SURFACE MOUNT MONOLITHIC CHIP CAPACITORS
COG AND TEMPERATURE COMPENSATING TYPES
GRM36/39/40/42-6/42-2/43-2/44-1 Series
FEATURES
I
Miniature size
I
No Polarity
I
Nickel Barrier Termination Standard – highly resistant to
metal migration
I
Uniform dimensions and configuration
I
Suitable for reflow soldering
I
GRM39, 40 and 42-6 suitable for wave soldering
I
Minimum series inductance
I
Tape and Reel Packaging
I
Bulk Case Packaging available for GRM40 and smaller
I
Wide selection of capacitance values and voltages
I
Largest production capacity and volume in the world
SURFACE MOUNT
MONOLITHIC CHIP
CAPACITORS
PART NUMBERING SYSTEM
GRM40
–––
COG
101
J
050
A
D
CAPACITOR
TYPE AND SIZE
See below and
following pages.
3-digit code
appears as
necessary
to indicate
special
thickness
requirements.
Please consult
your local
sales office
for details.
TEMPERATURE
CHARACTERISTICS
COG
COH
P2H
R2H
S2H
T2H
U2J
SL
CAPACITANCE VALUE
Expressed in picofarads
and identified by a
three-digit number.
First two digits
represent significant
figures. Last digit
specifies the number
of zeros to follow.
For fractional values
below 10pF, the letter “R”
is used as the decimal
point and the last digit
becomes significant.
CAPACITANCE
TOLERANCE
*= Standard
5pf:
B = ±.1pf
*C = ±.25pf
>5pf to 10pf:
B = ±.1pf
C = ±.25pf
*D = ±.5pf
>10pf:
K = ±10%
*J = ±5%
G = ±2%
F = ±1%
VOLTAGE
Identified
by a
three-digit
number.
MARKING
A = Unmarked
PACKAGING
Reel Diameter/
Tape Material
Code
7” Paper Tape
D
7” Plastic Tape
L
13” Paper Tape
J
13” Plastic Tape
K
Bulk
B
Bulk Cassette
C
7” Paper
Q
2mm pitch
See pages 115 -118 for labeling and
packaging information.
CHIP DIMENSIONS
Dimensions: mm
Size
GRM36
GRM39*
e
g
e
EIA
Code
0402
0603
0805
L
Length
1.0 ± 0.05
1.6 ± 0.1
2.0 ± 0.1
3.2 ± 0.15
3.2 ± 0.2
W
Width
0.5 ± 0.05
0.8 ± 0.1
1.25 ± 0.1
1.6 ± 0.15
1.6 ± 0.2
2.5 ± 0.2
3.2 ± 0.3
5.0 ± 0.4
GRM40
GRM42-6
T
L
W
1206
GRM42-2
GRM43-2
GRM44-1
1210
1812
2220
3.2 ± 0.3
4.5 ± 0.4
5.7 ± 0.4
T
Thickness
0.5 ± 0.05
0.8 ± 0.1
0.6 ± 0.1
0.85 ± 0.1
1.25 ± 0.1
0.85 ± 0.1
1.15 ± 0.1
1.6 ± 0.2
1.15 ± 0.1
1.35 ± 0.15
1.8 ± 0.2
2.5 ± 0.2
2.0 max.
2.0 max.
e (min.)
Termination
0.15 ~ 0.3
0.2 ~ 0.5
0.2 ~ 0.7
g (min.)
Insulation
0.4
0.5
0.7
0.3 ~ 0.8
1.5
0.3 min.
0.3 min.
0.3 min.
1.0
2.0
2.0
*Bulk case packaging is L = 1.6 ± 0.07, W, T = 0.8 ± 0.07.
CHIP TERMINATION DIAGRAMS
Nickel Barrier Layer (Standard)
Ceramic Dielectric
Inner Electrode
GRM Series
Inner Termination (Ag or Ag/Pd or Cu)
Nickel Plated Barrier Layer
Tin Plating*
*Size 0402 – Solder Plated
All products on this page are available as standard through authorized Murata Electronics Distributors.
CG01-J
7
SURFACE MOUNT MONOLITHIC CHIP CAPACITORS
COG AND TEMPERATURE COMPENSATING TYPES –
GRM36/39/40/42-6/42-2/43-2/44-1 Series
SPECIFICATION
GENERAL
Temperature Coefficient
C0G = 0
± 30 ppm*
C0H = 0
± 60 ppm
P2H = N150 ± 60 ppm
R2H = N220 ± 60 ppm
S2H = N330 ± 60 ppm
T2H = N470 ± 60 ppm
U2J = N750 ± 120 ppm
SL = N1000 to P350
*TC Tolerance for COG
Refer to EIA-RS198E for other limitations
Temperature Range
–55° to +125°C
–55° to +125°C
–55° to +85°C
–55° to +85°C
–55° to +85°C
–55° to +85°C
–55° to +85°C
–55° to +85°C
ELECTRICAL
TEST
Capacitance & Q
(Frequency & Voltage):
Q Limits
Insulation Resistance
(I.R.)
