AND Gate, 2-Func, 4-Input, CDIP14, CERAMIC, DIP-14
参数名称 | 属性值 |
是否无铅 | 含铅 |
是否Rohs认证 | 不符合 |
厂商名称 | Microsemi |
零件包装代码 | DIP |
包装说明 | DIP, |
针数 | 14 |
Reach Compliance Code | unknow |
JESD-30 代码 | R-CDIP-T14 |
JESD-609代码 | e0 |
逻辑集成电路类型 | AND GATE |
功能数量 | 2 |
输入次数 | 4 |
端子数量 | 14 |
最高工作温度 | 70 °C |
最低工作温度 | -30 °C |
输出特性 | OPEN-COLLECTOR |
封装主体材料 | CERAMIC, METAL-SEALED COFIRED |
封装代码 | DIP |
封装形状 | RECTANGULAR |
封装形式 | IN-LINE |
峰值回流温度(摄氏度) | NOT SPECIFIED |
传播延迟(tpd) | 500 ns |
认证状态 | Not Qualified |
最大供电电压 (Vsup) | 16 V |
最小供电电压 (Vsup) | 10 V |
表面贴装 | NO |
温度等级 | OTHER |
端子面层 | Tin/Lead (Sn/Pb) |
端子形式 | THROUGH-HOLE |
端子位置 | DUAL |
处于峰值回流温度下的最长时间 | NOT SPECIFIED |
TSC390CL | TSC391CL | TSC391AL | TSC395CL | TSC390AL | |
---|---|---|---|---|---|
描述 | AND Gate, 2-Func, 4-Input, CDIP14, CERAMIC, DIP-14 | AND Gate, 2-Func, 2-Input, CDIP8, CERAMIC, DIP-8 | AND Gate, 2-Func, 2-Input, CDIP8, CERAMIC, DIP-8 | NAND Gate, 2-Func, 4-Input, CDIP14, CERAMIC, DIP-14 | AND Gate, 2-Func, 4-Input, CDIP14, CERAMIC, DIP-14 |
是否无铅 | 含铅 | 含铅 | 含铅 | 含铅 | 含铅 |
是否Rohs认证 | 不符合 | 不符合 | 不符合 | 不符合 | 不符合 |
零件包装代码 | DIP | DIP | DIP | DIP | DIP |
包装说明 | DIP, | CERAMIC, DIP-8 | CERAMIC, DIP-8 | DIP, | CERAMIC, DIP-14 |
针数 | 14 | 8 | 8 | 14 | 14 |
Reach Compliance Code | unknow | unknown | unknown | unknown | unknown |
JESD-30 代码 | R-CDIP-T14 | R-CDIP-T8 | R-CDIP-T8 | R-CDIP-T14 | R-CDIP-T14 |
JESD-609代码 | e0 | e0 | e0 | e0 | e0 |
逻辑集成电路类型 | AND GATE | AND GATE | AND GATE | NAND GATE | AND GATE |
功能数量 | 2 | 2 | 2 | 2 | 2 |
输入次数 | 4 | 2 | 2 | 4 | 4 |
端子数量 | 14 | 8 | 8 | 14 | 14 |
最高工作温度 | 70 °C | 70 °C | 70 °C | 70 °C | 70 °C |
最低工作温度 | -30 °C | -30 °C | -30 °C | -30 °C | -30 °C |
输出特性 | OPEN-COLLECTOR | OPEN-COLLECTOR | OPEN-COLLECTOR | OPEN-COLLECTOR | OPEN-COLLECTOR |
封装主体材料 | CERAMIC, METAL-SEALED COFIRED | CERAMIC, METAL-SEALED COFIRED | CERAMIC, METAL-SEALED COFIRED | CERAMIC, METAL-SEALED COFIRED | CERAMIC, METAL-SEALED COFIRED |
封装代码 | DIP | DIP | DIP | DIP | DIP |
封装形状 | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR |
封装形式 | IN-LINE | IN-LINE | IN-LINE | IN-LINE | IN-LINE |
峰值回流温度(摄氏度) | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED |
传播延迟(tpd) | 500 ns | 500 ns | 500 ns | 500 ns | 500 ns |
认证状态 | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified |
最大供电电压 (Vsup) | 16 V | 16 V | 16 V | 16 V | 16 V |
最小供电电压 (Vsup) | 10 V | 10 V | 10 V | 10 V | 10 V |
表面贴装 | NO | NO | NO | NO | NO |
温度等级 | OTHER | OTHER | OTHER | OTHER | OTHER |
端子面层 | Tin/Lead (Sn/Pb) | TIN LEAD | TIN LEAD | TIN LEAD | Tin/Lead (Sn/Pb) |
端子形式 | THROUGH-HOLE | THROUGH-HOLE | THROUGH-HOLE | THROUGH-HOLE | THROUGH-HOLE |
端子位置 | DUAL | DUAL | DUAL | DUAL | DUAL |
处于峰值回流温度下的最长时间 | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED |
厂商名称 | Microsemi | Microsemi | - | Microsemi | Microsemi |
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