TSP10U60S
Taiwan Semiconductor
10A, 60V Trench Schottky Rectifier
FEATURES
- Patented Trench Schottky technology
- Excellent high temperature stability
- Low forward voltage
- Lower power loss/ high efficiency
- High forward surge capability
- Ideal for automated placement
- Compliant to RoHS Directive 2011/65/EU and
in accordance to WEEE 2002/96/EC
- Halogen-free according to IEC 61249-2-21 definition
TO-277A (SMPC)
MECHANICAL DATA
Case:
TO-277A (SMPC)
Molding compound, UL flammability classification rating 94V-0
Moisture sensitivity level: level 1, per J-STD-020
Packing code with suffix "G" means green compound (halogen-free)
Terminal:
Matte tin plated leads, solderable per JESD22-B102
Meet JESD 201 class 2 whisker test
Polarity:
Indicated by cathode band
Weight:
0.095g (approximately)
MAXIMUM RATINGS AND ELECTRICAL CHARACTERISTICS
(T
A
=25°C unless otherwise noted)
PARAMETER
Marking code
Maximum repetitive peak reverse voltage
Maximum average forward rectified current
Peak forward surge current, 8.3 ms single half sine-wave
superimposed on rated load
Maximum instantaneous forward voltage
(Note 1)
Maximum instantaneous reverse current
at rated reverse voltage
Maximum DC reverse voltage
Typical thermal resistance
Operating junction temperature range
Storage temperature range
Note 1: Pulse Test with Pulse Width=300
μs,
1% Duty Cycle
I
F
= 5A
I
F
= 10A
I
F
= 10A
V
RRM
I
F(AV)
I
FSM
MIN
T
J
= 25°C
T
J
= 125°C
T
J
= 25°C
T
J
= 125°C
I
R
V
DC
R
θJL
T
J
T
STG
V
F
-
-
-
-
-
SYMBOL
TSP10U60S
10U60
60
10
280
TYP
0.40
0.47
0.43
80
-
42
5
- 55 to +150
- 55 to +150
MAX
-
0.54
0.47
300
100
μA
mA
V
°C/W
°C
°C
V
V
A
A
UNIT
Document Number: DS_D1411029
Version: E15
TSP10U60S
Taiwan Semiconductor
ORDERING INFORMATION
PART NO.
TSP10U60S
PACKING CODE
S1
S2
PACKING CODE
SUFFIX
G
PACKAGE
SMPC
SMPC
PACKING
1,500/ 7" Plastic reel
6,000/ 13" Plastic reel
Note: Whole series with green compound
EXAMPLE
PREFERRED
PART NO.
TSP10U60S S1G
PART NO.
TSP10U60S
PACKING CODE
S1
PACKING CODE
SUFFIX
G
DESCRIPTION
Green compound
RATINGS AND CHARACTERISTICS CURVES
(T
A
=25
o
C unless otherwise noted)
FIG.1 FORWARD CURRENT DERATING CURVE
20
INSTANTANEOUS FORWARD CURRENT (A)
FIG. 2 TYPICAL FORWARD CHARACTERISTICS
100
AVERAGE FORWARD CURRENT (A)
15
10
T
J
=150
o
C
T
J
=125
o
C
10
1
T
J
=100
o
C
0.1
T
J
=85
o
C
T
J
=25
o
C
0.01
0
0.1
0.2
0.3
0.4
0.5
0.6
FORWARD VOLTAGE (V)
5
WITH HEATSINK
30mm x 30mm 4 oz.
pad PCB
0
0
25
50
75
100
125
150
LEAD TEMPERATURE (
o
C)
FIG. 3 TYPICAL REVERSE CHARACTERISTICS
100
INSTANTANEOUS REVERSE CURRENT (mA)
FIG. 4 TYPICAL JUNCTION CAPACITANCE
10000
T
J
=150
o
C
10
T
J
=125
o
C
T
J
=100
o
C
CAPACITANCE (pF)
1
T
J
=85
o
C
1000
0.1
T
J
=25
o
C
f=1.0MHz
V
sig
=50mV
p-p
0.01
10
20
30
40
50
60
70
80
90
100
PERCENT OF RATED PEAK REVERSE VOLTAGE.(%)
100
0.1
1
10
REVERSE VOLTAGE (V)
100
Document Number: DS_D1411029
Version: E15
TSP10U60S
Taiwan Semiconductor
FIG. 5 MAXIMUM NON-REPETITIVE FORWARD
SURGE CURRENT
300
PEAK FORWARD SURGE CURRENT (A)
270
240
210
180
150
120
90
60
30
0
1
8.3ms Single Half Sine Wave
NUMBER OF CYCLES AT 60 Hz
10
100
Document Number: DS_D1411029
Version: E15
TSP10U60S
Taiwan Semiconductor
PACKAGE OUTLINE DIMENSIONS
TO-277A (SMPC)
DIM.
A
B
C
D
E
F
G
H
I
J
K
L
Unit (mm)
Min
5.650
6.350
4.550
3.540
4.235
1.850
3.170
1.043
1.000
1.930
0.175
1.000
Max
5.750
6.650
4.650
3.840
4.535
2.150
3.470
1.343
1.300
2.230
0.325
1.200
Unit (inch)
Min
0.222
0.250
0.179
0.139
0.167
0.073
0.125
0.041
0.039
0.076
0.007
0.039
Max
0.226
0.262
0.183
0.151
0.179
0.085
0.137
0.053
0.051
0.088
0.013
0.047
SUGGESTED PAD LAYOUT
Symbol
A
B
C
D
E
F
Unit (mm)
4.80
4.72
1.40
1.27
6.80
1.04
Unit (inch)
0.189
0.186
0.055
0.050
0.268
0.041
MARKING DIAGRAM
P/N
YW
F
= Marking Code
= Date Code
= Factory Code
Document Number: DS_D1411029
Version: E15
TSP10U60S
Taiwan Semiconductor
CREAT BY ART
Notice
Specifications of the products displayed herein are subject to change without notice. TSC or anyone on its behalf,
assumes no responsibility or liability for any errors or inaccuracies.
Information contained herein is intended to provide a product description only. No license, express or implied, to
any intellectual property rights is granted by this document. Except as provided in TSC's terms and conditions of
sale for such products, TSC assumes no liability whatsoever, and disclaims any express or implied warranty,
relating to sale and/or use of TSC products including liability or warranties relating to fitness for a particular purpose,
merchantability, or infringement of any patent, copyright, or other intellectual property right.
The products shown herein are not designed for use in medical, life-saving, or life-sustaining applications.
Customers using or selling these products for use in such applications do so at their own risk and agree to fully
indemnify TSC for any damages resulting from such improper use or sale.
Document Number: DS_D1411029
Version: E15
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