
Vishay
Silicon Chip RF Capacitors
DESIGN OBJECTIVES AND CONSTRUCTION
DETAILS
Over the past two decades, semiconductor production has
been greatly refined in materials, processes, producibility,
cost reduction, repeatability, reliability, and simplicity. In
contrast, there have been few significant innovative
advances in passive component, so the search for a
significant advance in a high Q, high frequency capacitor
centered on the semiconductor processes instead of the
traditional capacitor processes. The final product yields a
true RF capacitor with a ten-fold increase in capacitance
density based on simple, low cost, high reliability
semiconductor processes, and on materials economically
available throughout the world.
CAPACITANCE VS. SIZE VS. TECHNOLOGY, AS
OFFERED BY LEADING MANUFACTURERS OF
PRECISION RF CAPACITORS.
LTCC - 0402
LTCC - 0603
LTCC - 0805
Thin Film - 0402
Thin Film - 0603
Thin Film - 0805
Thin Film - 1210
HPC0402
0
50
100
150
200
250
Capacitance (pF)
Graph 1
HPC silicon capacitor, Si/SiO2 integrated semiconductor process
Thin Film capacitor, deposited SiO2 on ceramic
LTCC, multi-layer chip capacitor
Solder
Passivation
Conductor
SiO2
Si
CONFIGURATION/MECHANICAL EFFECTS
The wraparound terminations of the standard chip
configuration reduce the resistance in the terminations, but
they add inductance at the same time. They also require
more board space than necessary. An 0402 size chip
requires 25 to 45 % greater length than the actual chip for the
mounting pads, depending on the manufacturer’s
recommendations. Additionally, there is a tendency for
wraparound terminations to tip up on one end during board
assembly when the solder at each end either melts or
solidifies unevenly, an effect known as “tombstoning” (See
Figure 2).
M1
Figure 1
Figure 1 shows a cross-sectional drawing of the HPC0402
capacitor. In this configuration, the high-conductivity silicon
forms the base plate of the capacitor. A proprietary process
forms a void-free silicon dioxide dielectric that is very thin (in
the order of 0.05 to 3 microns depending upon capacitance),
very uniform (variation of less than 0.4 % across a wafer for
10 pF), and very repeatable (less than 1 % variation from lot
to lot.) This makes it possible to produce tight tolerance
capacitors without trimming. This is highly desirable because
trimming changes the high frequency characteristics of the
capacitor. That is, the same capacitance value, in the same
capacitance tolerance, in the same capacitor model, from the
same capacitor manufacturer will have different RF
performance from lot to lot, but not with the HPC Silicon
Capacitor.
Graph 1 compares the integrated HPC0402 silicon capacitor
to other leading RF capacitor technologies.
T3
T1
T2
T3
T2
Figure 2
T1 = Surface tension of liquid solder
T2 = Tack force of solder paste
T3 = Weight of the chip
M1= Moment lifts chip upright
Tombstoning requires costly off-line testing and rework to
correct the problems. If only 0.5% of the mounted
components exhibit this behavior, and there are 10
components per board, then approximately 5 % of the boards
will need rework.
Document Number: 10132
Revision: 12-Oct-04
www.vishay.com
2
For technical questions, contact siliconRFcap@vishay.com
FPGA/CPLD
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