Datasheet> 器件分类 > 嵌入式处理器和控制器> 微控制器和处理器> KP80526NY700128

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KP80526NY700128: 产品描述Microprocessor, 32-Bit, 700MHz, CMOS, CPGA495, MICRO, PGA2-495; 产品类别嵌入式处理器和控制器微控制器和处理器; 文件大小862KB，共80页; 制造商Intel(英特尔); 官网地址http://www.intel.com/

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KP80526NY700128概述

Microprocessor, 32-Bit, 700MHz, CMOS, CPGA495, MICRO, PGA2-495

KP80526NY700128规格参数

参数名称	属性值
是否Rohs认证	不符合
厂商名称	Intel(英特尔)
零件包装代码	PGA
包装说明	SPGA, PGA495,21X24,50
针数	495
Reach Compliance Code	unknow
ECCN代码	3A001.A.3
地址总线宽度	36
位大小	32
边界扫描	YES
最大时钟频率	100 MHz
外部数据总线宽度	64
格式	FLOATING POINT
集成缓存	YES
JESD-30 代码	R-CPGA-P495
JESD-609代码	e0
长度	34.21 mm
低功率模式	YES
端子数量	495
封装主体材料	CERAMIC, METAL-SEALED COFIRED
封装代码	SPGA
封装等效代码	PGA495,21X24,50
封装形状	RECTANGULAR
封装形式	GRID ARRAY, SHRINK PITCH
峰值回流温度（摄氏度）	NOT SPECIFIED
电源	1.5,1.6 V
认证状态	Not Qualified
座面最大高度	3.73 mm
速度	700 MHz
最大供电电压	1.715 V
最小供电电压	1.485 V
标称供电电压	1.6 V
表面贴装	NO
技术	CMOS
端子面层	Tin/Lead (Sn/Pb)
端子形式	PIN/PEG
端子节距	1.27 mm
端子位置	PERPENDICULAR
处于峰值回流温度下的最长时间	NOT SPECIFIED
宽度	28.27 mm
uPs/uCs/外围集成电路类型	MICROPROCESSOR

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Mobile Intel Celeron Processor

(0.18µ) in BGA2 and Micro-PGA2

Packages

at 900 MHz, 850 MHz, 800 MHz, 750 MHz, 700 MHz, 650 MHz,

600 MHz, 550 MHz, 500 MHz, 450 MHz, Low-voltage 600 MHz,

Low-voltage 500 MHz, Low-voltage 400A MHz, and Ultra

Low-voltage 600 MHz, Ultra Low-voltage 500 MHz

Datasheet

October 2001

Order Number:

283654-003

Mobile Intel Celeron Processor (0.18µ) in BGA2 and Micro-PGA2 Packages

Information in this document is provided in connection with Intel products. No license, express or implied, by estoppel or otherwise, to

any intellectual property rights is granted by this document. Except as provided in Intel's Terms and Conditions of Sale for such

products, Intel assumes no liability whatsoever, and Intel disclaims any express or implied warranty, relating to sale and/or use of Intel

products including liability or warranties relating to fitness for a particular purpose, merchantability, or infringement of any patent,

copyright or other intellectual property right. Intel products are not intended for use in medical, life saving, or life sustaining applications.

Intel may make changes to specifications and product descriptions at any time, without notice.

Designers must not rely on the absence or characteristics of any features or instructions marked "reserved" or "undefined." Intel

reserves these for future definition and shall have no responsibility whatsoever for conflicts or incompatibilities arising from future

changes to them.

The mobile Intel® Celeron® processor may contain design defects or errors known as errata that may cause the product to deviate

from published specifications. Current characterized errata are available on request.

Contact your local Intel sales office or your distributor to obtain the latest specifications and before placing your product order.

Copies of documents which have an order number and are referenced in this document, or other Intel literature, may be obtained by

calling1-800-548-4725 or by visiting Intel’s web site at

http://www.intel.com

Intel® , Pentium®, Celeron® , and MMX™ are registered trademarks or trademarks of Intel Corporation or its subsidiaries in the United

States and other countries.

