Integrator Series FPGAs
– 1200XL and 3200DX Familes
Fe atur es
High Capacity
•
•
•
•
•
•
•
•
2,500 to 40,000 logic gates
Up to 4 Kbits configurable dual-port SRAM
Fast wide-decode circuitry
Up to 288 user-programmable I/O Pins
225 MHz performance
5 ns Dual-Port SRAM Access
100 MHz FIFOs
7.5 ns 35-bit Address Decode
Cadence, Escalade, Exemplar, IST, Mentor Graphics,
Synopsys and Viewlogic
• JTAG 1149.1 Boundary Scan Testing
Ge ne r al D e s c r ip t i on
High Performance
Actel’s Integrator Series FPGAs are the first programmable
logic devices optimized for high-speed system logic
integration. Based on Actel's proprietary PLICE antifuse
technology and state-of-the-art 0.6-micron double metal
CMOS process, the Integrator Series devices offer a
fine-grained, register-rich architecture with the industry’s
fastest embedded dual-port SRAM and wide decode circuitry.
3200DX and 1200XL FPGAs were designed to integrate
system logic which is typically implemented in multiple
CPLDs, PALs and FPGAs. These devices provide the features
and performance required for today’s complex, high-speed
digital logic systems. The 3200DX family offers the industry’s
fastest dual-port SRAM for implementing fast FIFOs, LIFOs
and temporary data storage. The large number of storage
elements can efficiently address applications requiring wide
datapath manipulation and transformation functions such as
telecommunications, networking and DSP.
Ease-of-Integration
• Synthesis-friendly architecture supports ASIC design
methodologies
• 95–100% device utilization using automatic Place and
Route Tools
• Deterministic, user-controllable timing via DirectTime
software tools
• Supported by Actel Designer Series development system
with interfaces to popular design environments such as
In tegr ato r Seri es Product Pro fil e
Device
Capacity
A1225XL
A1240XL
A3265DX
A1280XL
A32100DX A32140DX A32200DX A32300DX A32400DX
Logic Gates
1
SRAM Bits
Logic Modules
2,500
N/A
231
220
N/A
NA
231
2
83
No
PL84
PQ100
VQ100
PG100
4,000
N/A
348
336
N/A
NA
348
2
104
No
PL84
PQ100
PQ144
TQ176
PG132
6,500
N/A
510
475
20
NA
510
2
126
No
PL84
PQ100
PQ160
TQ176
8,000
N/A
624
608
N/A
NA
624
2
140
No
PL84
PQ160
PQ208
TQ176
PG176
CQ172
10,000
2,048
700
662
20
8
700
6
152
Yes
PL84
PQ160
PQ208
TQ176
CQ84
14,000
N/A
954
912
24
NA
954
2
176
Yes
PL84
PQ160
PQ208
TQ176
CQ256
20,000
2,560
1,230
1,184
24
10
1,230
6
202
Yes
PQ208
RQ208
RQ240
CQ208
CQ256
30,000
3,072
1,888
1,833
28
12
1,888
6
250
Yes
RQ208
RQ240
CQ256
40,000
4,096
2,526
2,466
28
16
2,526
6
288
Yes
RQ240
Sequential
Combinatorial
Decode
SRAM Modules
(64x4 or 32x8)
Dedicated Flip-Flops
Clocks
User I/O
(maximum)
JTAG
Packages
Note 1:
Logic gate capacity does not include SRAM bits as logic.
