Synchronous DRAM Module, 2MX64, 9ns, CMOS, DIMM-168
| 参数名称 | 属性值 |
| 厂商名称 | SK Hynix(海力士) |
| 零件包装代码 | DIMM |
| 包装说明 | DIMM, |
| 针数 | 168 |
| Reach Compliance Code | unknow |
| ECCN代码 | EAR99 |
| 访问模式 | DUAL BANK PAGE BURST |
| 最长访问时间 | 9 ns |
| 其他特性 | AUTO REFRESH |
| JESD-30 代码 | R-XDMA-N168 |
| 内存密度 | 134217728 bi |
| 内存集成电路类型 | SYNCHRONOUS DRAM MODULE |
| 内存宽度 | 64 |
| 功能数量 | 1 |
| 端口数量 | 1 |
| 端子数量 | 168 |
| 字数 | 2097152 words |
| 字数代码 | 2000000 |
| 工作模式 | SYNCHRONOUS |
| 最高工作温度 | 70 °C |
| 最低工作温度 | |
| 组织 | 2MX64 |
| 封装主体材料 | UNSPECIFIED |
| 封装代码 | DIMM |
| 封装形状 | RECTANGULAR |
| 封装形式 | MICROELECTRONIC ASSEMBLY |
| 认证状态 | Not Qualified |
| 最大供电电压 (Vsup) | 3.6 V |
| 最小供电电压 (Vsup) | 3 V |
| 标称供电电压 (Vsup) | 3.3 V |
| 表面贴装 | NO |
| 技术 | CMOS |
| 温度等级 | COMMERCIAL |
| 端子形式 | NO LEAD |
| 端子位置 | DUAL |
| HYM7V64200BLTFG-15 | HYM7V64200BTFG-12 | HYM7V64200BTFG-15 | HYM7V64200BTFG-10 | HYM7V64200BLTFG-12 | HYM7V64200BLTFG-10 | |
|---|---|---|---|---|---|---|
| 描述 | Synchronous DRAM Module, 2MX64, 9ns, CMOS, DIMM-168 | Synchronous DRAM Module, 2MX64, 8.5ns, CMOS, DIMM-168 | Synchronous DRAM Module, 2MX64, 9ns, CMOS, DIMM-168 | Synchronous DRAM Module, 2MX64, 8ns, CMOS, DIMM-168 | Synchronous DRAM Module, 2MX64, 8.5ns, CMOS, DIMM-168 | Synchronous DRAM Module, 2MX64, 8ns, CMOS, DIMM-168 |
| 零件包装代码 | DIMM | DIMM | DIMM | DIMM | DIMM | DIMM |
| 包装说明 | DIMM, | DIMM, | DIMM, | DIMM, | DIMM, | DIMM, |
| 针数 | 168 | 168 | 168 | 168 | 168 | 168 |
| Reach Compliance Code | unknow | unknown | unknown | unknown | unknown | unknown |
| ECCN代码 | EAR99 | EAR99 | EAR99 | EAR99 | EAR99 | EAR99 |
| 访问模式 | DUAL BANK PAGE BURST | DUAL BANK PAGE BURST | DUAL BANK PAGE BURST | DUAL BANK PAGE BURST | DUAL BANK PAGE BURST | DUAL BANK PAGE BURST |
| 最长访问时间 | 9 ns | 8.5 ns | 9 ns | 8 ns | 8.5 ns | 8 ns |
| 其他特性 | AUTO REFRESH | AUTO REFRESH | AUTO REFRESH | AUTO REFRESH | AUTO REFRESH | AUTO REFRESH |
| JESD-30 代码 | R-XDMA-N168 | R-XDMA-N168 | R-XDMA-N168 | R-XDMA-N168 | R-XDMA-N168 | R-XDMA-N168 |
| 内存密度 | 134217728 bi | 134217728 bit | 134217728 bit | 134217728 bit | 134217728 bit | 134217728 bit |
| 内存集成电路类型 | SYNCHRONOUS DRAM MODULE | SYNCHRONOUS DRAM MODULE | SYNCHRONOUS DRAM MODULE | SYNCHRONOUS DRAM MODULE | SYNCHRONOUS DRAM MODULE | SYNCHRONOUS DRAM MODULE |
| 内存宽度 | 64 | 64 | 64 | 64 | 64 | 64 |
| 功能数量 | 1 | 1 | 1 | 1 | 1 | 1 |
| 端口数量 | 1 | 1 | 1 | 1 | 1 | 1 |
| 端子数量 | 168 | 168 | 168 | 168 | 168 | 168 |
| 字数 | 2097152 words | 2097152 words | 2097152 words | 2097152 words | 2097152 words | 2097152 words |
| 字数代码 | 2000000 | 2000000 | 2000000 | 2000000 | 2000000 | 2000000 |
| 工作模式 | SYNCHRONOUS | SYNCHRONOUS | SYNCHRONOUS | SYNCHRONOUS | SYNCHRONOUS | SYNCHRONOUS |
| 最高工作温度 | 70 °C | 70 °C | 70 °C | 70 °C | 70 °C | 70 °C |
| 组织 | 2MX64 | 2MX64 | 2MX64 | 2MX64 | 2MX64 | 2MX64 |
| 封装主体材料 | UNSPECIFIED | UNSPECIFIED | UNSPECIFIED | UNSPECIFIED | UNSPECIFIED | UNSPECIFIED |
| 封装代码 | DIMM | DIMM | DIMM | DIMM | DIMM | DIMM |
| 封装形状 | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR |
| 封装形式 | MICROELECTRONIC ASSEMBLY | MICROELECTRONIC ASSEMBLY | MICROELECTRONIC ASSEMBLY | MICROELECTRONIC ASSEMBLY | MICROELECTRONIC ASSEMBLY | MICROELECTRONIC ASSEMBLY |
| 认证状态 | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified |
| 最大供电电压 (Vsup) | 3.6 V | 3.6 V | 3.6 V | 3.6 V | 3.6 V | 3.6 V |
| 最小供电电压 (Vsup) | 3 V | 3 V | 3 V | 3 V | 3 V | 3 V |
| 标称供电电压 (Vsup) | 3.3 V | 3.3 V | 3.3 V | 3.3 V | 3.3 V | 3.3 V |
| 表面贴装 | NO | NO | NO | NO | NO | NO |
| 技术 | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS |
| 温度等级 | COMMERCIAL | COMMERCIAL | COMMERCIAL | COMMERCIAL | COMMERCIAL | COMMERCIAL |
| 端子形式 | NO LEAD | NO LEAD | NO LEAD | NO LEAD | NO LEAD | NO LEAD |
| 端子位置 | DUAL | DUAL | DUAL | DUAL | DUAL | DUAL |
| Base Number Matches | - | 1 | 1 | 1 | 1 | - |
电子工程世界版权所有
京B2-20211791
京ICP备10001474号-1
电信业务审批[2006]字第258号函
京公网安备 11010802033920号
Copyright © 2005-2024 EEWORLD.com.cn, Inc. All rights reserved
电子工程世界