* Other names and brands may be claimed as the property of others.

Datasheet

283654-003

Mobile Intel Celeron Processor (0.18µ) in BGA2 and Micro-PGA2 Packages

Contents

Introduction.....................................................................................................................................9

1.1

1.2

1.3

2.1

Overview...............................................................................................................10

Terminology..........................................................................................................10

References ...........................................................................................................11

New Features in the Mobile Intel Celeron Processor...........................................12

2.1.1 On-die GTL+ Termination .......................................................................12

2.1.2 Streaming SIMD Extensions ...................................................................12

2.1.3 Signal Differences Between the Mobile Intel Celeron Processors in the

BGA1/Micro-PGA1 and the BGA2/Micro-PGA2......................................12

Power Management .............................................................................................13

2.2.1 Clock Control Architecture.......................................................................13

2.2.2 Normal State ...........................................................................................13

2.2.3 Auto Halt State ........................................................................................13

2.2.4 Stop Grant State......................................................................................14

2.2.5 Quick Start State .....................................................................................15

2.2.6 HALT/Grant Snoop State ........................................................................15

2.2.7 Sleep State ..............................................................................................15

2.2.8 Deep Sleep State ....................................................................................16

2.2.9 Operating System Implications of Low-power States .............................16

GTL+ Signals........................................................................................................17

Mobile Intel Celeron processor CPUID ................................................................17

Processor System Signals ...................................................................................18

3.1.1 Power Sequencing Requirements...........................................................19

3.1.2 Test Access Port (TAP) Connection .......................................................19

3.1.3 Catastrophic Thermal Protection.............................................................20

3.1.4 Unused Signals .......................................................................................20

3.1.5 Signal State in Low-power States ...........................................................20

3.1.5.1

System Bus Signals ..............................................................20

3.1.5.2

CMOS and Open-drain Signals.............................................20

3.1.5.3

Other Signals.........................................................................21

Power Supply Requirements................................................................................21

3.2.1 Decoupling Recommendations ...............................................................21

3.2.2 Voltage Planes ........................................................................................21

System Bus Clock and Processor Clocking .........................................................22

Maximum Ratings.................................................................................................22

DC Specifications .................................................................................................24

AC Specifications .................................................................................................28

3.6.1 System Bus, Clock, APIC, TAP, CMOS, and Open-drain AC

Specifications ..........................................................................................28

System Bus Clock (BCLK) and PICCLK AC Signal Quality Specifications .........40

Mobile Intel Celeron Processor Features ..................................................................................12

2.2

2.3

2.4

3.1

Electrical Specifications ..............................................................................................................18

3.2

3.3

3.4

3.5

3.6

System Signal Simulations .........................................................................................................40

4.1

Datasheet

283654-003

Mobile Intel Celeron Processor (0.18µ) in BGA2 and Micro-PGA2 Packages

4.2

4.3

GTL+ AC Signal Quality Specifications................................................................41

Non-GTL+ Signal Quality Specifications ..............................................................44

4.3.1 PWRGOOD Signal Quality Specifications ..............................................45

Surface-mount BGA2 Package Dimensions ........................................................46

Socketable Micro-PGA2 Package Dimensions ....................................................48

Signal Listings ......................................................................................................51

Thermal Diode ......................................................................................................60

Description............................................................................................................61

7.1.1 Quick Start Enable ..................................................................................61

7.1.2 System Bus Frequency ...........................................................................61

7.1.3 APIC Enable ............................................................................................61

Clock Frequencies and Ratios .............................................................................61

Alphabetical Signal Reference .............................................................................63

Signal Summaries ................................................................................................75

Introduction...........................................................................................................77

Filter Specification ................................................................................................77

Recommendation for Mobile Systems .................................................................78

Comments ............................................................................................................79

Mechanical Specifications...........................................................................................................46

5.1

5.2

5.3

Thermal Specifications ................................................................................................................59