S e p t e m b e r 19 9 7
1-9
© 1997 Actel Corporation
Orde rin g Inf or mati on
A1225
XL
V
–
PQ
100
C
Application (Temperature Range)
C = Commercial (0 to +70°C)
I = Industrial (–40 to +85°C)
M = Military (–55 to +125°C)
B = MIL-STD-883
Package Lead Count
Package Type
CQ = Ceramic Quad Flatpack
PG = Ceramic Pin Grid Array
PL = Plastic Leaded Chip Carrier
PQ = Plastic Quad Flatpack
RQ = Plastic Power Quad Flatpack
TQ = Thin (1.4 mm) Quad Flatpack
VQ = Very Thin (1.0 mm) Quad Flatpack
Speed Grade
Blank = Standard Speed
1 = Approximately 15% Faster than Standard
2 = Approximately 25% Faster than Standard
3 = Approximately 35% Faster than Standard
F = Approximately 30% Slower than Standard
Operating Voltage
V = 3.3 Volt
Blank = 5.0 Volt
Die Revision
XL = 1200XL Family
DX = 3200DX Family
Part Number
A1225
A1240
A3265
A1280
A32100
A32140
A32200
A32300
A32400
=
=
=
=
=
=
=
=
=
2500 Gates
4000 Gates
6500 Gates
8000 Gates
10000 Gates
14000 Gates
20000 Gates
30000 Gates
40000 Gates
1-10
In te g ra to r S e ri es FPGA s – 120 0XL an d 3200D X Fami les
Produc t Plan
Speed Grade
–F
A1225XL Device
84-pin Plastic Leaded Chip Carrier (PLCC)
100-pin Plastic Quad Flatpack (PQFP)
100-pin Very Thin Plastic Quad Flatpack (VQFP)
100-pin Ceramic Pin Grid Array (CPGA)
A1225XLV Device
84-pin Plastic Leaded Chip Carrier (PLCC)
100-pin Very Thin Plastic Quad Flatpack (VQFP)
A1240XL Device
84-pin Plastic Leaded Chip Carrier (PLCC)
100-pin Plastic Quad Flatpack (PQFP)
132-pin Ceramic Pin Grid Array (CPGA)
144-pin Plastic Quad Flatpack (PQFP)
176-pin Thin Plastic Quad Flatpack (TQFP)
A1240XLV Device
84-pin Plastic Leaded Chip Carrier (PLCC)
176-pin Thin Plastic Quad Flatpack (TQFP)
A3265DX Device
84-pin Plastic Leaded Chip Carrier (PLCC)
100-pin Plastic Quad Flatpack (PQFP)
160-pin Plastic Quad Flatpack (PQFP)
176-pin Thin Plastic Quad Flatpack (TQFP)
A3265DXV Device
84-pin Plastic Leaded Chip Carrier (PLCC)
176-pin Thin Plastic Quad Flatpack (TQFP)
A1280XL Device
84-pin Plastic Leaded Chip Carrier (PLCC)
160-pin Plastic Quad Flatpack (PQFP)
172-pin Ceramic Quad Flatpack (CQFP)
176-pin Thin Plastic Quad Flatpack (TQFP)
176-pin Ceramic Pin Grid Array (CPGA)
208-pin Plastic Quad Flatpack (PQFP)
A1280XLV Device
84-pin Plastic Leaded Chip Carrier (PLCC)
176-pin Thin Plastic Quad Flatpack (TQFP)
Applications:
C
I
M
B
=
=
=
=
Commercial
Industrial
Military
MIL-STD-883
Availability:
—
—
= Available
P = Planned
— = Not Planned
—
—
—
—
=
=
=
=
—
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P
—
P
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P
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P
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Std
–1*
–2*
–3
C
Application
I
M
B
* Speed Grade: –1
–2
–3
–F
Approx. 15% Faster than Standard
Approx. 25% Faster than Standard
Approx. 35% Faster than Standard
Approx. 30% Slower than Standard
1-11
P ro du c t Pla n
(continued)
Speed Grade
–F
A32100DX Device
84-pin Ceramic Quad Flatpack (CQFP)
84-pin Plastic Leaded Chip Carrier (PLCC)
160-pin Plastic Quad Flatpack (PQFP)
208-pin Plastic Quad Flatpack (PQFP)
176-pin Thin Plastic Quad Flatpack (TQFP)
A32100DXV Device
84-pin Plastic Leaded Chip Carrier (PLCC)
176-pin Thin Plastic Quad Flatpack (TQFP)
A32140DX Device
84-pin Plastic Leaded Chip Carrier (PLCC)
160-pin Plastic Quad Flatpack (PQFP)
176-pin Thin Plastic Quad Flatpack (TQFP)
208-pin Plastic Quad Flatpack (PQFP)
256-pin Ceramic Quad Flatpack (CQFP)
A32140DXV Device
84-pin Plastic Leaded Chip Carrier (PLCC)
176-pin Thin Plastic Quad Flatpack (TQFP)
A32200DX Device
208-pin Plastic Quad Flatpack (PQFP)
208-pin Plastic Power Quad Flatpack (RQFP)
240-pin Plastic Power Quad Flatpack (RQFP)
208-pin Ceramic Quad Flatpack (CQFP)
256-pin Ceramic Quad Flatpack (CQFP)
A32200DXV Device
208-pin Plastic Quad Flatpack (PQFP)
240-pin Plastic Power Quad Flatpack (RQFP)
A32300DX Device
208-pin Plastic Power Quad Flatpack (RQFP)
240-pin Plastic Power Quad Flatpack (RQFP)
256-pin Ceramic Quad Flatpack (CQFP)
A32300DXV Device
208-pin Plastic Power Quad Flatpack (RQFP)
240-pin Plastic Power Quad Flatpack (RQFP)
A32400DX Device
