Surface Mount Multilayer Ceramic Chip Capacitors (SMD MLCCs)
Telecom “Tip and Ring” X7R Dielectric, 250 VDC
(Commercial Grade)
Overview
KEMET’s 250 V DC Tip and Ring MLCCs in X7R dielectric are
designed and rated for telecommunication ringer circuits where
the capacitor is used to block -48 V to -52 V DC of line voltage
and pass a 16 – 25 Hz AC signal pulse of 70 VRMs to 90 VRMs.
Serving as an excellent replacement for high voltage leaded
film devices, these smaller surface mount technology footprints
save valuable board space which is critical when creating new
designs.
KEMET Tip and Ring capacitors feature a 125°C maximum
operating temperature and are considered “temperature
stable.” The Electronics Components, Assemblies & Materials
Association (EIA) characterizes X7R dielectric as a Class II
material. Components of this classification are fixed, ceramic
dielectric capacitors suited for bypass and decoupling applications
or for frequency discriminating circuits where Q and stability
of capacitance characteristics are not critical. X7R dielectric
exhibits a predictable change in capacitance with respect to time
and voltage and boasts a minimal change in capacitance with
reference to ambient temperature. Capacitance change is limited
to ±15% from -55°C to +125°C.
These devices are able to withstand today’s higher lead-free reflow
processing temperatures and offer superior high frequency filtering
characteristics and low ESR.
Benefits
•
•
•
•
•
•
•
•
-55°C to +125°C operating temperature range
Pb-Free and RoHS Compliant
EIA 0805, 1206, 1210, 1812, 1825, 2220, and 2225 case sizes
DC voltage rating of 250 V
Capacitance offerings ranging from 1,000 pF to 6.8 μF
Available capacitance tolerances of ±10% and ±20%
Non-polar device, minimizing installation concerns
100% pure matte tin-plated termination finish that allows for
excellent solderability
• SnPb termination finish option available upon request (5%
minimum)
• Flexible termination option available upon request
Ordering Information
C
Ceramic
1825
Case Size
(L" x W")
0805
1206
1210
1812
1825
2220
2225
C
Specification/
Series
C = Standard
X = Flexible
Termination
105
Capacitance
Code (pF)
2 Significant Digits +
Number of Zeros
K
Capacitance
Tolerance
J = ±5%
K = ±10%
M = ±20%
A
Voltage
A = 250 V
R
Dielectric
R = X7R
A
Failure Rate/
Design
A = N/A
C
Termination Finish
1
C = 100% Matte Sn
L = SnPb (5%
minimum)
TU
Packaging/Grade
(C-Spec)
2
Blank = Bulk
TU = 7" Reel
Unmarked
TM = 7" Reel
Marked
1
2
Additional termination finish options may be available. Contact KEMET for details.
Additional reeling or packaging options may be available. Contact KEMET for details.
One world. One KEMET
© KEMET Electronics Corporation • P.O. Box 5928 • Greenville, SC 29606 (864) 963-6300 • www.kemet.com
C1011_X7R_TIP_RING_SMD • 1/14/2013
1
Surface Mount Multilayer Ceramic Chip Capacitors (SMD MLCCs) – Telecom "Tip and Ring,” X7R Dielectric, 250 VDC, (Commercial Grade)
Dimensions – Millimeters (Inches) – Standard Termination
W
T
S
L
B
Nickel Plate
Electrodes
Conductive Metalization
100% Tin or SnPb Plate
EIA
Size
Code
0805
1206
1210
1812
1825
2220
2225
Metric
Size
Code
2012
3216
3225
4532
4564
5650
5664
L
Length
W
Width
T
Thickness
B
Bandwidth
0.50 (0.02) ± 0.25 (.010)
0.50 (0.02) ± 0.25 (.010)
0.50 (0.02) ± 0.25 (.010)
S
Separation
Minimum
0.75 (.030)
Mounting
Technique
Solder Wave or
Solder Reflow
2.00 (.079) ± 0.20 (.008) 1.25 (.049) ± 0.20 (.008)
3.20 (.126) ± 0.20 (.008) 1.60 (.063) ± 0.20 (.008)
3.20 (.126) ± 0.20 (.008) 2.50 (.098) ± 0.20 (.008)
