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MSC23240BL-80BS20

产品描述Fast Page DRAM Module, 2MX40, 80ns, CMOS, SIMM-72
产品类别存储    存储   
文件大小236KB,共8页
制造商OKI
官网地址http://www.oki.com
下载文档 详细参数 选型对比 全文预览

MSC23240BL-80BS20概述

Fast Page DRAM Module, 2MX40, 80ns, CMOS, SIMM-72

MSC23240BL-80BS20规格参数

参数名称属性值
厂商名称OKI
零件包装代码SIMM
包装说明,
针数72
Reach Compliance Codeunknow
ECCN代码EAR99
访问模式FAST PAGE
最长访问时间80 ns
其他特性RAS ONLY/CAS BEFORE RAS/HIDDEN REFRESH; TEST MODE; PRESENCE DETECT PINS
JESD-30 代码R-XSMA-N72
内存密度83886080 bi
内存集成电路类型FAST PAGE DRAM MODULE
内存宽度40
功能数量1
端口数量1
端子数量72
字数2097152 words
字数代码2000000
工作模式ASYNCHRONOUS
最高工作温度70 °C
最低工作温度
组织2MX40
输出特性3-STATE
封装主体材料UNSPECIFIED
封装形状RECTANGULAR
封装形式MICROELECTRONIC ASSEMBLY
认证状态Not Qualified
刷新周期1024
最大供电电压 (Vsup)5.5 V
最小供电电压 (Vsup)4.5 V
标称供电电压 (Vsup)5 V
表面贴装NO
技术CMOS
温度等级COMMERCIAL
端子形式NO LEAD
端子位置SINGLE

