IC,LOGIC GATE,DUAL 4-INPUT AND,HCT-CMOS,DIP,14PIN,CERAMIC
| 参数名称 | 属性值 |
| 是否Rohs认证 | 不符合 |
| 厂商名称 | Renesas(瑞萨电子) |
| 包装说明 | DIP, DIP14,.3 |
| Reach Compliance Code | _compli |
| JESD-30 代码 | R-XDIP-T14 |
| 负载电容（CL） | 50 pF |
| 逻辑集成电路类型 | AND GATE |
| 最大I（ol） | 0.004 A |
| 端子数量 | 14 |
| 最高工作温度 | 125 °C |
| 最低工作温度 | -55 °C |
| 封装主体材料 | CERAMIC |
| 封装代码 | DIP |
| 封装等效代码 | DIP14,.3 |
| 封装形状 | RECTANGULAR |
| 封装形式 | IN-LINE |
| 电源 | 5 V |
| Prop。Delay @ Nom-Su | 41 ns |
| 认证状态 | Not Qualified |
| 施密特触发器 | NO |
| 标称供电电压 (Vsup) | 5 V |
| 表面贴装 | NO |
| 技术 | CMOS |
| 温度等级 | MILITARY |
| 端子形式 | THROUGH-HOLE |
| 端子节距 | 2.54 mm |
| 端子位置 | DUAL |
| 5962-01-300-2291 | CD54HC21F | CD74HC21M96 | CD54HC21H | CD54HCT21F | CD54HCT21H | CD74HCT21M96 | |
|---|---|---|---|---|---|---|---|
| 描述 | IC,LOGIC GATE,DUAL 4-INPUT AND,HCT-CMOS,DIP,14PIN,CERAMIC | CD54HC21F | IC,LOGIC GATE,DUAL 4-INPUT AND,HC-CMOS,SOP,14PIN,PLASTIC | CD54HC21H | IC,LOGIC GATE,DUAL 4-INPUT AND,HCT-CMOS,DIP,14PIN,CERAMIC | CD54HCT21H | IC,LOGIC GATE,DUAL 4-INPUT AND,HCT-CMOS,SOP,14PIN,PLASTIC |
| 厂商名称 | Renesas(瑞萨电子) | Renesas(瑞萨电子) | Renesas(瑞萨电子) | Renesas(瑞萨电子) | Renesas(瑞萨电子) | Renesas(瑞萨电子) | Renesas(瑞萨电子) |
| Reach Compliance Code | _compli | not_compliant | not_compliant | unknown | not_compliant | unknow | _compli |
| 负载电容（CL） | 50 pF | 50 pF | 50 pF | 50 pF | 50 pF | 50 pF | 50 pF |
| 逻辑集成电路类型 | AND GATE | AND GATE | AND GATE | AND GATE | AND GATE | AND GATE | AND GATE |
| 最大I（ol） | 0.004 A | 0.004 A | 0.004 A | 0.004 A | 0.004 A | 0.004 A | 0.004 A |
| 最高工作温度 | 125 °C | 125 °C | 125 °C | 125 °C | 125 °C | 125 °C | 125 °C |
| 最低工作温度 | -55 °C | -55 °C | -55 °C | -55 °C | -55 °C | -55 °C | -55 °C |
| 封装等效代码 | DIP14,.3 | DIP14,.3 | SOP14,.25 | DIE OR CHIP | DIP14,.3 | DIE OR CHIP | SOP14,.25 |
| 电源 | 5 V | 2/6 V | 2/6 V | 2/6 V | 5 V | 5 V | 5 V |
| 认证状态 | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified |
| 施密特触发器 | NO | NO | NO | NO | NO | NO | NO |
| 技术 | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS |
| 温度等级 | MILITARY | MILITARY | MILITARY | MILITARY | MILITARY | MILITARY | MILITARY |
| 是否Rohs认证 | 不符合 | 不符合 | 不符合 | - | 不符合 | - | 不符合 |
| 包装说明 | DIP, DIP14,.3 | - | SOP, SOP14,.25 | , DIE OR CHIP | DIP, DIP14,.3 | , DIE OR CHIP | SOP, SOP14,.25 |
| JESD-30 代码 | R-XDIP-T14 | R-XDIP-T14 | R-PDSO-G14 | - | R-XDIP-T14 | - | R-PDSO-G14 |
| 端子数量 | 14 | 14 | 14 | - | 14 | - | 14 |
| 封装主体材料 | CERAMIC | CERAMIC | PLASTIC/EPOXY | - | CERAMIC | - | PLASTIC/EPOXY |
| 封装代码 | DIP | DIP | SOP | - | DIP | - | SOP |
| 封装形状 | RECTANGULAR | RECTANGULAR | RECTANGULAR | - | RECTANGULAR | - | RECTANGULAR |
| 封装形式 | IN-LINE | IN-LINE | SMALL OUTLINE | - | IN-LINE | - | SMALL OUTLINE |
| 标称供电电压 (Vsup) | 5 V | - | - | - | 5 V | 5 V | 5 V |
| 表面贴装 | NO | NO | YES | - | NO | - | YES |
| 端子形式 | THROUGH-HOLE | THROUGH-HOLE | GULL WING | - | THROUGH-HOLE | - | GULL WING |
| 端子节距 | 2.54 mm | 2.54 mm | 1.27 mm | - | 2.54 mm | - | 1.27 mm |
| 端子位置 | DUAL | DUAL | DUAL | - | DUAL | - | DUAL |
| JESD-609代码 | - | e0 | e0 | - | e0 | - | e0 |
| Prop。Delay @ Nom-Sup | - | 33 ns | 33 ns | 33 ns | 41 ns | - | - |
| 端子面层 | - | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | - | Tin/Lead (Sn/Pb) | - | Tin/Lead (Sn/Pb) |
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