IC RISC PROCESSOR, Microprocessor
参数名称 | 属性值 |
厂商名称 | Texas Instruments(德州仪器) |
包装说明 | FBGA, |
Reach Compliance Code | unknow |
地址总线宽度 | 16 |
边界扫描 | YES |
外部数据总线宽度 | 64 |
格式 | FLOATING POINT |
集成缓存 | YES |
JESD-30 代码 | S-PBGA-B1089 |
长度 | 27 mm |
低功率模式 | YES |
端子数量 | 1089 |
最高工作温度 | 85 °C |
最低工作温度 | |
封装主体材料 | PLASTIC/EPOXY |
封装代码 | FBGA |
封装形状 | SQUARE |
封装形式 | GRID ARRAY, FINE PITCH |
座面最大高度 | 3.55 mm |
速度 | 1250 MHz |
最大供电电压 | 0.997 V |
最小供电电压 | 0.902 V |
标称供电电压 | 0.95 V |
表面贴装 | YES |
技术 | CMOS |
温度等级 | OTHER |
端子形式 | BALL |
端子节距 | 0.8 mm |
端子位置 | BOTTOM |
宽度 | 27 mm |
uPs/uCs/外围集成电路类型 | MICROPROCESSOR, RISC |
AM5K2E02SABD25 | AM5K2E02DABD25 | AM5K2E02DABDA25 | AM5K2E02SABDA25 | AM5K2E02XABDA25 | AM5K2E04ABD4 | |
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描述 | IC RISC PROCESSOR, Microprocessor | IC RISC PROCESSOR, Microprocessor | IC RISC PROCESSOR, Microprocessor | IC RISC PROCESSOR, Microprocessor | IC RISC PROCESSOR, Microprocessor | IC RISC PROCESSOR, Microprocessor |
厂商名称 | Texas Instruments(德州仪器) | Texas Instruments(德州仪器) | Texas Instruments(德州仪器) | Texas Instruments(德州仪器) | Texas Instruments(德州仪器) | Texas Instruments(德州仪器) |
包装说明 | FBGA, | FBGA, | FBGA, | FBGA, | FBGA, | FBGA, |
Reach Compliance Code | unknow | unknow | unknow | unknow | unknow | unknow |
地址总线宽度 | 16 | 16 | 16 | 16 | 16 | 16 |
边界扫描 | YES | YES | YES | YES | YES | YES |
外部数据总线宽度 | 64 | 64 | 64 | 64 | 64 | 64 |
格式 | FLOATING POINT | FLOATING POINT | FLOATING POINT | FLOATING POINT | FLOATING POINT | FLOATING POINT |
集成缓存 | YES | YES | YES | YES | YES | YES |
JESD-30 代码 | S-PBGA-B1089 | S-PBGA-B1089 | S-PBGA-B1089 | S-PBGA-B1089 | S-PBGA-B1089 | S-PBGA-B1089 |
长度 | 27 mm | 27 mm | 27 mm | 27 mm | 27 mm | 27 mm |
低功率模式 | YES | YES | YES | YES | YES | YES |
端子数量 | 1089 | 1089 | 1089 | 1089 | 1089 | 1089 |
封装主体材料 | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY |
封装代码 | FBGA | FBGA | FBGA | FBGA | FBGA | FBGA |
封装形状 | SQUARE | SQUARE | SQUARE | SQUARE | SQUARE | SQUARE |
封装形式 | GRID ARRAY, FINE PITCH | GRID ARRAY, FINE PITCH | GRID ARRAY, FINE PITCH | GRID ARRAY, FINE PITCH | GRID ARRAY, FINE PITCH | GRID ARRAY, FINE PITCH |
座面最大高度 | 3.55 mm | 3.55 mm | 3.55 mm | 3.55 mm | 3.55 mm | 3.55 mm |
速度 | 1250 MHz | 1250 MHz | 1250 MHz | 1250 MHz | 1250 MHz | 1400 MHz |
最大供电电压 | 0.997 V | 0.997 V | 0.997 V | 0.997 V | 0.997 V | 0.997 V |
最小供电电压 | 0.902 V | 0.902 V | 0.902 V | 0.902 V | 0.902 V | 0.902 V |
标称供电电压 | 0.95 V | 0.95 V | 0.95 V | 0.95 V | 0.95 V | 0.95 V |
表面贴装 | YES | YES | YES | YES | YES | YES |
技术 | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS |
端子形式 | BALL | BALL | BALL | BALL | BALL | BALL |
端子节距 | 0.8 mm | 0.8 mm | 0.8 mm | 0.8 mm | 0.8 mm | 0.8 mm |
端子位置 | BOTTOM | BOTTOM | BOTTOM | BOTTOM | BOTTOM | BOTTOM |
宽度 | 27 mm | 27 mm | 27 mm | 27 mm | 27 mm | 27 mm |
uPs/uCs/外围集成电路类型 | MICROPROCESSOR, RISC | MICROPROCESSOR, RISC | MICROPROCESSOR, RISC | MICROPROCESSOR, RISC | MICROPROCESSOR, RISC | MICROPROCESSOR, RISC |
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