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A32200DXV-FRQ240C

产品描述Field Programmable Gate Array, 1230 CLBs, 20000 Gates, CMOS, PQFP240, HEAT SINK, POWER, PLASTIC, RQFP-240
产品类别可编程逻辑器件    可编程逻辑   
文件大小457KB,共82页
制造商Actel
官网地址http://www.actel.com/
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A32200DXV-FRQ240C概述

Field Programmable Gate Array, 1230 CLBs, 20000 Gates, CMOS, PQFP240, HEAT SINK, POWER, PLASTIC, RQFP-240

A32200DXV-FRQ240C规格参数

参数名称属性值
是否Rohs认证不符合
厂商名称Actel
包装说明HEAT SINK, POWER, PLASTIC, RQFP-240
Reach Compliance Codecompli
CLB-Max的组合延迟5.2 ns
JESD-30 代码S-PQFP-G240
JESD-609代码e0
长度32 mm
湿度敏感等级4
可配置逻辑块数量1230
等效关口数量20000
端子数量240
最高工作温度70 °C
最低工作温度
组织1230 CLBS, 20000 GATES
封装主体材料PLASTIC/EPOXY
封装代码HFQFP
封装形状SQUARE
封装形式FLATPACK, HEAT SINK/SLUG, FINE PITCH
峰值回流温度(摄氏度)225
可编程逻辑类型FIELD PROGRAMMABLE GATE ARRAY
认证状态Not Qualified
座面最大高度4.1 mm
最大供电电压3.465 V
最小供电电压3.135 V
标称供电电压3.3 V
表面贴装YES
技术CMOS
温度等级COMMERCIAL
端子面层TIN LEAD
端子形式GULL WING
端子节距0.5 mm
端子位置QUAD
处于峰值回流温度下的最长时间30
宽度32 mm

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Integrator Series FPGAs
– 1200XL and 3200DX Familes
Fe atur es
High Capacity
2,500 to 40,000 logic gates
Up to 4 Kbits configurable dual-port SRAM
Fast wide-decode circuitry
Up to 288 user-programmable I/O Pins
225 MHz performance
5 ns Dual-Port SRAM Access
100 MHz FIFOs
7.5 ns 35-bit Address Decode
Cadence, Escalade, Exemplar, IST, Mentor Graphics,
Synopsys and Viewlogic
• JTAG 1149.1 Boundary Scan Testing
Ge ne r al D e s c r ip t i on
High Performance
Actel’s Integrator Series FPGAs are the first programmable
logic devices optimized for high-speed system logic
integration. Based on Actel's proprietary PLICE antifuse
technology and state-of-the-art 0.6-micron double metal
CMOS process, the Integrator Series devices offer a
fine-grained, register-rich architecture with the industry’s
fastest embedded dual-port SRAM and wide decode circuitry.
3200DX and 1200XL FPGAs were designed to integrate
system logic which is typically implemented in multiple
CPLDs, PALs and FPGAs. These devices provide the features
and performance required for today’s complex, high-speed
digital logic systems. The 3200DX family offers the industry’s
fastest dual-port SRAM for implementing fast FIFOs, LIFOs
and temporary data storage. The large number of storage
elements can efficiently address applications requiring wide
datapath manipulation and transformation functions such as
telecommunications, networking and DSP.
Ease-of-Integration
• Synthesis-friendly architecture supports ASIC design
methodologies
• 95–100% device utilization using automatic Place and
Route Tools
• Deterministic, user-controllable timing via DirectTime
software tools
• Supported by Actel Designer Series development system
with interfaces to popular design environments such as
In tegr ato r Seri es Product Pro fil e
Device
Capacity
A1225XL
A1240XL
A3265DX
A1280XL
A32100DX A32140DX A32200DX A32300DX A32400DX
Logic Gates
1
SRAM Bits
Logic Modules
2,500
N/A
231
220
N/A
NA
231
2
83
No
PL84
PQ100
VQ100
PG100
4,000
N/A
348
336
N/A
NA
348
2
104
No
PL84
PQ100
PQ144
TQ176
PG132
6,500
N/A
510
475
20
NA
510
2
126
No
PL84
PQ100
PQ160
TQ176
8,000
N/A
624
608
N/A
NA
624
2
140
No
PL84
PQ160
PQ208
TQ176
PG176
CQ172
10,000
2,048
700
662
20
8
700
6
152
Yes
PL84
PQ160
PQ208
TQ176
CQ84
14,000
N/A
954
912
24
NA
954
2
176
Yes
PL84
PQ160
PQ208
TQ176
CQ256
20,000
2,560
1,230
1,184
24
10
1,230
6
202
Yes
PQ208
RQ208
RQ240
CQ208
CQ256
30,000
3,072
1,888
1,833
28
12
1,888
6
250
Yes
RQ208
RQ240
CQ256
40,000
4,096
2,526
2,466
28
16
2,526
6
288
Yes
RQ240
Sequential
Combinatorial
Decode
SRAM Modules
(64x4 or 32x8)
Dedicated Flip-Flops
Clocks
User I/O
(maximum)
JTAG
Packages
Note 1:
Logic gate capacity does not include SRAM bits as logic.
S e p t e m b e r 19 9 7
1-9
© 1997 Actel Corporation

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