Dielectric Strength
(Flash)
Aging
≤1000pF
1MHz ± 100Hz @ 1.0 ± .2 Vrms
>1000pF 1kHz ± 100Hz @ 1.0 ± .2 Vrms
≤30pF:
400 + (20xC (pF))
>30pF: 1000 minimum
100,000 megohms or 1000 megohms – mfd
(whichever is less) with rated voltage applied
for 2 minutes max with 50mA limiting current
250% of rated voltage for 5 seconds with series
resistor limiting charging current to 50mA max.;
200% for 500V
Negligible
MECHANICAL
TEST
Terminal
Adhesion
Mounting
2n
Capacitor
R340
Load
Deflection
Unit: mm
45
45
Supporter
Capacitance meter
TEST METHOD
POST TEST LIMITS
≤0603
1.0 lbs.
≥0805
2.2 lbs.
No evidence of termination peeling
1mm deflection (Glass epoxy board)
No mechanical damage
Cap., DF, IR meet initial limits
Contact factory for
test limits
Glass Epoxy Board
10
Deflection
Solderability
MIL-STD-202
Method 208F
ENVIRONMENTAL
TEST
Thermal
Shock
(Air to Air)
TEST METHOD
MIL-STD-202, Method 107, Condition A
Post thermal Shock measurement shall be taken after 24 hours
stabilization.
POST TEST LIMITS
Appearance: No visual damage
C: = ±2.0% or ±0.5pF (whichever is greater)
Q: >30pF = 1,000 min.,
≤
30pF = 400 + [20 x C(pF)]
I.R.: = 100,000M min. or 1,000M • F (whichever is less)
Appearance: No defects
Capacitance: Within ±5% or ±.0.5pF (whichever is greater)
Q/D.F.: 30pF and over: Q≥350; 10pf to 30pf: Q≥275+5/2C
Q/D.F.:
10pf and below: Q≥200±10C
I.R.: 1,000M or 50M F (whichever is less)
C: Nominal Capacitance (pF)
Appearance: No defects
Capacitance: Within ±7.5% or ±.0.75pF (whichever is greater)
Q/D.F.: 30pF and over: Q≥200;
Q/D.F.:
30pf and below: Q≥100±10/3C
I.R.: 500M or 25M F (whichever is less)
C: Nominal Capacitance (pF)
Appearance: No defects
Capacitance: ±3% or ±.3pF (whichever is greater)
Q: >30pF = 500 min.,
≤30pF
= 200 + [10 x C(pF)]
I.R.: 1,000M or 50M F (whichever is less)
Flash: 250% rated voltage
Humidity,
Steady State
Maintain the capacitor at 40 ± 2°C and 90 to 95% humidity for
500 ± 12 hours. Remove and let sit for 24 ± 2 hours at room
temperature, then measure.
Humidity Load
Apply the rated voltage at 40 ± 2°C and 90 to 95% humidity for
500 ± 12 hours. Remove and let sit for 24 ± 2 hours at room
temperature, then measure. The charge/discharge current is
.
less than 50mA.
Apply 200% of rated voltage for 1000 ± 12 hours at
maximum operating temperature; 150% for 500V.
Life Test
Upon completion of above test wait 24 hours prior
to performing post testing.
STORAGE LIFE
Chip component terminations should
generally be protected from moisture.
In addition, they should also be
protected from materials containing
chlorine, sulfur compounds or any
harmful gases that could cause
degradation of the solder.
8
1. All chip components, including
tape and reel, should be kept in
an area where the temperature
is between 5°C and 40°C and
where the humidity is 20% to 70%.
2. The chip components should be
used within six months.
3. The solderability of the chip
components should be rechecked
in the event that they are not used
in six months.
4. Peel strength and shelf life of tape
are guaranteed for 1 year when
stored under afore said conditions.
CG01-J
SURFACE MOUNT MONOLITHIC CHIP CAPACITORS
COG/COH TYPE–25V/50V/100V/200V
GRM36/39/40/42-6 Series
Type (EIA Code)
Char.
Volt.
