REVISIONS
LTR
A
B
DESCRIPTION
Added devices 03 and 04, editorial changes to table I and the
appropriate paragraphs throughout the document. ksr
Updated Case X and Y outline notes. Updated boilerplate
references. ksr
DATE (YR-MO-DA)
00-03 03
01-03-12
APPROVED
Raymond Monnin
Raymond Monnin
REV
SHEET
REV
SHEET
REV STATUS
OF SHEETS
PMIC N/A
B
15
B
16
B
17
B
18
REV
SHEET
PREPARED BY
Kenneth Rice
B
19
B
20
B
21
B
1
B
22
B
2
B
23
B
3
B
24
B
4
B
25
B
5
B
26
B
6
B
7
B
8
B
9
B
10
B
11
B
12
B
13
B
14
STANDARD
MICROCIRCUIT
DRAWING
THIS DRAWING IS
AVAILABLE
FOR USE BY ALL
DEPARTMENTS
AND AGENCIES OF THE
DEPARTMENT OF DEFENSE
AMSC N/A
CHECKED BY
Jeff Bowling
DEFENSE SUPPLY CENTER COLUMBUS
COLUMBUS, OHIO 43216
http://www.dscc.dla.mil
APPROVED BY
Raymond Monnin
MICROCIRCUIT, MEMORY, DIGITAL, CMOS,
FIELD PROGRAMMABLE GATE ARRAY, 32,000
GATES, MONOLITHIC SILICON
DRAWING APPROVAL DATE
99 – 08 - 11
REVISION LEVEL
B
SIZE
CAGE CODE
A
SHEET
67268
1 OF
26
5962-99586
DSCC FORM 2233
APR 97
DISTRIBUTION STATEMENT A. Approved for public release; distribution is unlimited.
5962-E192-01
1. SCOPE
1.1 Scope. This drawing documents two product assurance class levels consisting of high reliability (device classes Q and
M) and space application (device class V). A choice of case outlines and lead finishes are available and are reflected in the
Part or Identifying Number (PIN). When available, a choice of Radiation Hardness Assurance (RHA) levels are reflected in the
PIN.
1.2 PIN. The PIN is as shown in the following example:
5962
|
|
|
Federal
stock class
designator
\
-
|
|
|
RHA
designator
(see 1.2.1)
\/
Drawing number
1.2.1 RHA designator. Device classes Q and V RHA marked devices meet the MIL-PRF-38535 specified RHA levels and
are marked with the appropriate RHA designator. Device class M RHA marked devices meet the MIL-PRF-38535, appendix A
specified RHA levels and are marked with the appropriate RHA designator. A dash (-) indicates a non-RHA device.
1.2.2 Device type(s). The device type(s) identify the circuit function as follows:
Device type
01
02
03
04
Generic number
A54SX32
A54SX32-1
RT54SX32
RT54SX32-1
Circuit function
32,000 gate field programmable gate array
32,000 gate field programmable gate array
32,000 gate field programmable gate array
32,000 gate field programmable gate array
Bin Speed
47.2 1/
40.1 1/
80.0 1/
68.0 1/
99586
01
|
|
|
Device
type
(see 1.2.2)
/
Q
|
|
|
Device
class
designator
(see 1.2.3)
X
|
|
|
Case
outline
(see 1.2.4)
C
|
|
|
Lead
finish
(see 1.2.5)
1.2.3 Device class designator. The device class designator is a single letter identifying the product assurance level
as follows:
Device class
M
Q or V
Device requirements documentation
Vendor self-certification to the requirements for MIL-STD-883 compliant, non-JAN
class level B microcircuits in accordance with MIL-PRF-38535, appendix A
Certification and qualification to MIL-PRF-38535
1.2.4 Case outline(s). The case outline(s) are as designated in MIL-STD-1835 and as follows:
Outline letter
X
Y
Descriptive designator
See figure 1
See figure 1
Terminals
256
208
Package style
Ceramic Quad Flat Pack
Ceramic Quad Flat Pack
1.2.5 Lead finish. The lead finish is as specified in MIL-PRF-38535 for device classes Q and V or MIL-PRF-38535,
appendix A for device class M.