6.1

7.1

Processor Initialization and Configuration................................................................................61

7.2

8.1

8.2

A.1

A.2

A.3

A.4

Processor Interface ......................................................................................................................63

Appendix A: PLL RLC Filter Specification..............................................................................................77

283654-003

Datasheet

KP80526NY700128相似产品对比

	KP80526NY700128	KC80526NY500128	KC80526NY600128	KP80526NY750128	KP80526NY550128	KC80526NY550128	KC80526NY700128	KP80526NY500128
描述	Microprocessor, 32-Bit, 700MHz, CMOS, CPGA495, MICRO, PGA2-495	Microprocessor, 32-Bit, 500MHz, CMOS, PBGA495, BGA2-495	Microprocessor, 32-Bit, 600MHz, CMOS, PBGA495, BGA2-495	Microprocessor, 32-Bit, 750MHz, CMOS, CPGA495, MICRO, PGA2-495	Microprocessor, 32-Bit, 550MHz, CMOS, CPGA495, MICRO, PGA2-495	Microprocessor, 32-Bit, 550MHz, CMOS, PBGA495, BGA2-495	Microprocessor, 32-Bit, 700MHz, CMOS, PBGA495, BGA2-495	Microprocessor, 32-Bit, 500MHz, CMOS, CPGA495, MICRO, PGA2-495
是否Rohs认证	不符合	不符合	不符合	不符合	不符合	不符合	不符合	不符合
零件包装代码	PGA	BGA	BGA	PGA	PGA	BGA	BGA	PGA
包装说明	SPGA, PGA495,21X24,50	BGA, BGA495,21X24,50	BGA, BGA495,21X24,50	SPGA, PGA495,21X24,50	SPGA, PGA495,21X24,50	BGA, BGA495,21X24,50	BGA, BGA495,21X24,50	SPGA, PGA495,21X24,50
针数	495	495	495	495	495	495	495	495
Reach Compliance Code	unknow	unknown	unknown	unknown	unknown	unknown	unknown	unknown
ECCN代码	3A001.A.3	3A001.A.3	3A001.A.3	3A001.A.3	3A001.A.3	3A001.A.3	3A001.A.3	3A001.A.3
地址总线宽度	36	36	36	36	36	36	36	36
位大小	32	32	32	32	32	32	32	32
边界扫描	YES	YES	YES	YES	YES	YES	YES	YES
最大时钟频率	100 MHz	100 MHz	100 MHz	100 MHz	100 MHz	100 MHz	100 MHz	100 MHz
外部数据总线宽度	64	64	64	64	64	64	64	64
格式	FLOATING POINT	FLOATING POINT	FLOATING POINT	FLOATING POINT	FLOATING POINT	FLOATING POINT	FLOATING POINT	FLOATING POINT
集成缓存	YES	YES	YES	YES	YES	YES	YES	YES
JESD-30 代码	R-CPGA-P495	R-PBGA-B495	R-PBGA-B495	R-CPGA-P495	R-CPGA-P495	R-PBGA-B495	R-PBGA-B495	R-CPGA-P495
JESD-609代码	e0	e0	e0	e0	e0	e0	e0	e0
长度	34.21 mm	31 mm	31 mm	34.21 mm	34.21 mm	31 mm	31 mm	34.21 mm
低功率模式	YES	YES	YES	YES	YES	YES	YES	YES
端子数量	495	495	495	495	495	495	495	495
