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NSHC182G16TRJ1

产品描述CAPACITOR, METALLIZED FILM, POLYPHENYLENE SULPHIDE, 16V, 0.0018uF, SURFACE MOUNT, 0603, CHIP
产品类别无源元件    电容器   
文件大小117KB,共3页
制造商Nichicon(尼吉康)
官网地址http://www.nichicon.co.jp
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NSHC182G16TRJ1概述

CAPACITOR, METALLIZED FILM, POLYPHENYLENE SULPHIDE, 16V, 0.0018uF, SURFACE MOUNT, 0603, CHIP

NSHC182G16TRJ1规格参数

参数名称属性值
是否Rohs认证不符合
厂商名称Nichicon(尼吉康)
包装说明, 0603
Reach Compliance Codecompli
ECCN代码EAR99
电容0.0018 µF
电容器类型FILM CAPACITOR
介电材料POLYPHENYLENE SULPHIDE
高度0.7 mm
JESD-609代码e0
长度1.6 mm
制造商序列号NSHC
安装特点SURFACE MOUNT
负容差2%
端子数量2
最高工作温度125 °C
最低工作温度-55 °C
封装形状RECTANGULAR PACKAGE
封装形式SMT
包装方法TR, EMBOSSED PLASTIC, 7 INCH
正容差2%
额定(AC)电压(URac)12 V
额定(直流)电压(URdc)16 V
系列NSHC(0603,16 VOLT)
尺寸代码0603
表面贴装YES
端子面层Tin/Lead (Sn/Pb)
端子形状WRAPAROUND
宽度0.8 mm

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Stacked Film Capacitor Chips
FEATURES
• STACKED METALLIZED POLYPHENYLENE SULFIDE (PPS) FILM
• STANDARD EIA 0603, 0805, 1206, 1210, 1913 AND 2416 SIZES
• WIDE TEMPERATURE RANGE UP TO +125
O
C (100pF ~ 0.1µF)
• HIGH HEAT AND MOISTURE RESISTANT
• VERY STABLE TEMPERATURE, FREQUENCY, VOLTAGE, BIAS AND
nDIELECTRIC
ABSORPTION CHARACTERISTICS
• SUITABLE FOR REFLOW (100pF ~ 0.1µF) & FLOW (0.12µF ~ 0.22µF)
SOLDERING
• TAPE AND REEL PACKAGING
SPECIFICATIONS
Capacitance Range
Voltage Ratings
Capacitance Tolerance
Temperature Range
Dissipation Factor (20°C)
Insulation Resistance (20°C)
Dielectric Withstanding Voltage
Temperature Characteristic
Dielectric Absorption
o
NSHC Series
NEW
Case Sizes
0603
0805
1206
1210
1913
2416
100pF ~ 0.0027
µF
100pF ~ .01
µF
3300pF ~ .047
µF
.012
µ
F ~ .1
µF
.047
µ
F ~ .1
µF
0.12
µ
F ~ 0.22
µF
16Vdc (12Vrms), 50Vdc (40Vrms)
±5% Std, ±2% Opt
-55 C ~ +125°C (0.12
µ
F ~ 0.22
µ
F voltage derated above 105°C)
0.6% max @ 1 KHz
3 Gigohms Minimum
150% of Rated Voltage 60 Seconds
175% of Rated Voltage for 5 Seconds (except 1913 and 2416 case sizes)
±3%
C Maximum Over Temperature Range
0.05 ~ 0.10% Typical
ENVIRONMENTAL CHARACTERISTICS
Life Test At +125°C
1000 Hours at 125% of
Rated Voltage
Resistance to Soldering Heat:
+260°C Peak for 5 Seconds
(0.047
µ
F ~ 0.22
µ
F)
Humidity Load Life (Note 1):
(1) 1000 Hours, +40°C
(2) 500 Hours, +60°C
Solderability with
10% Wt Rosin-Methanol Flux
Capacitance Change
Dissipation Factor
Insulation Resistance
Capacitance Change
Dissipation Factor
Insulation Resistance
Capacitance Change
Dissipation Factor
Insulation Resistance
Within ±2% of Initial Value
0.66% Maximum
1 Gigohm Minimum
Within ±3% of Initial Value
0.66% Maximum
1 Gigohm Minimum
Within ±2% of Initial Value
0.90% Maximum
(1) 1 Gigohm Minimum
(2) 0.5 Gigohm Minimum
NSHC IS
RECOMMENDED
FOR NEW DESIGNS
90% Minimum Coverage After 5 Second Dip into 235°C Solder Pot
RECOMMENDED SOLDERING PROFILES
REFLOW SOLDERING
300
T
E
M
P
E
R
A
T
U
R
E
FLOW SOLDERING
0.12µF ~ 0.22µF only
300
Soldering
250°C Max.
RECOMMENDED LAND
PATTERN (mm)
EIA Size
0603
0805
1206
1210
1913
2416
A
0.6
0.8
1.8
1.8
2.6
3.8
B
2.0
2.4
3.6
3.6
6.6
7.8
C
0.7
1.1
1.4
2.3
3.0
3.8
250
200
°C 150
100
50
0
Pre-Heat
150°C Max.
Soldering
230°C Max.
Cool
Down
0
5 Seconds Max.
2 1/2 Minutes Max.
Less than
15 Seconds
2 Minutes Min.
3 Minutes Max.
5 Seconds Max.
2 Minutes Min.
A
B
®
NIC COMPONENTS
www.niccomp.com
www.lowESR.com
www.RFpassives.com
181
C
T
E
M
P
E
R
A
T
U
R
E
250
200
°C 150
100
50
Pre-Heat
150°C Max.
Cool
Down

 
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