IC 6-CH 10-BIT SUCCESSIVE APPROXIMATION ADC, SERIAL ACCESS, CDIP18, CERAMIC, DIP-18, Analog to Digital Converter
| 参数名称 | 属性值 |
| 是否Rohs认证 | 不符合 |
| 厂商名称 | Linear ( ADI ) |
| 零件包装代码 | DIP |
| 包装说明 | DIP, DIP18,.3 |
| 针数 | 18 |
| Reach Compliance Code | unknow |
| ECCN代码 | EAR99 |
| 最大模拟输入电压 | 5.05 V |
| 最小模拟输入电压 | -0.05 V |
| 最长转换时间 | 20 µs |
| 转换器类型 | ADC, SUCCESSIVE APPROXIMATION |
| JESD-30 代码 | R-GDIP-T18 |
| JESD-609代码 | e0 |
| 最大线性误差 (EL) | 0.0488% |
| 标称负供电电压 | -5 V |
| 模拟输入通道数量 | 6 |
| 位数 | 10 |
| 功能数量 | 1 |
| 端子数量 | 18 |
| 最高工作温度 | 125 °C |
| 最低工作温度 | -55 °C |
| 输出位码 | 2\'S COMPLEMENT BINARY |
| 输出格式 | SERIAL |
| 封装主体材料 | CERAMIC, GLASS-SEALED |
| 封装代码 | DIP |
| 封装等效代码 | DIP18,.3 |
| 封装形状 | RECTANGULAR |
| 封装形式 | IN-LINE |
| 峰值回流温度（摄氏度） | NOT SPECIFIED |
| 电源 | 5,10,0/-5 V |
| 认证状态 | Not Qualified |
| 采样速率 | 0.025 MHz |
| 采样并保持/跟踪并保持 | SAMPLE |
| 座面最大高度 | 5.08 mm |
| 标称供电电压 | 5 V |
| 表面贴装 | NO |
| 技术 | CMOS |
| 温度等级 | MILITARY |
| 端子面层 | Tin/Lead (Sn/Pb) |
| 端子形式 | THROUGH-HOLE |
| 端子节距 | 2.54 mm |
| 端子位置 | DUAL |
| 处于峰值回流温度下的最长时间 | NOT SPECIFIED |
| 宽度 | 7.62 mm |
| LTC1095BMJ | 5-1393127-0 | LTC1095CCN | LTC1095BCJ | LTC1095CMJ | LTC1095CCJ | |
|---|---|---|---|---|---|---|
| 描述 | IC 6-CH 10-BIT SUCCESSIVE APPROXIMATION ADC, SERIAL ACCESS, CDIP18, CERAMIC, DIP-18, Analog to Digital Converter | Magnetic blowouts available for switching DC loads | IC 6-CH 10-BIT SUCCESSIVE APPROXIMATION ADC, SERIAL ACCESS, PDIP18, PLASTIC, DIP-18, Analog to Digital Converter | IC 6-CH 10-BIT SUCCESSIVE APPROXIMATION ADC, SERIAL ACCESS, CDIP18, CERAMIC, DIP-18, Analog to Digital Converter | IC 6-CH 10-BIT SUCCESSIVE APPROXIMATION ADC, SERIAL ACCESS, CDIP18, CERAMIC, DIP-18, Analog to Digital Converter | IC 6-CH 10-BIT SUCCESSIVE APPROXIMATION ADC, SERIAL ACCESS, CDIP18, CERAMIC, DIP-18, Analog to Digital Converter |
| 是否Rohs认证 | 不符合 | - | 不符合 | 不符合 | 不符合 | 不符合 |
| 厂商名称 | Linear ( ADI ) | - | Linear ( ADI ) | Linear ( ADI ) | Linear ( ADI ) | Linear ( ADI ) |
| 零件包装代码 | DIP | - | DIP | DIP | DIP | DIP |
| 包装说明 | DIP, DIP18,.3 | - | DIP, DIP18,.3 | DIP, DIP18,.3 | DIP, DIP18,.3 | DIP, DIP18,.3 |
| 针数 | 18 | - | 18 | 18 | 18 | 18 |
| Reach Compliance Code | unknow | - | compliant | unknown | unknown | unknow |
| ECCN代码 | EAR99 | - | EAR99 | EAR99 | EAR99 | EAR99 |
| 最大模拟输入电压 | 5.05 V | - | 5.05 V | 5.05 V | 5.05 V | 5.05 V |
| 最小模拟输入电压 | -0.05 V | - | -0.05 V | -0.05 V | -0.05 V | -0.05 V |
| 最长转换时间 | 20 µs | - | 20 µs | 20 µs | 20 µs | 20 µs |