240-pin Plastic Power Quad Flatpack (RQFP)
Applications:
C
I
M
B
=
=
=
=
Commercial
Industrial
Military
MIL-STD-883
Availability:
P
P
P
P
P
=
=
=
=
P
P
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
P
P
—
—
P
—
—
—
P
—
—
P
—
—
—
—
—
—
P
P
P
P
—
—
—
—
P
P
—
—
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—
—
P
P
—
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—
P
P
—
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—
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—
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—
—
—
P
P
—
—
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—
—
P
—
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—
—
—
P
—
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—
P
—
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—
P
P
—
—
P
—
P
—
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—
—
P
—
—
—
—
Std
–1*
–2*
–3
C
Application
I
M
B
= Available
P = Planned
— = Not Planned
* Speed Grade: –1
–2
–3
–F
Approx. 15% Faster than Standard
Approx. 25% Faster than Standard
Approx. 35% Faster than Standard
Approx. 30% Slower than Standard
1-12
In te g ra to r S e ri es FPGA s – 120 0XL an d 3200D X Fami les
Integrator Series devices are supported by Actel’s Designer
Series Development software which provides a seamless
integration into any ASIC design flow. The Designer Series
development tools offer automatic placement and routing
(even with pre-assigned pins), static timing analysis, user
programming, and debug and diagnostic probe capabilities.
In addition, the DirectTime tool provides deterministic as
well as controllable timing. DirectTime allows the designer to
specify the performance requirements of individual paths and
system clock(s). Using these specifications, the software will
automatically optimize the placement and routing of the logic
to meet these constraints. Included with the Designer Series
tools is Actel’s ACTGen™ Macro Builder. ACTGen allows the
designer to quickly build fast, efficient logic functions such as
counters, adders, FIFOs, and RAM.
The Designer Series tools provide designers the capability to
move up to High-Level Description Languages, such as VHDL
Plast ic D evice R es ources
and Verilog, or use schematic design entry with interfaces to
most EDA tools. Designer Series is supported on the following
development platforms: 486 and Pentium PC, Sun® and HP®
workstations. The software provides CAE interfaces to
Cadence, Mentor Graphics®, Escalade, OrCAD™ and
Viewlogic® design environments. Additional development
tools are supported through Actel's Industry Alliance
Program, including DATA I/O (ABEL FPGA) and MINC.
Actel’s FPGAs are an ideal solution for shortening the system
design and development cycle and offers a cost-effective
alternative for low volume production runs. The 3200DX and
1200XL devices are an excellent choice for integrating logic
that is currently implemented in multiple PALs, CPLDs and
FPGAs. Some example applications include high-speed
controllers and address decoding, peripheral bus interfaces,
DSP, and co-processor functions.
User I/Os
Device
A1225XL
A1240XL
A3265DX
A1280XL
A32100DX
A32140DX
A32200DX
A32300DX
A32400DX
PLCC
84-pin
72
72
72
72
72
72
—
—
—
VQFP
100-pin
83
—
—
—
—
—
—
—
—
PQFP
100-pin
83
83
83
—
—
—
—
—
—
PQFP
144-pin
—
104
—
—
—
—
—
—
—
PQFP
160-pin
—
—
125
125
125
125
—
—
—
PQFP
208-pin
—
—
—
140
152
176
176*
176
—
RQFP
240-pin
—
—
—
—
—
—
202
202
202
TQFP
176-pin
—
103
126
140
142
150
—
—
—
Package Definitions
(Consult your local Actel Sales Representative for product availability.)
PLCC = Plastic Leaded Chip Carrier, PQFP = Plastic Quad Flat Pack, TQFP = Thin Quad Flat Pack, BGA = Ball Grid Array, VQFP = Very Thin
Quad Flat Pack, RQFP = Plastic Power Quad Flat Pack
• Also available in RQFP 208-pin.
Herme tic D ev i ce Res ources
User I/Os
Device
A1280XL
A32100DX
A32140DX
A32200DX
A32300DX
Package Definitions
(Consult your local Actel Sales Representative for product availability.)
CPGA = Ceramic Pin Grid Array, CQFP = Ceramic Quad Flat Pack
176
CPGA
176-pin
140
60
176
202
212
CQFP
84-pin
CQFP
172-pin
140
CQFP
208-pin
CQFP
256-pin
1-13