Cap. (pF)
0.5
0.75
1
1.5
2
3
4
5
6
7
8
9
10
11
12
13
15
16
18
20
22
24
27
30
33
36
39
43
47
51
56
62
68
75
82
91
100
110
120
130
150
160
180
200
220
240
270
300
330
360
390
430
470
510
560
620
680
750
820
910
1000
1100
1200
1300
1500
1600
1800
2000
2200
2400
2700
3000
3300
3600
3900
4300
4700
5100
5600
6200
6800
7500
8200
9100
10000
11000
12000
13000
15000
16000
SURFACE MOUNT
MONOLITHIC CHIP
CAPACITORS
GRM36* (0402)
COG
COH
50
25
50
GRM39 (0603)
COG
100
200
COH
25
50
GRM40 (0805)
COG
100
200
COH
25
50
GRM42-6 (1206)
COG
100
200
COH
25
Note:
Capacitance values = EIA 24 Step = 10, 11, 12, 13, 15, 16, 18, 20, 22, 24, 27, 30, 33, 36, 39, 43, 47, 51, 56, 62, 68, 75, 82, 91
*GRM36 is suited to only reflow soldering.
THICKNESS AND PACKAGING TYPES/QUANTITY
Type
GRM36
GRM39
GRM40
Thickness: T
Bulk
Taping
Bulk Case
Thickness: T
Bulk
Taping
Bulk Case
Type
(mm)
(pcs./bag) (pcs./ 178mm reel)
1
(pcs./case)
(mm)
(pcs./bag) (pcs./ 178mm reel)
1
(pcs./case)
: 0.5 ± 0.05
1000
10000
50000
: 0.85 ± 0.1
1000
4000
—
GRM42-6
2
: 0.8 ± 0.1
1000
4000
15000
: 1.15 ± 0.1
1000
3000
—
: 0.6 ± 0.1
1000
4000
10000
: 0.85 ± 0.1
1000
4000
—
1
330mm reel is available on request.
2
Bulk case packaging is T = 0.8 ± 0.07.
: 1.25 ± 0.1
1000
3000
5000
CG01-J
9
SURFACE MOUNT MONOLITHIC CHIP CAPACITORS
COG TYPE–50V/100V/200V
GRM42-2/43-2/44-1 Series
Type (EIA Code)
Char.
Volt.
Cap. (pF)
130
150
160
180
200
220
240
270
300
330
360
390
430
470
510
560
620
680
750
820
910
1000
1100
1200
1300
1500
1600
1800
2000
2200
2400
2700
3000
3300
3600
3900
4300
4700
5100
5600
6200
6800
7500
8200
9100
10000
11000
12000
13000
15000
16000
18000
20000
22000
24000
27000
30000
33000
36000
39000
43000
47000
GRM42-2 (1210)
COG
50
100
200
50
GRM43-2 (1812)
COG
100
200
50
GRM44-1 (2220)
COG
100
200
Note:
Capacitance values = EIA 24 Step = 10, 11, 12, 13, 15, 16, 18, 20, 22, 24, 27, 30, 33, 36, 39, 43, 47, 51, 56, 62, 68, 75, 82, 91
THICKNESS AND PACKAGING TYPES/QUANTITY
Type
GRM42-2
GRM43-2
GRM44-1
Thickness: T
(mm)
: 1.35 ± 0.15
: 2.0 max.
: 2.0 max.
Bulk
(pcs./bag)
1000
1000
1000
Taping
(pcs./ 178mm reel)*
2000
1000
1000
* 330mm reel is available on request.
10
CG01-J
SURFACE MOUNT MONOLITHIC CHIP CAPACITORS
TEMPERATURE COMPENSATING TYPE–25V/50V
Type (EIA Code)
Char.
Volt.
Cap. (pF)
0.5
0.75
1
1.5
2
3
4
5
6
7
8
9
10
11
12
13
15
16
18
20
22
24
27
30
33
36
39
43
47
51
56
62
68
75
82
91
100
110
120
130
150
160
180
200
220
240
270
300
330
360
390
430
470
510
560
620
680
750
820
910
1000
1100
1200
1300
1500
1600
1800
2000
2200
2400
2700
3000
3300
3600
3900
4300
4700
5100
5600
6200
6800
7500
8200
9100
10000
11000
12000
13000
15000
16000
SURFACE MOUNT
MONOLITHIC CHIP
CAPACITORS
GRM36/39 Series
S2H
50
T2H
50
U2J
50
GRM36* (0402)
SL
25
50
25
SL
50
P2H
50
GRM39 (0603)
R2H
50
Note:
Capacitance values = EIA 24 Step = 10, 11, 12, 13, 15, 16, 18, 20, 22, 24, 27, 30, 33, 36, 39, 43, 47, 51, 56, 62, 68, 75, 82, 91
*GRM36 is suited to only reflow soldering.
THICKNESS AND PACKAGING TYPES/QUANTITY
Type
GRM36
GRM39
1
Thickness: T
(mm)
: 0.5 ± 0.05
: 0.8 ± 0.1
2
Bulk
Taping
Bulk Case
1
(pcs./bag) (pcs./ 178mm reel) (pcs./case)
1000
1000
10000
4000
50000
15000
330mm reel is available on request.
2
Bulk case packaging is T = 0.8 ± 0.07.
CG01-J
11
FPGA/CPLD
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