HC/UH SERIES, QUAD 2 LINE TO 1 LINE MULTIPLEXER, INVERTED OUTPUT, PDIP16, PLASTIC, DIP-16
| 参数名称 | 属性值 |
| 是否Rohs认证 | 不符合 |
| 厂商名称 | ST(意法半导体) |
| 零件包装代码 | DIP |
| 包装说明 | DIP, DIP16,.3 |
| 针数 | 16 |
| Reach Compliance Code | _compli |
| 系列 | HC/UH |
| JESD-30 代码 | R-PDIP-T16 |
| JESD-609代码 | e0 |
| 负载电容（CL） | 50 pF |
| 逻辑集成电路类型 | MULTIPLEXER |
| 最大I（ol） | 0.004 A |
| 功能数量 | 4 |
| 输入次数 | 2 |
| 输出次数 | 1 |
| 端子数量 | 16 |
| 最高工作温度 | 85 °C |
| 最低工作温度 | -40 °C |
| 输出极性 | INVERTED |
| 封装主体材料 | PLASTIC/EPOXY |
| 封装代码 | DIP |
| 封装等效代码 | DIP16,.3 |
| 封装形状 | RECTANGULAR |
| 封装形式 | IN-LINE |
| 峰值回流温度（摄氏度） | NOT SPECIFIED |
| 电源 | 2/6 V |
| Prop。Delay @ Nom-Su | 35 ns |
| 传播延迟（tpd） | 34 ns |
| 认证状态 | Not Qualified |
| 座面最大高度 | 5.1 mm |
| 最大供电电压 (Vsup) | 6 V |
| 最小供电电压 (Vsup) | 2 V |
| 标称供电电压 (Vsup) | 5 V |
| 表面贴装 | NO |
| 技术 | CMOS |
| 温度等级 | INDUSTRIAL |
| 端子面层 | Tin/Lead (Sn/Pb) |
| 端子形式 | THROUGH-HOLE |
| 端子节距 | 2.54 mm |
| 端子位置 | DUAL |
| 处于峰值回流温度下的最长时间 | NOT SPECIFIED |
| 宽度 | 7.62 mm |
| M74HC158B1N | M74HC158C1 | M74HC158F1 | M74HC158M1 | M54HC157F1 | M74HC157M1 | M74HC157C1 | M74HC157B1N | M54HC158F1 | M74HC157F1 | |
|---|---|---|---|---|---|---|---|---|---|---|
| 描述 | HC/UH SERIES, QUAD 2 LINE TO 1 LINE MULTIPLEXER, INVERTED OUTPUT, PDIP16, PLASTIC, DIP-16 | HC/UH SERIES, QUAD 2 LINE TO 1 LINE MULTIPLEXER, INVERTED OUTPUT, PQCC20, PLASTIC, CC-20 | HC/UH SERIES, QUAD 2 LINE TO 1 LINE MULTIPLEXER, INVERTED OUTPUT, CDIP16, FRIT SEALED, CERAMIC, DIP-16 | HC/UH SERIES, QUAD 2 LINE TO 1 LINE MULTIPLEXER, INVERTED OUTPUT, PDSO16, GULLWING, PLASTIC, DIP-16 | HC/UH SERIES, QUAD 2 LINE TO 1 LINE MULTIPLEXER, TRUE OUTPUT, CDIP16, FRIT SEALED, CERAMIC, DIP-16 | HC/UH SERIES, QUAD 2 LINE TO 1 LINE MULTIPLEXER, TRUE OUTPUT, PDSO16, GULLWING, PLASTIC, DIP-16 | HC/UH SERIES, QUAD 2 LINE TO 1 LINE MULTIPLEXER, TRUE OUTPUT, PQCC20, PLASTIC, CC-20 | HC/UH SERIES, QUAD 2 LINE TO 1 LINE MULTIPLEXER, TRUE OUTPUT, PDIP16, PLASTIC, DIP-16 | HC/UH SERIES, QUAD 2 LINE TO 1 LINE MULTIPLEXER, INVERTED OUTPUT, CDIP16, FRIT SEALED, CERAMIC, DIP-16 | HC/UH SERIES, QUAD 2 LINE TO 1 LINE MULTIPLEXER, TRUE OUTPUT, CDIP16, FRIT SEALED, CERAMIC, DIP-16 |
| 是否Rohs认证 | 不符合 | 不符合 | 不符合 | 不符合 | 不符合 | 不符合 | 不符合 | 不符合 | 不符合 | 不符合 |
| 零件包装代码 | DIP | QFN | DIP | SOIC | DIP | SOIC | QFN | DIP | DIP | DIP |
| 包装说明 | DIP, DIP16,.3 | PLASTIC, CC-20 | DIP, DIP16,.3 | SOP, SOP16,.25 | DIP, DIP16,.3 | SOP, SOP16,.25 | PLASTIC, CC-20 | DIP, DIP16,.3 | DIP, DIP16,.3 | DIP, DIP16,.3 |
| 针数 | 16 | 20 | 16 | 16 | 16 | 16 | 20 | 16 | 16 | 16 |
| Reach Compliance Code | _compli | not_compliant | not_compliant | not_compliant | not_compliant | not_compliant | not_compliant | not_compliant | not_compliant | _compli |
| 厂商名称 | ST(意法半导体) | - | - | - | ST(意法半导体) | ST(意法半导体) | ST(意法半导体) | ST(意法半导体) | ST(意法半导体) | ST(意法半导体) |
| 系列 | HC/UH | HC/UH | HC/UH | HC/UH | - | - | HC/UH | - | HC/UH | HC/UH |
| JESD-30 代码 | R-PDIP-T16 | S-PQCC-J20 | R-GDIP-T16 | R-PDSO-G16 | - | - | S-PQCC-J20 | - | R-GDIP-T16 | R-GDIP-T16 |