| 转换器类型 | ADC, SUCCESSIVE APPROXIMATION | - | ADC, SUCCESSIVE APPROXIMATION | ADC, SUCCESSIVE APPROXIMATION | ADC, SUCCESSIVE APPROXIMATION | ADC, SUCCESSIVE APPROXIMATION |
| JESD-30 代码 | R-GDIP-T18 | - | R-PDIP-T18 | R-GDIP-T18 | R-GDIP-T18 | R-GDIP-T18 |
| JESD-609代码 | e0 | - | e0 | e0 | e0 | e0 |
| 最大线性误差 (EL) | 0.0488% | - | 0.0488% | 0.0488% | 0.0488% | 0.0488% |
| 标称负供电电压 | -5 V | - | -5 V | -5 V | -5 V | -5 V |
| 模拟输入通道数量 | 6 | - | 6 | 6 | 6 | 6 |
| 位数 | 10 | - | 10 | 10 | 10 | 10 |
| 功能数量 | 1 | - | 1 | 1 | 1 | 1 |
| 端子数量 | 18 | - | 18 | 18 | 18 | 18 |
| 最高工作温度 | 125 °C | - | 85 °C | 85 °C | 125 °C | 85 °C |
| 最低工作温度 | -55 °C | - | -40 °C | -40 °C | -55 °C | -40 °C |
| 输出位码 | 2\'S COMPLEMENT BINARY | - | 2\'S COMPLEMENT BINARY | 2\'S COMPLEMENT BINARY | 2\'S COMPLEMENT BINARY | 2\'S COMPLEMENT BINARY |
| 输出格式 | SERIAL | - | SERIAL | SERIAL | SERIAL | SERIAL |
| 封装主体材料 | CERAMIC, GLASS-SEALED | - | PLASTIC/EPOXY | CERAMIC, GLASS-SEALED | CERAMIC, GLASS-SEALED | CERAMIC, GLASS-SEALED |
| 封装代码 | DIP | - | DIP | DIP | DIP | DIP |
| 封装等效代码 | DIP18,.3 | - | DIP18,.3 | DIP18,.3 | DIP18,.3 | DIP18,.3 |
| 封装形状 | RECTANGULAR | - | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR |
| 封装形式 | IN-LINE | - | IN-LINE | IN-LINE | IN-LINE | IN-LINE |
| 峰值回流温度（摄氏度） | NOT SPECIFIED | - | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED |
| 电源 | 5,10,0/-5 V | - | 5,10,0/-5 V | 5,10,0/-5 V | 5,10,0/-5 V | 5,10,0/-5 V |
| 认证状态 | Not Qualified | - | Not Qualified | Not Qualified | Not Qualified | Not Qualified |
| 采样速率 | 0.025 MHz | - | 0.025 MHz | 0.025 MHz | 0.025 MHz | 0.025 MHz |
| 采样并保持/跟踪并保持 | SAMPLE | - | SAMPLE | SAMPLE | SAMPLE | SAMPLE |
| 座面最大高度 | 5.08 mm | - | 3.937 mm | 5.08 mm | 5.08 mm | 5.08 mm |
| 标称供电电压 | 5 V | - | 5 V | 5 V | 5 V | 5 V |
| 表面贴装 | NO | - | NO | NO | NO | NO |
| 技术 | CMOS | - | CMOS | CMOS | CMOS | CMOS |
| 温度等级 | MILITARY | - | INDUSTRIAL | INDUSTRIAL | MILITARY | INDUSTRIAL |
| 端子面层 | Tin/Lead (Sn/Pb) | - | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) |
| 端子形式 | THROUGH-HOLE | - | THROUGH-HOLE | THROUGH-HOLE | THROUGH-HOLE | THROUGH-HOLE |
| 端子节距 | 2.54 mm | - | 2.54 mm | 2.54 mm | 2.54 mm | 2.54 mm |
| 端子位置 | DUAL | - | DUAL | DUAL | DUAL | DUAL |
| 处于峰值回流温度下的最长时间 | NOT SPECIFIED | - | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED |
| 宽度 | 7.62 mm | - | 7.62 mm | 7.62 mm | 7.62 mm | 7.62 mm |
DSP 与 ARM 处理器
微控制器 MCU
嵌入式系统
Silicon Labs测评专区
无线连接
电子工程世界版权所有
京B2-20211791
京ICP备10001474号-1
电信业务审批[2006]字第258号函
京公网安备 11010802033920号
Copyright © 2005-2026 EEWORLD.com.cn, Inc. All rights reserved
电子工程世界
