High- Performance EE PLD
| 参数名称 | 属性值 |
| 是否无铅 | 含铅 |
| 是否Rohs认证 | 不符合 |
| 厂商名称 | Atmel (Microchip) |
| 零件包装代码 | DIP |
| 包装说明 | DIP, DIP20,.3 |
| 针数 | 20 |
| Reach Compliance Code | unknow |
| ECCN代码 | EAR99 |
| 其他特性 | 8 MACROCELLS; 1 EXTERNAL CLOCK; SHARED INPUT/CLOCK |
| 架构 | PAL-TYPE |
| 最大时钟频率 | 45 MHz |
| JESD-30 代码 | R-PDIP-T20 |
| JESD-609代码 | e0 |
| 长度 | 25.908 mm |
| 湿度敏感等级 | 1 |
| 专用输入次数 | 7 |
| I/O 线路数量 | 8 |
| 输入次数 | 18 |
| 输出次数 | 8 |
| 产品条款数 | 64 |
| 端子数量 | 20 |
| 最高工作温度 | 70 °C |
| 最低工作温度 | |
| 组织 | 7 DEDICATED INPUTS, 8 I/O |
| 输出函数 | MACROCELL |
| 封装主体材料 | PLASTIC/EPOXY |
| 封装代码 | DIP |
| 封装等效代码 | DIP20,.3 |
| 封装形状 | RECTANGULAR |
| 封装形式 | IN-LINE |
| 峰值回流温度（摄氏度） | 225 |
| 电源 | 3.3/5 V |
| 可编程逻辑类型 | FLASH PLD |
| 传播延迟 | 15 ns |
| 认证状态 | Not Qualified |
| 座面最大高度 | 5.334 mm |
| 最大供电电压 | 5.5 V |
| 最小供电电压 | 3 V |
| 标称供电电压 | 3.3 V |
| 表面贴装 | NO |
| 技术 | CMOS |
| 温度等级 | COMMERCIAL |
| 端子面层 | Tin/Lead (Sn/Pb) |
| 端子形式 | THROUGH-HOLE |
| 端子节距 | 2.54 mm |
| 端子位置 | DUAL |
| 处于峰值回流温度下的最长时间 | 30 |
| 宽度 | 7.62 mm |
| ATF16LV8C-15PC | ATF16LV8C-10 | ATF16LV8C-10SI | ATF16LV8C | ATF16LV8C-10JI | ATF16LV8C-15PI | ATF16LV8C-15XC | ATF16LV8C-15JC | ATF16LV8C-15XI | |
|---|---|---|---|---|---|---|---|---|---|
| 描述 | High- Performance EE PLD | High- Performance EE PLD | High- Performance EE PLD | High- Performance EE PLD | High- Performance EE PLD | High- Performance EE PLD | High- Performance EE PLD | High- Performance EE PLD | High- Performance EE PLD |
| 是否无铅 | 含铅 | - | 含铅 | - | 含铅 | 含铅 | 含铅 | 含铅 | - |
| 是否Rohs认证 | 不符合 | - | 不符合 | - | 不符合 | 不符合 | 不符合 | 不符合 | 不符合 |
| 厂商名称 | Atmel (Microchip) | - | Atmel (Microchip) | - | Atmel (Microchip) | Atmel (Microchip) | Atmel (Microchip) | Atmel (Microchip) | Atmel (Microchip) |
| 零件包装代码 | DIP | - | SOIC | - | LPCC | DIP | TSSOP | LPCC | TSSOP |
| 包装说明 | DIP, DIP20,.3 | - | SOP, SOP20,.4 | - | QCCJ, LDCC20,.4SQ | DIP, DIP20,.3 | 4.40 MM, PLASTIC, MO-153, TSSOP-20 | QCCJ, LDCC20,.4SQ | 4.40 MM, PLASTIC, MO-153, TSSOP-20 |
| 针数 | 20 | - | 20 | - | 20 | 20 | 20 | 20 | 20 |
| Reach Compliance Code | unknow | - | compli | - | compli | unknow | unknow | compli | unknow |
| ECCN代码 | EAR99 | - | EAR99 | - | EAR99 | EAR99 | EAR99 | EAR99 | - |
| 架构 | PAL-TYPE | - | PAL-TYPE | - | PAL-TYPE | PAL-TYPE | PAL-TYPE | PAL-TYPE | PAL-TYPE |
| 最大时钟频率 | 45 MHz | - | 71.4 MHz | - | 71 MHz | 45 MHz | 45.5 MHz | 45 MHz | 45.5 MHz |
| JESD-30 代码 | R-PDIP-T20 | - | R-PDSO-G20 | - | S-PQCC-J20 | R-PDIP-T20 | R-PDSO-G20 | S-PQCC-J20 | R-PDSO-G20 |
| JESD-609代码 | e0 | - | e0 | - | e0 | e0 | e0 | e0 | e0 |
| 长度 | 25.908 mm | - | 12.8 mm | - | 8.966 mm | 25.908 mm | 6.5 mm | 8.966 mm | 6.5 mm |
| 湿度敏感等级 | 1 | - | 2 | - | 2 | 1 | 2 | 2 | 2 |
| 专用输入次数 | 7 | - | 7 | - | 7 | 7 | 7 | 7 | 7 |