封装主体材料	CERAMIC, METAL-SEALED COFIRED	PLASTIC/EPOXY	PLASTIC/EPOXY	CERAMIC, METAL-SEALED COFIRED	CERAMIC, METAL-SEALED COFIRED	PLASTIC/EPOXY	PLASTIC/EPOXY	CERAMIC, METAL-SEALED COFIRED
封装代码	SPGA	BGA	BGA	SPGA	SPGA	BGA	BGA	SPGA
封装等效代码	PGA495,21X24,50	BGA495,21X24,50	BGA495,21X24,50	PGA495,21X24,50	PGA495,21X24,50	BGA495,21X24,50	BGA495,21X24,50	PGA495,21X24,50
封装形状	RECTANGULAR	RECTANGULAR	RECTANGULAR	RECTANGULAR	RECTANGULAR	RECTANGULAR	RECTANGULAR	RECTANGULAR
封装形式	GRID ARRAY, SHRINK PITCH	GRID ARRAY	GRID ARRAY	GRID ARRAY, SHRINK PITCH	GRID ARRAY, SHRINK PITCH	GRID ARRAY	GRID ARRAY	GRID ARRAY, SHRINK PITCH
峰值回流温度（摄氏度）	NOT SPECIFIED	NOT SPECIFIED	NOT SPECIFIED	NOT SPECIFIED	NOT SPECIFIED	NOT SPECIFIED	NOT SPECIFIED	NOT SPECIFIED
电源	1.5,1.6 V	1.5,1.6 V	1.5,1.6 V	1.5,1.6 V	1.5,1.6 V	1.5,1.6 V	1.5,1.6 V	1.5,1.6 V
认证状态	Not Qualified	Not Qualified	Not Qualified	Not Qualified	Not Qualified	Not Qualified	Not Qualified	Not Qualified
座面最大高度	3.73 mm	2.79 mm	2.79 mm	3.73 mm	3.73 mm	2.79 mm	2.79 mm	3.73 mm
速度	700 MHz	500 MHz	600 MHz	750 MHz	550 MHz	550 MHz	700 MHz	500 MHz
最大供电电压	1.715 V	1.715 V	1.715 V	1.715 V	1.715 V	1.715 V	1.715 V	1.715 V
最小供电电压	1.485 V	1.485 V	1.485 V	1.485 V	1.485 V	1.485 V	1.485 V	1.485 V
标称供电电压	1.6 V	1.6 V	1.6 V	1.6 V	1.6 V	1.6 V	1.6 V	1.6 V
表面贴装	NO	YES	YES	NO	NO	YES	YES	NO
技术	CMOS	CMOS	CMOS	CMOS	CMOS	CMOS	CMOS	CMOS
端子面层	Tin/Lead (Sn/Pb)	Tin/Lead (Sn/Pb)	Tin/Lead (Sn/Pb)	Tin/Lead (Sn/Pb)	Tin/Lead (Sn/Pb)	Tin/Lead (Sn/Pb)	Tin/Lead (Sn/Pb)	Tin/Lead (Sn/Pb)
端子形式	PIN/PEG	BALL	BALL	PIN/PEG	PIN/PEG	BALL	BALL	PIN/PEG
端子节距	1.27 mm	1.27 mm	1.27 mm	1.27 mm	1.27 mm	1.27 mm	1.27 mm	1.27 mm
端子位置	PERPENDICULAR	BOTTOM	BOTTOM	PERPENDICULAR	PERPENDICULAR	BOTTOM	BOTTOM	PERPENDICULAR
处于峰值回流温度下的最长时间	NOT SPECIFIED	NOT SPECIFIED	NOT SPECIFIED	NOT SPECIFIED	NOT SPECIFIED	NOT SPECIFIED	NOT SPECIFIED	NOT SPECIFIED
宽度	28.27 mm	27.2 mm	27.2 mm	28.27 mm	28.27 mm	27.2 mm	27.2 mm	28.27 mm
uPs/uCs/外围集成电路类型	MICROPROCESSOR	MICROPROCESSOR	MICROPROCESSOR	MICROPROCESSOR	MICROPROCESSOR	MICROPROCESSOR	MICROPROCESSOR	MICROPROCESSOR
厂商名称	Intel(英特尔)	-	-	-	Intel(英特尔)	Intel(英特尔)	Intel(英特尔)	Intel(英特尔)

KP80526NY700128

KP80526NY700128概述

KP80526NY700128规格参数

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KP80526NY700128相似产品对比

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