Microcontroller, 16-Bit, UVPROM, XA CPU, 25MHz, CMOS, PQFP44,
| 参数名称 | 属性值 |
| 是否Rohs认证 | 不符合 |
| 厂商名称 | Philips Semiconductors (NXP Semiconductors N.V.) |
| 包装说明 | QFP, QFP44,.5SQ,32 |
| Reach Compliance Code | unknow |
| 位大小 | 16 |
| CPU系列 | XA |
| JESD-30 代码 | S-PQFP-G44 |
| JESD-609代码 | e0 |
| 端子数量 | 44 |
| 最高工作温度 | 70 °C |
| 最低工作温度 | |
| 封装主体材料 | PLASTIC/EPOXY |
| 封装代码 | QFP |
| 封装等效代码 | QFP44,.5SQ,32 |
| 封装形状 | SQUARE |
| 封装形式 | FLATPACK |
| 电源 | 3.3/5 V |
| 认证状态 | Not Qualified |
| RAM（字节） | 512 |
| ROM（单词） | 16384 |
| ROM可编程性 | UVPROM |
| 速度 | 25 MHz |
| 最大压摆率 | 100 mA |
| 表面贴装 | YES |
| 技术 | CMOS |
| 温度等级 | COMMERCIAL |
| 端子面层 | Tin/Lead (Sn/Pb) |
| 端子形式 | GULL WING |
| 端子节距 | 0.8 mm |
| 端子位置 | QUAD |
| P51XAG37JBBD | P51XAG37KFA | P51XAG30JFA | P51XAG30JBA | P51XAG37JBKA | P51XAG30JBBD | P51XAG33JFA | P51XAG37KBA | P51XAG30JFBD | P51XAG37KFBD | |
|---|---|---|---|---|---|---|---|---|---|---|
| 描述 | Microcontroller, 16-Bit, UVPROM, XA CPU, 25MHz, CMOS, PQFP44, | Microcontroller, 16-Bit, UVPROM, XA CPU, 30MHz, CMOS, PQCC44, | Microcontroller, 16-Bit, XA CPU, 25MHz, CMOS, PQCC44, | Microcontroller, 16-Bit, XA CPU, 25MHz, CMOS, PQCC44, | Microcontroller, 16-Bit, UVPROM, XA CPU, 25MHz, CMOS, CQCC44, | Microcontroller, 16-Bit, XA CPU, 25MHz, CMOS, PQFP44, | Microcontroller, 16-Bit, MROM, XA CPU, 25MHz, CMOS, PQCC44, | Microcontroller, 16-Bit, UVPROM, XA CPU, 30MHz, CMOS, PQCC44, | Microcontroller, 16-Bit, XA CPU, 25MHz, CMOS, PQFP44, | Microcontroller, 16-Bit, UVPROM, XA CPU, 30MHz, CMOS, PQFP44, |
| 是否Rohs认证 | 不符合 | 不符合 | 不符合 | 不符合 | 不符合 | 不符合 | 不符合 | 不符合 | 不符合 | 不符合 |
| 包装说明 | QFP, QFP44,.5SQ,32 | QCCJ, LDCC44,.7SQ | QCCJ, LDCC44,.7SQ | QCCJ, LDCC44,.7SQ | QCCJ, LDCC44,.7SQ | QFP, QFP44,.5SQ,32 | QCCJ, LDCC44,.7SQ | QCCJ, LDCC44,.7SQ | QFP, QFP44,.5SQ,32 | QFP, QFP44,.5SQ,32 |
| Reach Compliance Code | unknow | unknown | unknown | unknown | unknown | unknown | unknown | unknow | unknow | unknow |
| 位大小 | 16 | 16 | 16 | 16 | 16 | 16 | 16 | 16 | 16 | 16 |
| CPU系列 | XA | XA | XA | XA | XA | XA | XA | XA | XA | XA |
| JESD-30 代码 | S-PQFP-G44 | S-PQCC-J44 | S-PQCC-J44 | S-PQCC-J44 | S-XQCC-J44 | S-PQFP-G44 | S-PQCC-J44 | S-PQCC-J44 | S-PQFP-G44 | S-PQFP-G44 |
| JESD-609代码 | e0 | e0 | e0 | e0 | e0 | e0 | e0 | e0 | e0 | e0 |
| 端子数量 | 44 | 44 | 44 | 44 | 44 | 44 | 44 | 44 | 44 | 44 |
| 最高工作温度 | 70 °C | 85 °C | 85 °C | 70 °C | 70 °C | 70 °C | 85 °C | 70 °C | 85 °C | 85 °C |
