EDO DRAM Module, 8MX64, 50ns, CMOS, PDMA168, DIMM-168
| 参数名称 | 属性值 |
| 厂商名称 | SK Hynix(海力士) |
| 零件包装代码 | DIMM |
| 包装说明 | , |
| 针数 | 168 |
| Reach Compliance Code | unknow |
| ECCN代码 | EAR99 |
| 访问模式 | FAST PAGE WITH EDO |
| 最长访问时间 | 50 ns |
| 其他特性 | CAS BEFORE RAS/RAS ONLY/HIDDEN/ SELF REFRESH |
| JESD-30 代码 | R-PDMA-N168 |
| 内存密度 | 536870912 bi |
| 内存集成电路类型 | EDO DRAM MODULE |
| 内存宽度 | 64 |
| 功能数量 | 1 |
| 端口数量 | 1 |
| 端子数量 | 168 |
| 字数 | 8388608 words |
| 字数代码 | 8000000 |
| 工作模式 | ASYNCHRONOUS |
| 最高工作温度 | 70 °C |
| 最低工作温度 | |
| 组织 | 8MX64 |
| 封装主体材料 | PLASTIC/EPOXY |
| 封装形状 | RECTANGULAR |
| 封装形式 | MICROELECTRONIC ASSEMBLY |
| 认证状态 | Not Qualified |
| 自我刷新 | YES |
| 最大供电电压 (Vsup) | 3.6 V |
| 最小供电电压 (Vsup) | 3 V |
| 标称供电电压 (Vsup) | 3.3 V |
| 表面贴装 | NO |
| 技术 | CMOS |
| 温度等级 | COMMERCIAL |
| 端子形式 | NO LEAD |
| 端子位置 | DUAL |
| HYM5V64804TFG-50 | HYM5V64834TFG-60 | HYM5V64834FG-60 | HYM5V64804TFG-70 | HYM5V64834TFG-50 | HYM5V64834TFG-70 | HYM5V64834FG-50 | HYM5V64804FG-60 | HYM5V64804FG-50 | HYM5V64804TFG-60 | |
|---|---|---|---|---|---|---|---|---|---|---|
| 描述 | EDO DRAM Module, 8MX64, 50ns, CMOS, PDMA168, DIMM-168 | EDO DRAM Module, 8MX64, 60ns, CMOS, PDMA168, DIMM-168 | EDO DRAM Module, 8MX64, 60ns, CMOS, PDMA168, DIMM-168 | EDO DRAM Module, 8MX64, 70ns, CMOS, PDMA168, DIMM-168 | EDO DRAM Module, 8MX64, 50ns, CMOS, PDMA168, DIMM-168 | EDO DRAM Module, 8MX64, 70ns, CMOS, PDMA168, DIMM-168 | EDO DRAM Module, 8MX64, 50ns, CMOS, PDMA168, DIMM-168 | EDO DRAM Module, 8MX64, 60ns, CMOS, PDMA168, DIMM-168 | EDO DRAM Module, 8MX64, 50ns, CMOS, PDMA168, DIMM-168 | EDO DRAM Module, 8MX64, 60ns, CMOS, PDMA168, DIMM-168 |
| 零件包装代码 | DIMM | DIMM | DIMM | DIMM | DIMM | DIMM | DIMM | DIMM | DIMM | DIMM |
| 针数 | 168 | 168 | 168 | 168 | 168 | 168 | 168 | 168 | 168 | 168 |
| Reach Compliance Code | unknow | unknown | unknown | unknown | unknown | unknown | unknown | unknown | unknown | unknown |
| ECCN代码 | EAR99 | EAR99 | EAR99 | EAR99 | EAR99 | EAR99 | EAR99 | EAR99 | EAR99 | EAR99 |
| 访问模式 | FAST PAGE WITH EDO | FAST PAGE WITH EDO | FAST PAGE WITH EDO | FAST PAGE WITH EDO | FAST PAGE WITH EDO | FAST PAGE WITH EDO | FAST PAGE WITH EDO | FAST PAGE WITH EDO | FAST PAGE WITH EDO | FAST PAGE WITH EDO |
| 最长访问时间 | 50 ns | 60 ns | 60 ns | 70 ns | 50 ns | 70 ns | 50 ns | 60 ns | 50 ns | 60 ns |
| 其他特性 | CAS BEFORE RAS/RAS ONLY/HIDDEN/ SELF REFRESH | CAS BEFORE RAS/RAS ONLY/HIDDEN REFRESH | CAS BEFORE RAS/RAS ONLY/HIDDEN REFRESH | CAS BEFORE RAS/RAS ONLY/HIDDEN/ SELF REFRESH | CAS BEFORE RAS/RAS ONLY/HIDDEN REFRESH | CAS BEFORE RAS/RAS ONLY/HIDDEN REFRESH | CAS BEFORE RAS/RAS ONLY/HIDDEN REFRESH | CAS BEFORE RAS/RAS ONLY/HIDDEN/ SELF REFRESH | CAS BEFORE RAS/RAS ONLY/HIDDEN/ SELF REFRESH | CAS BEFORE RAS/RAS ONLY/HIDDEN/ SELF REFRESH |