1/
Bin speed is tested at 125
G
C at 5 volts for worst case condition.
STANDARD
MICROCIRCUIT DRAWING
DEFENSE SUPPLY CENTER COLUMBUS
COLUMBUS, OHIO 43216-5000
DSCC FORM 2234
APR 97
SIZE
A
REVISION LEVEL
5962-99586
SHEET
B
2
1.3 Absolute maximum ratings. 2/
3.3 V DC supply voltage range (V
CCA
, and V
CCI
).......................................... -0.3 V dc to +4.0 V dc
5.0 V DC supply voltage range (V
CCR
) .......................................................... -0.3 V dc to +6.0 V dc
Input voltage range (V
I
) ................................................................................ -0.5 V dc to +5.5 V dc
Output voltage range (V
O
) ............................................................................ -0.5 V dc to +3.6 V dc
I/O source sink current (I
IO
) .......................................................................... -30 to +5.0 mA
Storage temperature range (T
STG
) ................................................................ -40
G
C to +125
G
C
Lead temperature (soldering, 10 seconds)................................................... 300
G
C
Thermal resistance, junction-to-case (
"
JC
):
Case X........................................................................................................ 8
G
C/W 3/
Case Y........................................................................................................ 9
G
C/W 3/
Maximum junction temperature (T
J
).............................................................. +150
G
C
1.4 Recommended operating conditions.
3.3V Power supply (V
CCA
, and V
CCI
) ............................................................. +3.0 V dc to +3.6 V dc (
H
10% V
CC
)
5.0V Power supply (V
CCR
)............................................................................. +4.5 V dc to +5.5 V dc (
H
10% V
CC
)
Case operating temperature range (T
C
) ....................................................... -55
G
C to +125
G
C
1.5 Digital logic testing for device classes Q and V.
Fault coverage measurement of manufacturing
logic tests (MIL-STD-883, test method 5012) ............................................. 100 percent 4/
2. APPLICABLE DOCUMENTS
2.1 Government specification, standards, and handbooks. The following specification, standards, and handbooks form a
part of this drawing to the extent specified herein. Unless otherwise specified, the issues of these documents are those listed in
the issue of the Department of Defense Index of Specifications and Standards (DoDISS) and supplement thereto, cited in the
solicitation.
SPECIFICATION
DEPARTMENT OF DEFENSE
MIL-PRF-38535 - Integrated Circuits, Manufacturing, General Specification for.
STANDARDS
DEPARTMENT OF DEFENSE
MIL-STD-883 -
MIL-STD-1835 -
HANDBOOKS
DEPARTMENT OF DEFENSE
MIL-HDBK-103 -
MIL-HDBK-780 -
List of Standard Microcircuit Drawings.
Standard Microcircuit Drawings.
Test Method Standard Microcircuits.
Interface Standard Electronic Component Case Outlines.
(Unless otherwise indicated, copies of the specification, standards, and handbooks are available from the Standardization
Document Order Desk, 700 Robbins Avenue, Building 4D, Philadelphia, PA 19111-5094.)
2/ Stresses above the absolute maximum rating may cause permanent damage to the device. Extended operation at the
maximum levels may degrade performance and affect reliability.
3/ When the thermal resistance for this case is specified in MIL-STD-1835, that value shall supersede the value indicated
herein.
4/ 100 percent test coverage of blank programmable logic devices.