| JESD-609代码 | e0 | e0 | e0 | e0 | - | - | e0 | - | e0 | e0 |
| 负载电容（CL） | 50 pF | 50 pF | 50 pF | 50 pF | - | - | 50 pF | - | 50 pF | 50 pF |
| 逻辑集成电路类型 | MULTIPLEXER | MULTIPLEXER | MULTIPLEXER | MULTIPLEXER | - | - | MULTIPLEXER | - | MULTIPLEXER | MULTIPLEXER |
| 最大I（ol） | 0.004 A | 0.004 A | 0.004 A | 0.004 A | - | - | 0.004 A | - | 0.004 A | 0.004 A |
| 功能数量 | 4 | 4 | 4 | 4 | - | - | 4 | - | 4 | 4 |
| 输入次数 | 2 | 2 | 2 | 2 | - | - | 2 | - | 2 | 2 |
| 输出次数 | 1 | 1 | 1 | 1 | - | - | 1 | - | 1 | 1 |
| 端子数量 | 16 | 20 | 16 | 16 | - | - | 20 | - | 16 | 16 |
| 最高工作温度 | 85 °C | 85 °C | 85 °C | 85 °C | - | - | 85 °C | - | 125 °C | 85 °C |
| 最低工作温度 | -40 °C | -40 °C | -40 °C | -40 °C | - | - | -40 °C | - | -55 °C | -40 °C |
| 输出极性 | INVERTED | INVERTED | INVERTED | INVERTED | - | - | TRUE | - | INVERTED | TRUE |
| 封装主体材料 | PLASTIC/EPOXY | PLASTIC/EPOXY | CERAMIC, GLASS-SEALED | PLASTIC/EPOXY | - | - | PLASTIC/EPOXY | - | CERAMIC, GLASS-SEALED | CERAMIC, GLASS-SEALED |
| 封装代码 | DIP | QCCJ | DIP | SOP | - | - | QCCJ | - | DIP | DIP |
| 封装等效代码 | DIP16,.3 | LDCC20,.4SQ | DIP16,.3 | SOP16,.25 | - | - | LDCC20,.4SQ | - | DIP16,.3 | DIP16,.3 |
| 封装形状 | RECTANGULAR | SQUARE | RECTANGULAR | RECTANGULAR | - | - | SQUARE | - | RECTANGULAR | RECTANGULAR |
| 封装形式 | IN-LINE | CHIP CARRIER | IN-LINE | SMALL OUTLINE | - | - | CHIP CARRIER | - | IN-LINE | IN-LINE |
| 峰值回流温度（摄氏度） | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | - | - | NOT SPECIFIED | - | NOT SPECIFIED | NOT SPECIFIED |
| 电源 | 2/6 V | 2/6 V | 2/6 V | 2/6 V | - | - | 2/6 V | - | 2/6 V | 2/6 V |
| 传播延迟（tpd） | 34 ns | 34 ns | 34 ns | 34 ns | - | - | 35 ns | - | 41 ns | 35 ns |
| 认证状态 | Not Qualified | Not Qualified | Not Qualified | Not Qualified | - | - | Not Qualified | - | Not Qualified | Not Qualified |
| 座面最大高度 | 5.1 mm | 4.57 mm | 5 mm | 1.75 mm | - | - | 4.57 mm | - | 5 mm | 5 mm |
| 最大供电电压 (Vsup) | 6 V | 6 V | 6 V | 6 V | - | - | 6 V | - | 6 V | 6 V |
| 最小供电电压 (Vsup) | 2 V | 2 V | 2 V | 2 V | - | - | 2 V | - | 2 V | 2 V |
| 标称供电电压 (Vsup) | 5 V | 5 V | 5 V | 5 V | - | - | 5 V | - | 5 V | 5 V |
| 表面贴装 | NO | YES | NO | YES | - | - | YES | - | NO | NO |
| 技术 | CMOS | CMOS | CMOS | CMOS | - | - | CMOS | - | CMOS | CMOS |
| 温度等级 | INDUSTRIAL | INDUSTRIAL | INDUSTRIAL | INDUSTRIAL | - | - | INDUSTRIAL | - | MILITARY | INDUSTRIAL |
| 端子面层 | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | - | - | Tin/Lead (Sn/Pb) | - | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) |
| 端子形式 | THROUGH-HOLE | J BEND | THROUGH-HOLE | GULL WING | - | - | J BEND | - | THROUGH-HOLE | THROUGH-HOLE |
| 端子节距 | 2.54 mm | 1.27 mm | 2.54 mm | 1.27 mm | - | - | 1.27 mm | - | 2.54 mm | 2.54 mm |
| 端子位置 | DUAL | QUAD | DUAL | DUAL | - | - | QUAD | - | DUAL | DUAL |
| 处于峰值回流温度下的最长时间 | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | - | - | NOT SPECIFIED | - | NOT SPECIFIED | NOT SPECIFIED |
| 宽度 | 7.62 mm | 8.9662 mm | 7.62 mm | 3.9 mm | - | - | 8.9662 mm | - | 7.62 mm | 7.62 mm |
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