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HM62256BP-50: 产品描述Standard SRAM, 32KX8, 50ns, CMOS, PDIP28, 0.600 INCH, PLASTIC, DIP-28; 产品类别存储存储; 文件大小304KB，共8页; 制造商Hualon Microelectronics Corp

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HM62256BP-50概述

Standard SRAM, 32KX8, 50ns, CMOS, PDIP28, 0.600 INCH, PLASTIC, DIP-28

HM62256BP-50规格参数

参数名称	属性值
厂商名称	Hualon Microelectronics Corp
零件包装代码	DIP
包装说明	DIP,
针数	28
Reach Compliance Code	unknow
ECCN代码	EAR99
最长访问时间	50 ns
JESD-30 代码	R-PDIP-T28
长度	36.705 mm
内存密度	262144 bi
内存集成电路类型	STANDARD SRAM
内存宽度	8
功能数量	1
端口数量	1
端子数量	28
字数	32768 words
字数代码	32000
工作模式	ASYNCHRONOUS
最高工作温度	70 °C
最低工作温度
组织	32KX8
输出特性	3-STATE
可输出	YES
封装主体材料	PLASTIC/EPOXY
封装代码	DIP
封装形状	RECTANGULAR
封装形式	IN-LINE
并行/串行	PARALLEL
认证状态	Not Qualified
座面最大高度	6.35 mm
最小待机电流	2 V
最大供电电压 (Vsup)	5.5 V
最小供电电压 (Vsup)	4.5 V
标称供电电压 (Vsup)	5 V
表面贴装	NO
技术	CMOS
温度等级	COMMERCIAL
端子形式	THROUGH-HOLE
端子节距	2.54 mm
端子位置	DUAL
宽度	15.24 mm