4.50 (.177) ± 0.30 (.012)
3.20 (.126) ± 0.30 (.012)
5.70 (.224) ± 0.40 (.016) 5.00 (.197) ± 0.40 (.016)
5.60 (.220) ± 0.40 (.016) 6.40 (.248) ± 0.40 (.016)
0.60 (.024) ± 0.35 (.014)
0.60 (.024) ± 0.35 (.014)
Dimensions – Millimeters (Inches) – Flexible Termination
W
T
S
L
B
Ceramic Surface Mount
See Table 2 for
0.60 (.024) ± 0.35 (.014)
Thickness
4.50 (.177) ± 0.30 (.012) 6.40 (.252) ± 0.40 (.016)
0.60 (.024) ± 0.35 (.014)
N/A
Solder Reflow Only
EIA
Size
Code
0805
1206
1210
1812
1825
2220
2225
Metric
Size
Code
2012
3216
3225
4532
4564
5650
5664
L Length
W Width
T
Thickness
B Bandwidth
0.50 (0.02) ± 0.25 (.010)
0.60 (.024) ± 0.25 (.010)
0.60 (.024) ± 0.25 (.010)
S
Separation
Minimum
0.75 (.030)
Mounting
Technique
Solder Wave or
Solder Reflow
2.00 (.079) ± 0.20 (.008) 1.25 (.049) ± 0.20 (.008)
3.30 (.130) ± 0.40 (.016) 1.60 (.063) ± 0.20 (.008)
3.30 (.130) ± 0.40 (.016) 2.50 (.098) ± 0.20 (.008)
4.50 (.178) ± 0.40 (.016)
4.60 (.181) ± 0.40 (.016)
3.20 (.126) ± 0.30 (.012)
5.90 (.232) ± 0.75 (.030) 5.00 (.197) ± 0.40 (.016)
5.90 (.232) ± 0.75 (.030) 6.40 (.248) ± 0.40 (.016)
0.70 (.028) ± 0.35 (.014)
0.70 (.028) ± 0.35 (.014)
© KEMET Electronics Corporation • P.O. Box 5928 • Greenville, SC 29606 (864) 963-6300 • www.kemet.com
Ceramic Surface Mount
See Table 2 for
0.70 (.028) ± 0.35 (.014)
Thickness
6.40 (.252) ± 0.40 (.016)
0.70 (.028) ± 0.35 (.014)
N/A
Solder Reflow Only
C1011_X7R_TIP_RING_SMD • 1/14/2013
2
Surface Mount Multilayer Ceramic Chip Capacitors (SMD MLCCs) – Telecom "Tip and Ring,” X7R Dielectric, 250 VDC, (Commercial Grade)
Applications
Typical applications include telecommunication ringing circuits, switch mode power supply snubber circuits, high voltage DC blocking
and high voltage coupling. Markets include telephone lines, analog and digital modems, facsimile machines, wireless base stations,
cable and digital video recording set-top boxes, satellite dishes, high voltage power supply, DC/DC converters, and Ethernet, POS and
ATM hardware.
Qualification/Certification
Commercial Grade products are subject to internal qualification. Details regarding test methods and conditions are referenced in
Table 4, Performance & Reliability.
Environmental Compliance
Pb-Free and RoHS Compliant (excluding SnPb termination finish option).
Electrical Parameters/Characteristics
Item
Operating Temperature Range
Capacitance Change with Reference to +25°C and 0 VDC Applied (TCC)
Aging Rate (Maximum % Capacitance Loss/Decade Hour)
Dielectric Withstanding Voltage (DWV)
Dissipation Factor (DF) Maximum Limit @ 25ºC
Insulation Resistance (IR) Limit @ 25°C
-55°C to +125°C
±15%
3.0%
250% of rated voltage
(5 ±1 seconds and charge/discharge not exceeding 50 mA)
5% (6.3 and 10 V), 3.5% (16 and 25 V) and 2.5% (50 to 250 V)
See Insulation Resistance Limit Table
(Rated voltage applied for 120 ±5 seconds @ 25°C)
Parameters/Characteristics
Regarding aging rate: Capacitance measurements (including tolerance) are indexed to a referee time of 1,000 hours.
To obtain IR limit, divide MΩ-µF value by the capacitance and compare to GΩ limit. Select the lower of the two limits.
Capacitance and dissipation factor (DF) measured under the following conditions:
1 kHz ±50 Hz and 1.0 ±0.2 Vrms if capacitance ≤ 10 µF
120 Hz ±10 Hz and 0.5 ±0.1 Vrms if capacitance >10 µF
Note: When measuring capacitance it is important to ensure the set voltage level is held constant. The HP4284 and Agilent E4980 have a feature known as
Automatic Level Control (ALC). The ALC feature should be switched to "ON."
