RISC MICROCONTROLLER
参数名称 | 属性值 |
厂商名称 | Microchip(微芯科技) |
包装说明 | UQFN-28 |
Reach Compliance Code | compli |
具有ADC | YES |
其他特性 | ALSO OPEARTES AT 16 MHZ AT 2.3V MINIMUM SUPPLY |
地址总线宽度 | |
位大小 | 8 |
最大时钟频率 | 32 MHz |
DAC 通道 | YES |
DMA 通道 | NO |
外部数据总线宽度 | |
JESD-30 代码 | S-PQCC-N28 |
长度 | 4 mm |
I/O 线路数量 | 25 |
端子数量 | 28 |
片上程序ROM宽度 | 14 |
最高工作温度 | 125 °C |
最低工作温度 | -40 °C |
PWM 通道 | YES |
封装主体材料 | PLASTIC/EPOXY |
封装代码 | HVQCCN |
封装形状 | SQUARE |
封装形式 | CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE |
ROM可编程性 | FLASH |
筛选级别 | TS 16949 |
座面最大高度 | 0.55 mm |
速度 | 32 MHz |
最大供电电压 | 5.5 V |
最小供电电压 | 2.5 V |
标称供电电压 | 3 V |
表面贴装 | YES |
技术 | CMOS |
温度等级 | AUTOMOTIVE |
端子形式 | NO LEAD |
端子节距 | 0.4 mm |
端子位置 | QUAD |
宽度 | 4 mm |
uPs/uCs/外围集成电路类型 | MICROCONTROLLER, RISC |
PIC16F18854T-E/MV | PIC16F18854T-E/SO | PIC16LF18854T-E/MV | PIC16LF18854T-E/SO | PIC16LF18854T-E/SS | |
---|---|---|---|---|---|
描述 | RISC MICROCONTROLLER | RISC MICROCONTROLLER | RISC MICROCONTROLLER | RISC MICROCONTROLLER | RISC MICROCONTROLLER |
厂商名称 | Microchip(微芯科技) | Microchip(微芯科技) | Microchip(微芯科技) | Microchip(微芯科技) | Microchip(微芯科技) |
包装说明 | UQFN-28 | SOP, | UQFN-28 | SOP, | SSOP, |
Reach Compliance Code | compli | compli | compli | compli | compli |
具有ADC | YES | YES | YES | YES | YES |
其他特性 | ALSO OPEARTES AT 16 MHZ AT 2.3V MINIMUM SUPPLY | ALSO OPEARTES AT 16 MHZ AT 2.3V MINIMUM SUPPLY | ALSO OPEARTES AT 16 MHZ AT 1.8V MINIMUM SUPPLY | ALSO OPEARTES AT 16 MHZ AT 1.8V MINIMUM SUPPLY | ALSO OPEARTES AT 16 MHZ AT 1.8V MINIMUM SUPPLY |
位大小 | 8 | 8 | 8 | 8 | 8 |
最大时钟频率 | 32 MHz | 32 MHz | 32 MHz | 32 MHz | 32 MHz |
DAC 通道 | YES | YES | YES | YES | YES |
DMA 通道 | NO | NO | NO | NO | NO |
JESD-30 代码 | S-PQCC-N28 | R-PDSO-G28 | S-PQCC-N28 | R-PDSO-G28 | R-PDSO-G28 |
长度 | 4 mm | 17.9 mm | 4 mm | 17.9 mm | 10.2 mm |
I/O 线路数量 | 25 | 25 | 25 | 25 | 25 |
端子数量 | 28 | 28 | 28 | 28 | 28 |
片上程序ROM宽度 | 14 | 14 | 14 | 14 | 14 |
最高工作温度 | 125 °C | 125 °C | 125 °C | 125 °C | 125 °C |
最低工作温度 | -40 °C | -40 °C | -40 °C | -40 °C | -40 °C |
PWM 通道 | YES | YES | YES | YES | YES |
封装主体材料 | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY |
封装代码 | HVQCCN | SOP | HVQCCN | SOP | SSOP |
封装形状 | SQUARE | RECTANGULAR | SQUARE | RECTANGULAR | RECTANGULAR |
封装形式 | CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE | SMALL OUTLINE | CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE | SMALL OUTLINE | SMALL OUTLINE, SHRINK PITCH |
ROM可编程性 | FLASH | FLASH | FLASH | FLASH | FLASH |
筛选级别 | TS 16949 | TS 16949 | TS 16949 | TS 16949 | TS 16949 |
座面最大高度 | 0.55 mm | 2.65 mm | 0.55 mm | 2.65 mm | 2 mm |
速度 | 32 MHz | 32 MHz | 32 MHz | 32 MHz | 32 MHz |
最大供电电压 | 5.5 V | 5.5 V | 3.6 V | 3.6 V | 3.6 V |
最小供电电压 | 2.5 V | 2.5 V | 2.5 V | 2.5 V | 2.5 V |
标称供电电压 | 3 V | 3 V | 3 V | 3 V | 3 V |
表面贴装 | YES | YES | YES | YES | YES |
技术 | CMOS | CMOS | CMOS | CMOS | CMOS |
温度等级 | AUTOMOTIVE | AUTOMOTIVE | AUTOMOTIVE | AUTOMOTIVE | AUTOMOTIVE |
端子形式 | NO LEAD | GULL WING | NO LEAD | GULL WING | GULL WING |
端子节距 | 0.4 mm | 1.27 mm | 0.4 mm | 1.27 mm | 0.65 mm |
端子位置 | QUAD | DUAL | QUAD | DUAL | DUAL |
宽度 | 4 mm | 7.5 mm | 4 mm | 7.5 mm | 5.3 mm |
uPs/uCs/外围集成电路类型 | MICROCONTROLLER, RISC | MICROCONTROLLER, RISC | MICROCONTROLLER, RISC | MICROCONTROLLER, RISC | MICROCONTROLLER, RISC |
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