| JESD-30 代码 | R-PDMA-N168 | R-PDMA-N168 | R-PDMA-N168 | R-PDMA-N168 | R-PDMA-N168 | R-PDMA-N168 | R-PDMA-N168 | R-PDMA-N168 | R-PDMA-N168 | R-PDMA-N168 |
| 内存密度 | 536870912 bi | 536870912 bit | 536870912 bit | 536870912 bit | 536870912 bit | 536870912 bit | 536870912 bit | 536870912 bit | 536870912 bit | 536870912 bit |
| 内存集成电路类型 | EDO DRAM MODULE | EDO DRAM MODULE | EDO DRAM MODULE | EDO DRAM MODULE | EDO DRAM MODULE | EDO DRAM MODULE | EDO DRAM MODULE | EDO DRAM MODULE | EDO DRAM MODULE | EDO DRAM MODULE |
| 内存宽度 | 64 | 64 | 64 | 64 | 64 | 64 | 64 | 64 | 64 | 64 |
| 功能数量 | 1 | 1 | 1 | 1 | 1 | 1 | 1 | 1 | 1 | 1 |
| 端口数量 | 1 | 1 | 1 | 1 | 1 | 1 | 1 | 1 | 1 | 1 |
| 端子数量 | 168 | 168 | 168 | 168 | 168 | 168 | 168 | 168 | 168 | 168 |
| 字数 | 8388608 words | 8388608 words | 8388608 words | 8388608 words | 8388608 words | 8388608 words | 8388608 words | 8388608 words | 8388608 words | 8388608 words |
| 字数代码 | 8000000 | 8000000 | 8000000 | 8000000 | 8000000 | 8000000 | 8000000 | 8000000 | 8000000 | 8000000 |
| 工作模式 | ASYNCHRONOUS | ASYNCHRONOUS | ASYNCHRONOUS | ASYNCHRONOUS | ASYNCHRONOUS | ASYNCHRONOUS | ASYNCHRONOUS | ASYNCHRONOUS | ASYNCHRONOUS | ASYNCHRONOUS |
| 最高工作温度 | 70 °C | 70 °C | 70 °C | 70 °C | 70 °C | 70 °C | 70 °C | 70 °C | 70 °C | 70 °C |
| 组织 | 8MX64 | 8MX64 | 8MX64 | 8MX64 | 8MX64 | 8MX64 | 8MX64 | 8MX64 | 8MX64 | 8MX64 |
| 封装主体材料 | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY |
| 封装形状 | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR |
| 封装形式 | MICROELECTRONIC ASSEMBLY | MICROELECTRONIC ASSEMBLY | MICROELECTRONIC ASSEMBLY | MICROELECTRONIC ASSEMBLY | MICROELECTRONIC ASSEMBLY | MICROELECTRONIC ASSEMBLY | MICROELECTRONIC ASSEMBLY | MICROELECTRONIC ASSEMBLY | MICROELECTRONIC ASSEMBLY | MICROELECTRONIC ASSEMBLY |
| 认证状态 | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified |
| 最大供电电压 (Vsup) | 3.6 V | 3.6 V | 3.6 V | 3.6 V | 3.6 V | 3.6 V | 3.6 V | 3.6 V | 3.6 V | 3.6 V |
| 最小供电电压 (Vsup) | 3 V | 3 V | 3 V | 3 V | 3 V | 3 V | 3 V | 3 V | 3 V | 3 V |
| 标称供电电压 (Vsup) | 3.3 V | 3.3 V | 3.3 V | 3.3 V | 3.3 V | 3.3 V | 3.3 V | 3.3 V | 3.3 V | 3.3 V |
| 表面贴装 | NO | NO | NO | NO | NO | NO | NO | NO | NO | NO |
| 技术 | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS |
| 温度等级 | COMMERCIAL | COMMERCIAL | COMMERCIAL | COMMERCIAL | COMMERCIAL | COMMERCIAL | COMMERCIAL | COMMERCIAL | COMMERCIAL | COMMERCIAL |
| 端子形式 | NO LEAD | NO LEAD | NO LEAD | NO LEAD | NO LEAD | NO LEAD | NO LEAD | NO LEAD | NO LEAD | NO LEAD |
| 端子位置 | DUAL | DUAL | DUAL | DUAL | DUAL | DUAL | DUAL | DUAL | DUAL | DUAL |
| 厂商名称 | SK Hynix(海力士) | - | SK Hynix(海力士) | SK Hynix(海力士) | SK Hynix(海力士) | SK Hynix(海力士) | SK Hynix(海力士) | SK Hynix(海力士) | SK Hynix(海力士) | SK Hynix(海力士) |
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