| I/O 线路数量 | 8 | - | 8 | - | 8 | 8 | 8 | 8 | 8 |
| 输入次数 | 18 | - | 18 | - | 18 | 18 | 18 | 18 | 18 |
| 输出次数 | 8 | - | 8 | - | 8 | 8 | 8 | 8 | 8 |
| 产品条款数 | 64 | - | 64 | - | 64 | 64 | 64 | 64 | 64 |
| 端子数量 | 20 | - | 20 | - | 20 | 20 | 20 | 20 | 20 |
| 最高工作温度 | 70 °C | - | 85 °C | - | 85 °C | 85 °C | 70 °C | 70 °C | 85 °C |
| 组织 | 7 DEDICATED INPUTS, 8 I/O | - | 7 DEDICATED INPUTS, 8 I/O | - | 7 DEDICATED INPUTS, 8 I/O | 7 DEDICATED INPUTS, 8 I/O | 7 DEDICATED INPUTS, 8 I/O | 7 DEDICATED INPUTS, 8 I/O | 7 DEDICATED INPUTS, 8 I/O |
| 输出函数 | MACROCELL | - | MACROCELL | - | MACROCELL | MACROCELL | MACROCELL | MACROCELL | MACROCELL |
| 封装主体材料 | PLASTIC/EPOXY | - | PLASTIC/EPOXY | - | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY |
| 封装代码 | DIP | - | SOP | - | QCCJ | DIP | TSSOP | QCCJ | TSSOP |
| 封装等效代码 | DIP20,.3 | - | SOP20,.4 | - | LDCC20,.4SQ | DIP20,.3 | TSSOP20,.25 | LDCC20,.4SQ | TSSOP20,.25 |
| 封装形状 | RECTANGULAR | - | RECTANGULAR | - | SQUARE | RECTANGULAR | RECTANGULAR | SQUARE | RECTANGULAR |
| 封装形式 | IN-LINE | - | SMALL OUTLINE | - | CHIP CARRIER | IN-LINE | SMALL OUTLINE, THIN PROFILE, SHRINK PITCH | CHIP CARRIER | SMALL OUTLINE, THIN PROFILE, SHRINK PITCH |
| 峰值回流温度（摄氏度） | 225 | - | 240 | - | 225 | 225 | 240 | 225 | 240 |
| 电源 | 3.3/5 V | - | 3.3/5 V | - | 3.3/5 V | 3.3/5 V | 3.3/5 V | 3.3/5 V | 3.3/5 V |
| 可编程逻辑类型 | FLASH PLD | - | FLASH PLD | - | FLASH PLD | FLASH PLD | FLASH PLD | FLASH PLD | FLASH PLD |
| 传播延迟 | 15 ns | - | 10 ns | - | 10 ns | 15 ns | 15 ns | 15 ns | 15 ns |
| 认证状态 | Not Qualified | - | Not Qualified | - | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified |
| 座面最大高度 | 5.334 mm | - | 2.65 mm | - | 4.572 mm | 5.334 mm | 1.2 mm | 4.572 mm | 1.2 mm |
| 最大供电电压 | 5.5 V | - | 5.5 V | - | 5.5 V | 5.5 V | 5.5 V | 5.5 V | 5.5 V |
| 最小供电电压 | 3 V | - | 3 V | - | 3 V | 3 V | 3 V | 3 V | 3 V |
| 标称供电电压 | 3.3 V | - | 3.3 V | - | 3.3 V | 3.3 V | 3.3 V | 3.3 V | 3.3 V |
| 表面贴装 | NO | - | YES | - | YES | NO | YES | YES | YES |
| 技术 | CMOS | - | CMOS | - | CMOS | CMOS | CMOS | CMOS | CMOS |
| 温度等级 | COMMERCIAL | - | INDUSTRIAL | - | INDUSTRIAL | INDUSTRIAL | COMMERCIAL | COMMERCIAL | INDUSTRIAL |
| 端子面层 | Tin/Lead (Sn/Pb) | - | Tin/Lead (Sn/Pb) | - | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) |
| 端子形式 | THROUGH-HOLE | - | GULL WING | - | J BEND | THROUGH-HOLE | GULL WING | J BEND | GULL WING |
| 端子节距 | 2.54 mm | - | 1.27 mm | - | 1.27 mm | 2.54 mm | 0.65 mm | 1.27 mm | 0.65 mm |
| 端子位置 | DUAL | - | DUAL | - | QUAD | DUAL | DUAL | QUAD | DUAL |
| 处于峰值回流温度下的最长时间 | 30 | - | 30 | - | 30 | 30 | 30 | 30 | 30 |
| 宽度 | 7.62 mm | - | 7.5 mm | - | 8.966 mm | 7.62 mm | 4.4 mm | 8.966 mm | 4.4 mm |
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