| 封装主体材料 | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | CERAMIC | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY |
| 封装代码 | QFP | QCCJ | QCCJ | QCCJ | QCCJ | QFP | QCCJ | QCCJ | QFP | QFP |
| 封装等效代码 | QFP44,.5SQ,32 | LDCC44,.7SQ | LDCC44,.7SQ | LDCC44,.7SQ | LDCC44,.7SQ | QFP44,.5SQ,32 | LDCC44,.7SQ | LDCC44,.7SQ | QFP44,.5SQ,32 | QFP44,.5SQ,32 |
| 封装形状 | SQUARE | SQUARE | SQUARE | SQUARE | SQUARE | SQUARE | SQUARE | SQUARE | SQUARE | SQUARE |
| 封装形式 | FLATPACK | CHIP CARRIER | CHIP CARRIER | CHIP CARRIER | CHIP CARRIER | FLATPACK | CHIP CARRIER | CHIP CARRIER | FLATPACK | FLATPACK |
| 电源 | 3.3/5 V | 3.3/5 V | 3.3/5 V | 3.3/5 V | 3.3/5 V | 3.3/5 V | 3.3/5 V | 3.3/5 V | 3.3/5 V | 3.3/5 V |
| 认证状态 | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified |
| RAM（字节） | 512 | 512 | 512 | 512 | 512 | 512 | 512 | 512 | 512 | 512 |
| ROM（单词） | 16384 | 16384 | - | - | 16384 | - | 16384 | 16384 | - | 16384 |
| 速度 | 25 MHz | 30 MHz | 25 MHz | 25 MHz | 25 MHz | 25 MHz | 25 MHz | 30 MHz | 25 MHz | 30 MHz |
| 最大压摆率 | 100 mA | 100 mA | 100 mA | 100 mA | 100 mA | 100 mA | 100 mA | 100 mA | 100 mA | 100 mA |
| 表面贴装 | YES | YES | YES | YES | YES | YES | YES | YES | YES | YES |
| 技术 | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS |
| 温度等级 | COMMERCIAL | INDUSTRIAL | INDUSTRIAL | COMMERCIAL | COMMERCIAL | COMMERCIAL | INDUSTRIAL | COMMERCIAL | INDUSTRIAL | INDUSTRIAL |
| 端子面层 | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) |
| 端子形式 | GULL WING | J BEND | J BEND | J BEND | J BEND | GULL WING | J BEND | J BEND | GULL WING | GULL WING |
| 端子节距 | 0.8 mm | 1.27 mm | 1.27 mm | 1.27 mm | 1.27 mm | 0.8 mm | 1.27 mm | 1.27 mm | 0.8 mm | 0.8 mm |
| 端子位置 | QUAD | QUAD | QUAD | QUAD | QUAD | QUAD | QUAD | QUAD | QUAD | QUAD |
| 厂商名称 | Philips Semiconductors (NXP Semiconductors N.V.) | - | Philips Semiconductors (NXP Semiconductors N.V.) | Philips Semiconductors (NXP Semiconductors N.V.) | Philips Semiconductors (NXP Semiconductors N.V.) | Philips Semiconductors (NXP Semiconductors N.V.) | Philips Semiconductors (NXP Semiconductors N.V.) | Philips Semiconductors (NXP Semiconductors N.V.) | Philips Semiconductors (NXP Semiconductors N.V.) | Philips Semiconductors (NXP Semiconductors N.V.) |
| ROM可编程性 | UVPROM | UVPROM | - | - | UVPROM | - | MROM | UVPROM | - | UVPROM |
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