© KEMET Electronics Corporation • P.O. Box 5928 • Greenville, SC 29606 (864) 963-6300 • www.kemet.com
C1011_X7R_TIP_RING_SMD • 1/14/2013
3
Surface Mount Multilayer Ceramic Chip Capacitors (SMD MLCCs) – Telecom "Tip and Ring,” X7R Dielectric, 250 VDC, (Commercial Grade)
Post Environmental Limits
High Temperature Life, Biased Humidity, Moisture Resistance
Dielectric
Rated DC
Voltage
> 25
X7R
16/25
< 16
All
Capacitance
Value
Dissipation Factor
(Maximum %)
3.0
5.0
7.5
±20%
10% of Initial Limit
Capacitance
Shift
Insulation
Resistance
Insulation Resistance Limit Table
EIA Case Size
0201
0402
0603
0805
1206
1210
1808
1812
1825
2220
2225
1,000 Megohm
Microfarads or 100 GΩ
N/A
< 0.012 µF
< 0.047 µF
< 0.047 µF
< 0.22 µF
< 0.39 µF
ALL
< 2.2 µF
ALL
< 10 µF
ALL
500 Megohm
Microfarads or 10 GΩ
ALL
≥ 0.012 µF
≥ 0.047 µF
≥ 0.047 µF
≥ 0.22 µF
≥ 0.39 µF
N/A
≥ 2.2 µF
N/A
≥ 10 µF
N/A
© KEMET Electronics Corporation • P.O. Box 5928 • Greenville, SC 29606 (864) 963-6300 • www.kemet.com
C1011_X7R_TIP_RING_SMD • 1/14/2013
4
Surface Mount Multilayer Ceramic Chip Capacitors (SMD MLCCs) – Telecom "Tip and Ring,” X7R Dielectric, 250 VDC, (Commercial Grade)
Table 1 – Capacitance Range/Selection Waterfall (0805 – 2225 Case Sizes)
Series
Capacitance
180 pF
220 pF
270 pF
330 pF
390 pF
470 pF
560 pF
680 pF
820 pF
1000 pF
1200 pF
1500 pF
1800 pF
2200 pF
2700 pF
3300 pF
3900 pF
4700 pF
5600 pF
6800 pF
8200 pF
10000 pF
12000 pF
15000 pF
18000 pF
22000 pF
27000 pF
33000 pF
39000 pF
47000 pF
56000 pF
68000 pF
82000 pF
0.1 µF
0.12 µF
0.15 µF
0.18 µF
0.22 µF
0.27 µF
0.33 µF
0.39 µF
0.47 µF
0.56 µF
0.68 µF
0.82 µF
1 µF
1.2 µF
C0805
A
250
C1206
A
250
C1210
A
250
C1812
A
250
C1825
A
250
C2220
A
250
C2225
A
250
Capacitance
Code
181
221
271
331
391
471
561
681
821
102
122
152
182
222
272
332
392
472
562
682
822
103
123
153
183
223
273
333
393
473
563
683
823
104
124
154
184
224
274
334
394
474
564
684
824
105
125
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
Voltage Code
Voltage DC
Capacitance
Tolerance
K
K
K
K
K
K
K
K
K
K
K
K
K
K
K
K
K
K
K
K
K
K
K
K
K
K
K
K
K
K
K
K
K
K
K
K
K
K
K
K
K
K
K
K
K
K
K
Voltage DC
Voltage Code
M
M
M
M
M
M
M
M
M
M
M
M
M
M
M
M
M
M
M
M
M
M
M
M
M
M
M
M
M
M
M
M
M
M
M
M
M
M
M
M
M
M
M
M
M
M
M
DC
DC
DC
DC
DC
DC
DC
DC
DC
DC
DC
DC
DC
DC
DC
DC
DC
DC
DC
DC
DC
DC
DC
DC
DC
DC
Product Availability and Chip Thickness Codes
See Table 2 for Chip Thickness Dimensions
EB
EB
EB
EB
EB
EB
EB
EB
EB
EB
EB
EB
EB
EB
EB
EB
EB
EB
EB
EB
ED
ED
ED
ED
EM
FB
FB
FB
FB
FB
FB
FB
FB
FB
FB
FB
FB
FB
FB
FB
FB
FC
FC
FC
FF
FG
GB
GB
GB
GB
GB
GB
GB
GB
GB
GB
GB
GB
GB
GB
GB
GB
GE
GG
GG
GG
GG
GG
GJ
HB
HB
HB
HB
HB
HB
HB
HB
HB
HB
HB
HB
HB
HB
HB
HD
HD
HD
HD
HF
HF
250
A
JC
JC
JC
JC
JC
JC
JC
JC
JC
JC
JD
JD
JF
JF
250
A
KC
KC
KC
KC
KC
KC
KC
KC
KD
KD
KD
KE
KE
KE
250
A
250
A
250
A
250
A
250
A
Capacitance
Capacitance
Code
Series
C0805
C1206
C1210
C1812
C1825
C2220
C2225
© KEMET Electronics Corporation • P.O. Box 5928 • Greenville, SC 29606 (864) 963-6300 • www.kemet.com
C1011_X7R_TIP_RING_SMD • 1/14/2013
5
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