Low latency 10/100-Mbps PHY, MII interface and enhanced mode with an industrial temperature range 32-VQFN -40 to 85
参数名称 | 属性值 |
Brand Name | Texas Instruments |
是否无铅 | 不含铅 |
是否Rohs认证 | 符合 |
厂商名称 | Texas Instruments(德州仪器) |
包装说明 | HVQCCN, LCC32,.2SQ,20 |
Reach Compliance Code | compli |
ECCN代码 | EAR99 |
Factory Lead Time | 12 weeks |
Date Of I | 2020-03-30 |
Samacsys Descripti | LOW COST ENET PHY INDUSTRIAL |
JESD-30 代码 | S-PQCC-N32 |
JESD-609代码 | e4 |
长度 | 5 mm |
湿度敏感等级 | 2 |
功能数量 | 1 |
端子数量 | 32 |
收发器数量 | 1 |
最高工作温度 | 85 °C |
最低工作温度 | -40 °C |
封装主体材料 | PLASTIC/EPOXY |
封装代码 | HVQCCN |
封装等效代码 | LCC32,.2SQ,20 |
封装形状 | SQUARE |
封装形式 | CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE |
座面最大高度 | 1 mm |
最大压摆率 | 53 mA |
标称供电电压 | 3.3 V |
表面贴装 | YES |
电信集成电路类型 | ETHERNET TRANSCEIVER |
温度等级 | INDUSTRIAL |
端子面层 | Nickel/Palladium/Gold (Ni/Pd/Au) |
端子形式 | NO LEAD |
端子节距 | 0.5 mm |
端子位置 | QUAD |
宽度 | 5 mm |
DP83826IRHBR | DP83826ERHBR | DP83826ERHBT | DP83826IRHBT | |
---|---|---|---|---|
描述 | Low latency 10/100-Mbps PHY, MII interface and enhanced mode with an industrial temperature range 32-VQFN -40 to 85 | Low latency 10/100-Mbps PHY with MII interface and enhanced mode 32-VQFN -40 to 105 | Low latency 10/100-Mbps PHY with MII interface and enhanced mode 32-VQFN -40 to 105 | Low latency 10/100-Mbps PHY, MII interface and enhanced mode with an industrial temperature range 32-VQFN -40 to 85 |
Brand Name | Texas Instruments | Texas Instruments | Texas Instruments | Texas Instruments |
是否无铅 | 不含铅 | 不含铅 | 不含铅 | 不含铅 |
是否Rohs认证 | 符合 | 符合 | 符合 | 符合 |
厂商名称 | Texas Instruments(德州仪器) | Texas Instruments(德州仪器) | Texas Instruments(德州仪器) | Texas Instruments(德州仪器) |
包装说明 | HVQCCN, LCC32,.2SQ,20 | HVQCCN, LCC32,.2SQ,20 | HVQCCN, LCC32,.2SQ,20 | HVQCCN, LCC32,.2SQ,20 |
Reach Compliance Code | compli | compli | compli | compli |
Factory Lead Time | 12 weeks | 6 weeks | 6 weeks | 12 weeks |
JESD-30 代码 | S-PQCC-N32 | S-PQCC-N32 | S-PQCC-N32 | S-PQCC-N32 |
JESD-609代码 | e4 | e4 | e4 | e4 |
长度 | 5 mm | 5 mm | 5 mm | 5 mm |
湿度敏感等级 | 2 | 2 | 2 | 2 |
功能数量 | 1 | 1 | 1 | 1 |
端子数量 | 32 | 32 | 32 | 32 |
收发器数量 | 1 | 1 | 1 | 1 |
最高工作温度 | 85 °C | 105 °C | 105 °C | 85 °C |
最低工作温度 | -40 °C | -40 °C | -40 °C | -40 °C |
封装主体材料 | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY |
封装代码 | HVQCCN | HVQCCN | HVQCCN | HVQCCN |
封装等效代码 | LCC32,.2SQ,20 | LCC32,.2SQ,20 | LCC32,.2SQ,20 | LCC32,.2SQ,20 |
封装形状 | SQUARE | SQUARE | SQUARE | SQUARE |
封装形式 | CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE | CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE | CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE | CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE |
座面最大高度 | 1 mm | 1 mm | 1 mm | 1 mm |
标称供电电压 | 3.3 V | 3.3 V | 3.3 V | 3.3 V |
表面贴装 | YES | YES | YES | YES |
电信集成电路类型 | ETHERNET TRANSCEIVER | ETHERNET TRANSCEIVER | ETHERNET TRANSCEIVER | ETHERNET TRANSCEIVER |
温度等级 | INDUSTRIAL | INDUSTRIAL | INDUSTRIAL | INDUSTRIAL |
端子面层 | Nickel/Palladium/Gold (Ni/Pd/Au) | Nickel/Palladium/Gold (Ni/Pd/Au) | Nickel/Palladium/Gold (Ni/Pd/Au) | Nickel/Palladium/Gold (Ni/Pd/Au) |
端子形式 | NO LEAD | NO LEAD | NO LEAD | NO LEAD |
端子节距 | 0.5 mm | 0.5 mm | 0.5 mm | 0.5 mm |
端子位置 | QUAD | QUAD | QUAD | QUAD |
宽度 | 5 mm | 5 mm | 5 mm | 5 mm |
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