HM62256BP-50相似产品对比

	HM62256BP-50	HM62256BWM-50	HM62256BJ-50	HM62256BM-50	HM62256BP-70	HM62256BWM-70	HM62256BK-50	HM62256BJ-70	HM62256BK-70	HM62256BM-70
描述	Standard SRAM, 32KX8, 50ns, CMOS, PDIP28, 0.600 INCH, PLASTIC, DIP-28	Standard SRAM, 32KX8, 50ns, CMOS, PDSO28, 0.330 INCH, PLASTIC, SOP-28	Standard SRAM, 32KX8, 50ns, CMOS, PDSO28, 0.300 INCH, PLASTIC, SOJ-28	Standard SRAM, 32KX8, 50ns, CMOS, PDSO28, 0.300 INCH, PLASTIC, SOP-28	Standard SRAM, 32KX8, 70ns, CMOS, PDIP28, 0.600 INCH, PLASTIC, DIP-28	Standard SRAM, 32KX8, 70ns, CMOS, PDSO28, 0.330 INCH, PLASTIC, SOP-28	Standard SRAM, 32KX8, 50ns, CMOS, PDIP28, 0.300 INCH, SKINNY, PLASTIC, DIP-28	Standard SRAM, 32KX8, 70ns, CMOS, PDSO28, 0.300 INCH, PLASTIC, SOJ-28	Standard SRAM, 32KX8, 70ns, CMOS, PDIP28, 0.300 INCH, SKINNY, PLASTIC, DIP-28	Standard SRAM, 32KX8, 70ns, CMOS, PDSO28, 0.300 INCH, PLASTIC, SOP-28
厂商名称	Hualon Microelectronics Corp	Hualon Microelectronics Corp	Hualon Microelectronics Corp	Hualon Microelectronics Corp	Hualon Microelectronics Corp	Hualon Microelectronics Corp	Hualon Microelectronics Corp	Hualon Microelectronics Corp	Hualon Microelectronics Corp	Hualon Microelectronics Corp
零件包装代码	DIP	SOIC	SOJ	SOIC	DIP	SOIC	DIP	SOJ	DIP	SOIC
包装说明	DIP,	SOP,	SOJ,	SOP,	DIP,	SOP,	DIP,	SOJ,	DIP,	SOP,
针数	28	28	28	28	28	28	28	28	28	28
Reach Compliance Code	unknow	unknown	unknow	unknow	unknow	unknow	unknow	unknow	unknow	unknow
ECCN代码	EAR99	EAR99	EAR99	EAR99	EAR99	EAR99	EAR99	EAR99	EAR99	EAR99
最长访问时间	50 ns	50 ns	50 ns	50 ns	70 ns	70 ns	50 ns	70 ns	70 ns	70 ns
JESD-30 代码	R-PDIP-T28	R-PDSO-G28	R-PDSO-J28	R-PDSO-G28	R-PDIP-T28	R-PDSO-G28	R-PDIP-T28	R-PDSO-J28	R-PDIP-T28	R-PDSO-G28
内存密度	262144 bi	262144 bit	262144 bi	262144 bi	262144 bi	262144 bi	262144 bi	262144 bi	262144 bi	262144 bi
内存集成电路类型	STANDARD SRAM	STANDARD SRAM	STANDARD SRAM	STANDARD SRAM	STANDARD SRAM	STANDARD SRAM	STANDARD SRAM	STANDARD SRAM	STANDARD SRAM	STANDARD SRAM
内存宽度	8	8	8	8	8	8	8	8	8	8
功能数量	1	1	1	1	1	1	1	1	1	1
端口数量	1	1	1	1	1	1	1	1	1	1
端子数量	28	28	28	28	28	28	28	28	28	28
字数	32768 words	32768 words	32768 words	32768 words	32768 words	32768 words	32768 words	32768 words	32768 words	32768 words
字数代码	32000	32000	32000	32000	32000	32000	32000	32000	32000	32000
工作模式	ASYNCHRONOUS	ASYNCHRONOUS	ASYNCHRONOUS	ASYNCHRONOUS	ASYNCHRONOUS	ASYNCHRONOUS	ASYNCHRONOUS	ASYNCHRONOUS	ASYNCHRONOUS	ASYNCHRONOUS
最高工作温度	70 °C	70 °C	70 °C	70 °C	70 °C	70 °C	70 °C	70 °C	70 °C	70 °C
组织	32KX8	32KX8	32KX8	32KX8	32KX8	32KX8	32KX8	32KX8	32KX8	32KX8
输出特性	3-STATE	3-STATE	3-STATE	3-STATE	3-STATE	3-STATE	3-STATE	3-STATE	3-STATE	3-STATE
可输出	YES	YES	YES	YES	YES	YES	YES	YES	YES	YES
封装主体材料	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY
封装代码	DIP	SOP	SOJ	SOP	DIP	SOP	DIP	SOJ	DIP	SOP
封装形状	RECTANGULAR	RECTANGULAR	RECTANGULAR	RECTANGULAR	RECTANGULAR	RECTANGULAR	RECTANGULAR	RECTANGULAR	RECTANGULAR	RECTANGULAR
封装形式	IN-LINE	SMALL OUTLINE	SMALL OUTLINE	SMALL OUTLINE	IN-LINE	SMALL OUTLINE	IN-LINE	SMALL OUTLINE	IN-LINE	SMALL OUTLINE
并行/串行	PARALLEL	PARALLEL	PARALLEL	PARALLEL	PARALLEL	PARALLEL	PARALLEL	PARALLEL	PARALLEL	PARALLEL
认证状态	Not Qualified	Not Qualified	Not Qualified	Not Qualified	Not Qualified	Not Qualified	Not Qualified	Not Qualified	Not Qualified	Not Qualified
最小待机电流	2 V	2 V	2 V	2 V	2 V	2 V	2 V	2 V	2 V	2 V
最大供电电压 (Vsup)	5.5 V	5.5 V	5.5 V	5.5 V	5.5 V	5.5 V	5.5 V	5.5 V	5.5 V	5.5 V
最小供电电压 (Vsup)	4.5 V	4.5 V	4.5 V	4.5 V	4.5 V	4.5 V	4.5 V	4.5 V	4.5 V	4.5 V
标称供电电压 (Vsup)	5 V	5 V	5 V	5 V	5 V	5 V	5 V	5 V	5 V	5 V
表面贴装	NO	YES	YES	YES	NO	YES	NO	YES	NO	YES
技术	CMOS	CMOS	CMOS	CMOS	CMOS	CMOS	CMOS	CMOS	CMOS	CMOS
温度等级	COMMERCIAL	COMMERCIAL	COMMERCIAL	COMMERCIAL	COMMERCIAL	COMMERCIAL	COMMERCIAL	COMMERCIAL	COMMERCIAL	COMMERCIAL
端子形式	THROUGH-HOLE	GULL WING	J BEND	GULL WING	THROUGH-HOLE	GULL WING	THROUGH-HOLE	J BEND	THROUGH-HOLE	GULL WING
端子位置	DUAL	DUAL	DUAL	DUAL	DUAL	DUAL	DUAL	DUAL	DUAL	DUAL
长度	36.705 mm	18.05 mm	-	17.9 mm	36.705 mm	18.05 mm	35.675 mm	-	35.675 mm	17.9 mm
座面最大高度	6.35 mm	2.9 mm	-	2.65 mm	6.35 mm	2.9 mm	5.334 mm	-	5.334 mm	2.65 mm
端子节距	2.54 mm	1.27 mm	-	1.27 mm	2.54 mm	1.27 mm	2.54 mm	-	2.54 mm	1.27 mm
宽度	15.24 mm	8.4 mm	-	7.5 mm	15.24 mm	8.4 mm	7.62 mm	-	7.62 mm	7.5 mm

HM62256BP-50

HM62256BP-50概述

HM62256BP-50规格参数

HM62256BP-50相似产品对比

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