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MCP14A0902T-E/MNY

产品描述Buffer/Inverter Based MOSFET Driver
产品类别模拟混合信号IC    驱动程序和接口   
制造商Microchip(微芯科技)
官网地址https://www.microchip.com
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MCP14A0902T-E/MNY概述

Buffer/Inverter Based MOSFET Driver

MCP14A0902T-E/MNY规格参数

参数名称属性值
厂商名称Microchip(微芯科技)
Reach Compliance Codecompli
ECCN代码EAR99
Factory Lead Time6 weeks
接口集成电路类型BUFFER OR INVERTER BASED MOSFET DRIVER

MCP14A0902T-E/MNY相似产品对比

MCP14A0902T-E/MNY MCP14A0902-E/SN MCP14A0902-E/MS MCP14A0902-E/MSVAO MCP14A0902-E/SNVAO MCP14A0902T-E/MNYVAO MCP14A0902T-E/MS MCP14A0902T-E/MSVAO MCP14A0902T-E/SN MCP14A0902T-E/SNVAO
描述 Buffer/Inverter Based MOSFET Driver Buffer/Inverter Based MOSFET Driver Buffer/Inverter Based MOSFET Driver, PDSO8 Buffer/Inverter Based MOSFET Driver, PDSO8 Buffer/Inverter Based MOSFET Driver, PDSO8 Buffer/Inverter Based MOSFET Driver, PDSO8 Buffer/Inverter Based MOSFET Driver, PDSO8 Buffer/Inverter Based MOSFET Driver, PDSO8 Buffer/Inverter Based MOSFET Driver Buffer/Inverter Based MOSFET Driver, PDSO8
厂商名称 Microchip(微芯科技) Microchip(微芯科技) Microchip(微芯科技) Microchip(微芯科技) Microchip(微芯科技) Microchip(微芯科技) Microchip(微芯科技) Microchip(微芯科技) Microchip(微芯科技) Microchip(微芯科技)
Reach Compliance Code compli compli compli compli compli compli compli compli compli compli
接口集成电路类型 BUFFER OR INVERTER BASED MOSFET DRIVER BUFFER OR INVERTER BASED MOSFET DRIVER BUFFER OR INVERTER BASED MOSFET DRIVER BUFFER OR INVERTER BASED MOSFET DRIVER BUFFER OR INVERTER BASED MOSFET DRIVER BUFFER OR INVERTER BASED MOSFET DRIVER BUFFER OR INVERTER BASED MOSFET DRIVER BUFFER OR INVERTER BASED MOSFET DRIVER BUFFER OR INVERTER BASED MOSFET DRIVER BUFFER OR INVERTER BASED MOSFET DRIVER
ECCN代码 EAR99 - EAR99 EAR99 EAR99 EAR99 EAR99 EAR99 EAR99 EAR99
包装说明 - - MSOP-8 MSOP-8 SOIC-8 TDFN-8 MSOP-8 MSOP-8 - SOIC-8
高边驱动器 - - NO NO NO NO NO NO - NO
JESD-30 代码 - - S-PDSO-G8 S-PDSO-G8 R-PDSO-G8 R-PDSO-N8 S-PDSO-G8 S-PDSO-G8 - R-PDSO-G8
长度 - - 3 mm 3 mm 4.9 mm 3 mm 3 mm 3 mm - 4.9 mm
功能数量 - - 1 1 1 1 1 1 - 1
端子数量 - - 8 8 8 8 8 8 - 8
最高工作温度 - - 125 °C 125 °C 125 °C 125 °C 125 °C 125 °C - 125 °C
最低工作温度 - - -40 °C -40 °C -40 °C -40 °C -40 °C -40 °C - -40 °C
封装主体材料 - - PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY - PLASTIC/EPOXY
封装代码 - - TSSOP TSSOP SOP HVSON TSSOP TSSOP - SOP
封装形状 - - SQUARE SQUARE RECTANGULAR RECTANGULAR SQUARE SQUARE - RECTANGULAR
封装形式 - - SMALL OUTLINE, THIN PROFILE, SHRINK PITCH SMALL OUTLINE, THIN PROFILE, SHRINK PITCH SMALL OUTLINE SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE SMALL OUTLINE, THIN PROFILE, SHRINK PITCH SMALL OUTLINE, THIN PROFILE, SHRINK PITCH - SMALL OUTLINE
筛选级别 - - TS 16949 AEC-Q100; TS 16949 AEC-Q100; TS 16949 AEC-Q100; TS 16949 TS 16949 AEC-Q100; TS 16949 - AEC-Q100; TS 16949
座面最大高度 - - 1.1 mm 1.1 mm 1.75 mm 0.8 mm 1.1 mm 1.1 mm - 1.75 mm
最大供电电压 - - 18 V 18 V 18 V 18 V 18 V 18 V - 18 V
最小供电电压 - - 4.5 V 4.5 V 4.5 V 4.5 V 4.5 V 4.5 V - 4.5 V
表面贴装 - - YES YES YES YES YES YES - YES
温度等级 - - AUTOMOTIVE AUTOMOTIVE AUTOMOTIVE AUTOMOTIVE AUTOMOTIVE AUTOMOTIVE - AUTOMOTIVE
端子形式 - - GULL WING GULL WING GULL WING NO LEAD GULL WING GULL WING - GULL WING
端子节距 - - 0.65 mm 0.65 mm 1.27 mm 0.5 mm 0.65 mm 0.65 mm - 1.27 mm
端子位置 - - DUAL DUAL DUAL DUAL DUAL DUAL - DUAL
宽度 - - 3 mm 3 mm 3.9 mm 2 mm 3 mm 3 mm - 3.9 mm

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