MSC23240BL-80BS20相似产品对比

MSC23240BL-80BS20 MSC23240B-10BS20 MSC23240B-10DS20 MSC23240BL-80DS20 MSC23240BL-10DS20 MSC23240BL-10BS20 MSC23240BL-60DS20 MSC23240BL-60BS20 MSC23240BL-70BS20 MSC23240BL-70DS20
描述 Fast Page DRAM Module, 2MX40, 80ns, CMOS, SIMM-72 Fast Page DRAM Module, 2MX40, 100ns, CMOS, SIMM-72 Fast Page DRAM Module, 2MX40, 100ns, CMOS, SIMM-72 Fast Page DRAM Module, 2MX40, 80ns, CMOS, SIMM-72 Fast Page DRAM Module, 2MX40, 100ns, CMOS, SIMM-72 Fast Page DRAM Module, 2MX40, 100ns, CMOS, SIMM-72 Fast Page DRAM Module, 2MX40, 60ns, CMOS, SIMM-72 Fast Page DRAM Module, 2MX40, 60ns, CMOS, SIMM-72 Fast Page DRAM Module, 2MX40, 70ns, CMOS, SIMM-72 Fast Page DRAM Module, 2MX40, 70ns, CMOS, SIMM-72
厂商名称 OKI OKI OKI OKI OKI OKI OKI OKI OKI OKI
零件包装代码 SIMM SIMM SIMM SIMM SIMM SIMM SIMM SIMM SIMM SIMM
针数 72 72 72 72 72 72 72 72 72 72
Reach Compliance Code unknow unknown unknown unknown unknown unknown unknown unknown unknown unknown
ECCN代码 EAR99 EAR99 EAR99 EAR99 EAR99 EAR99 EAR99 EAR99 EAR99 EAR99
访问模式 FAST PAGE FAST PAGE FAST PAGE FAST PAGE FAST PAGE FAST PAGE FAST PAGE FAST PAGE FAST PAGE FAST PAGE
最长访问时间 80 ns 100 ns 100 ns 80 ns 100 ns 100 ns 60 ns 60 ns 70 ns 70 ns
其他特性 RAS ONLY/CAS BEFORE RAS/HIDDEN REFRESH; TEST MODE; PRESENCE DETECT PINS RAS ONLY/CAS BEFORE RAS/HIDDEN REFRESH; TEST MODE; PRESENCE DETECT PINS RAS ONLY/CAS BEFORE RAS/HIDDEN REFRESH; TEST MODE; PRESENCE DETECT PINS RAS ONLY/CAS BEFORE RAS/HIDDEN REFRESH; TEST MODE; PRESENCE DETECT PINS RAS ONLY/CAS BEFORE RAS/HIDDEN REFRESH; TEST MODE; PRESENCE DETECT PINS RAS ONLY/CAS BEFORE RAS/HIDDEN REFRESH; TEST MODE; PRESENCE DETECT PINS RAS ONLY/CAS BEFORE RAS/HIDDEN REFRESH; TEST MODE; PRESENCE DETECT PINS RAS ONLY/CAS BEFORE RAS/HIDDEN REFRESH; TEST MODE; PRESENCE DETECT PINS RAS ONLY/CAS BEFORE RAS/HIDDEN REFRESH; TEST MODE; PRESENCE DETECT PINS RAS ONLY/CAS BEFORE RAS/HIDDEN REFRESH; TEST MODE; PRESENCE DETECT PINS
JESD-30 代码 R-XSMA-N72 R-XSMA-N72 R-XSMA-N72 R-XSMA-N72 R-XSMA-N72 R-XSMA-N72 R-XSMA-N72 R-XSMA-N72 R-XSMA-N72 R-XSMA-N72
内存密度 83886080 bi 83886080 bit 83886080 bit 83886080 bit 83886080 bit 83886080 bit 83886080 bit 83886080 bit 83886080 bit 83886080 bit
内存集成电路类型 FAST PAGE DRAM MODULE FAST PAGE DRAM MODULE FAST PAGE DRAM MODULE FAST PAGE DRAM MODULE FAST PAGE DRAM MODULE FAST PAGE DRAM MODULE FAST PAGE DRAM MODULE FAST PAGE DRAM MODULE FAST PAGE DRAM MODULE FAST PAGE DRAM MODULE
内存宽度 40 40 40 40 40 40 40 40 40 40
功能数量 1 1 1 1 1 1 1 1 1 1
端口数量 1 1 1 1 1 1 1 1 1 1
端子数量 72 72 72 72 72 72 72 72 72 72
字数 2097152 words 2097152 words 2097152 words 2097152 words 2097152 words 2097152 words 2097152 words 2097152 words 2097152 words 2097152 words
字数代码 2000000 2000000 2000000 2000000 2000000 2000000 2000000 2000000 2000000 2000000
工作模式 ASYNCHRONOUS ASYNCHRONOUS ASYNCHRONOUS ASYNCHRONOUS ASYNCHRONOUS ASYNCHRONOUS ASYNCHRONOUS ASYNCHRONOUS ASYNCHRONOUS ASYNCHRONOUS
最高工作温度 70 °C 70 °C 70 °C 70 °C 70 °C 70 °C 70 °C 70 °C 70 °C 70 °C
组织 2MX40 2MX40 2MX40 2MX40 2MX40 2MX40 2MX40 2MX40 2MX40 2MX40
输出特性 3-STATE 3-STATE 3-STATE 3-STATE 3-STATE 3-STATE 3-STATE 3-STATE 3-STATE 3-STATE
封装主体材料 UNSPECIFIED UNSPECIFIED UNSPECIFIED UNSPECIFIED UNSPECIFIED UNSPECIFIED UNSPECIFIED UNSPECIFIED UNSPECIFIED UNSPECIFIED
封装形状 RECTANGULAR RECTANGULAR RECTANGULAR RECTANGULAR RECTANGULAR RECTANGULAR RECTANGULAR RECTANGULAR RECTANGULAR RECTANGULAR
封装形式 MICROELECTRONIC ASSEMBLY MICROELECTRONIC ASSEMBLY MICROELECTRONIC ASSEMBLY MICROELECTRONIC ASSEMBLY MICROELECTRONIC ASSEMBLY MICROELECTRONIC ASSEMBLY MICROELECTRONIC ASSEMBLY MICROELECTRONIC ASSEMBLY MICROELECTRONIC ASSEMBLY MICROELECTRONIC ASSEMBLY
认证状态 Not Qualified Not Qualified Not Qualified Not Qualified Not Qualified Not Qualified Not Qualified Not Qualified Not Qualified Not Qualified
刷新周期 1024 1024 1024 1024 1024 1024 1024 1024 1024 1024
最大供电电压 (Vsup) 5.5 V 5.5 V 5.5 V 5.5 V 5.5 V 5.5 V 5.5 V 5.5 V 5.5 V 5.5 V
最小供电电压 (Vsup) 4.5 V 4.5 V 4.5 V 4.5 V 4.5 V 4.5 V 4.5 V 4.5 V 4.5 V 4.5 V
标称供电电压 (Vsup) 5 V 5 V 5 V 5 V 5 V 5 V 5 V 5 V 5 V 5 V
表面贴装 NO NO NO NO NO NO NO NO NO NO
技术 CMOS CMOS CMOS CMOS CMOS CMOS CMOS CMOS CMOS CMOS
温度等级 COMMERCIAL COMMERCIAL COMMERCIAL COMMERCIAL COMMERCIAL COMMERCIAL COMMERCIAL COMMERCIAL COMMERCIAL COMMERCIAL
端子形式 NO LEAD NO LEAD NO LEAD NO LEAD NO LEAD NO LEAD NO LEAD NO LEAD NO LEAD NO LEAD
端子位置 SINGLE SINGLE SINGLE SINGLE SINGLE SINGLE SINGLE SINGLE SINGLE SINGLE

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