SNJ54LS222AFK
| 参数名称 | 属性值 |
| 是否Rohs认证 | 不符合 |
| 厂商名称 | Texas Instruments(德州仪器) |
| 包装说明 | QCCN, LCC(UNSPEC) |
| Reach Compliance Code | _compli |
| 内存集成电路类型 | OTHER FIFO |
| 内存宽度 | 4 |
| 字数 | 16 words |
| 字数代码 | 16 |
| 工作模式 | ASYNCHRONOUS |
| 最高工作温度 | 125 °C |
| 最低工作温度 | -55 °C |
| 组织 | 16X4 |
| 封装主体材料 | CERAMIC |
| 封装代码 | QCCN |
| 封装等效代码 | LCC(UNSPEC) |
| 封装形式 | CHIP CARRIER |
| 电源 | 5 V |
| 认证状态 | Not Qualified |
| 筛选级别 | 38535Q/M;38534H;883B |
| 标称供电电压 (Vsup) | 5 V |
| 表面贴装 | YES |
| 技术 | TTL |
| 温度等级 | MILITARY |
| 端子形式 | NO LEAD |
| 端子位置 | QUAD |
| SNJ54LS222AFK | SN74LS222N1 | SN74LS222NP1 | SNC54LS222J | SNJ54LS222FK | SNJ54LS222W | |
|---|---|---|---|---|---|---|
| 描述 | SNJ54LS222AFK | IC,FIFO,16X4,ASYNCHRONOUS,LS-TTL,DIP,20PIN,PLASTIC | IC,FIFO,16X4,ASYNCHRONOUS,LS-TTL,DIP,20PIN,PLASTIC | IC,FIFO,16X4,ASYNCHRONOUS,LS-TTL,DIP,20PIN,CERAMIC | IC,FIFO,16X4,ASYNCHRONOUS,LS-TTL,LLCC,CERAMIC | IC,FIFO,16X4,ASYNCHRONOUS,LS-TTL,FP,20PIN,CERAMIC |
| 是否Rohs认证 | 不符合 | 不符合 | 不符合 | 不符合 | 不符合 | 不符合 |
| 厂商名称 | Texas Instruments(德州仪器) | Texas Instruments(德州仪器) | Texas Instruments(德州仪器) | Texas Instruments(德州仪器) | Texas Instruments(德州仪器) | Texas Instruments(德州仪器) |
| 包装说明 | QCCN, LCC(UNSPEC) | DIP, DIP20,.3 | DIP, DIP20,.3 | DIP, DIP20,.3 | QCCN, LCC(UNSPEC) | DFP, FL20,.3 |
| Reach Compliance Code | _compli | not_compliant | not_compliant | _compli | _compli | _compli |
| 内存集成电路类型 | OTHER FIFO | OTHER FIFO | OTHER FIFO | OTHER FIFO | OTHER FIFO | OTHER FIFO |
| 内存宽度 | 4 | 4 | 4 | 4 | 4 | 4 |
| 字数 | 16 words | 16 words | 16 words | 16 words | 16 words | 16 words |
| 字数代码 | 16 | 16 | 16 | 16 | 16 | 16 |
| 工作模式 | ASYNCHRONOUS | ASYNCHRONOUS | ASYNCHRONOUS | ASYNCHRONOUS | ASYNCHRONOUS | ASYNCHRONOUS |
| 最高工作温度 | 125 °C | 70 °C | 70 °C | 125 °C | 125 °C | 125 °C |
| 最低工作温度 | -55 °C | - | - | -55 °C | -55 °C | -55 °C |
| 组织 | 16X4 | 16X4 | 16X4 | 16X4 | 16X4 | 16X4 |
| 封装主体材料 | CERAMIC | PLASTIC/EPOXY | PLASTIC/EPOXY | CERAMIC | CERAMIC | CERAMIC |
| 封装代码 | QCCN | DIP | DIP | DIP | QCCN | DFP |
| 封装等效代码 | LCC(UNSPEC) | DIP20,.3 | DIP20,.3 | DIP20,.3 | LCC(UNSPEC) | FL20,.3 |
| 封装形式 | CHIP CARRIER | IN-LINE | IN-LINE | IN-LINE | CHIP CARRIER | FLATPACK |
| 电源 | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V |
| 认证状态 | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified |
| 标称供电电压 (Vsup) | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V |
| 表面贴装 | YES | NO | NO | NO | YES | YES |
| 技术 | TTL | TTL | TTL | TTL | TTL | TTL |
| 温度等级 | MILITARY | COMMERCIAL | COMMERCIAL | MILITARY | MILITARY | MILITARY |
| 端子形式 | NO LEAD | THROUGH-HOLE | THROUGH-HOLE | THROUGH-HOLE | NO LEAD | FLAT |
| 端子位置 | QUAD | DUAL | DUAL | DUAL | QUAD | DUAL |
| 筛选级别 | 38535Q/M;38534H;883B | - | - | MIL-STD-883 Class B (Modified) | 38535Q/M;38534H;883B | 38535Q/M;38534H;883B |
| JESD-30 代码 | - | R-PDIP-T20 | R-PDIP-T20 | R-XDIP-T20 | - | R-XDFP-F20 |
| 端子数量 | - | 20 | 20 | 20 | - | 20 |
| 封装形状 | - | RECTANGULAR | RECTANGULAR | RECTANGULAR | - | RECTANGULAR |
| 端子节距 | - | 2.54 mm | 2.54 mm | 2.54 mm | - | 1.27 mm |
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