STANDARD
MICROCIRCUIT DRAWING
DEFENSE SUPPLY CENTER COLUMBUS
COLUMBUS, OHIO 43216-5000
DSCC FORM 2234
APR 97
SIZE
A
REVISION LEVEL
5962-99586
SHEET
B
3
2.2 Non-Government publications. The following document(s) form a part of this document to the extent specified herein.
Unless otherwise specified, the issues of the documents which are DoD adopted are those listed in the issue of the DoDISS
cited in the solicitation. Unless otherwise specified, the issues of documents not listed in the DoDISS are the issues of the
documents cited in the solicitation.
AMERICAN SOCIETY FOR TESTING AND MATERIALS (ASTM)
ASTM Standard F1192M-95
-Standard Guide for the Measurement of Single Event Phenomena (SEP) Induced by
Heavy Ion Irradiation of Semiconductor Devices.
(Applications for copies of ASTM publications should be addressed to the American Society for Testing and Materials,
1916 Race Street, Philadelphia, PA 19103.)
ELECTRONICS INDUSTRIES ASSOCIATION (EIA)
JEDEC Standard EIA/JESD78
-
IC Latch-Up Test.
(Applications for copies should be addressed to the Electronics Industries Association, 2500 Wilson Boulevard, Arlington,
VA 22201.)
(Non-Government standards and other publications are normally available from the organizations that prepare or distribute
the documents. These documents also may be available in or through libraries or other informational services.)
2.3 Order of precedence. In the event of a conflict between the text of this drawing and the references cited herein, the text
of this drawing takes precedence. Nothing in this document, however, supersedes applicable laws and regulations unless
a specific exemption has been obtained.
3. REQUIREMENTS
3.1 Item requirements. The individual item requirements for device classes Q and V shall be in accordance with
MIL-PRF-38535 and as specified herein or as modified in the device manufacturer's Quality Management (QM) plan. The
modification in the QM plan shall not affect the form, fit, or function as described herein. The individual item requirements for
device class M shall be in accordance with MIL-PRF-38535, appendix A for non-JAN class level B devices and as specified
herein.
3.2 Design, construction, and physical dimensions. The design, construction, and physical dimensions shall be as specified
in MIL-PRF-38535 and herein for device classes Q and V or MIL-PRF-38535, appendix A and herein for device class M.
3.2.1 Case outline(s). The case outline(s) shall be in accordance with 1.2.4 herein and figure 1.
3.2.2 Terminal connections. The terminal connections shall be as specified on figure 2.
3.2.3 Truth table(s).
3.2.3.1 Unprogrammed devices. The truth table or test vectors for unprogrammed devices for contracts involving no altered
item drawing is not part of this drawing. When required in screening (see 4.2 herein) or qualification conformance inspection,
groups A, B, C, D, or E (see 4.4 herein), the devices shall be programmed by the manufacturer prior to test. A minimum of 50
percent of the total number of logic modules shall be utilized or at least 25 percent of the total logic modules shall be utilized for
any altered item drawing pattern.
3.2.3.2 Programmed devices. The truth table or test vectors for programmed devices shall be as specified by an attached
altered item drawing.
3.2.4 Switching test circuit and waveforms. The switching test circuit and waveforms diagram shall be as specified on
figure 3.
3.3 Electrical performance characteristics and postirradiation parameter limits. Unless otherwise specified herein, the
electrical performance characteristics and postirradiation parameter limits are as specified in table I and shall apply over the full
case operating temperature range.
STANDARD
MICROCIRCUIT DRAWING
DEFENSE SUPPLY CENTER COLUMBUS
COLUMBUS, OHIO 43216-5000
DSCC FORM 2234
APR 97
SIZE
A
REVISION LEVEL
5962-99586
SHEET
B
4
3.4 Electrical test requirements. The electrical test requirements shall be the subgroups specified in table IIA. The electrical
tests for each subgroup are defined in table I.
3.5 Marking. The part shall be marked with the PIN listed in 1.2 herein. In addition, the manufacturer's PIN may also be
marked as listed in MIL-HDBK-103. For packages where marking of the entire SMD PIN number is not feasible due to space
limitations, the manufacturer has the option of not marking the "5962-" on the device. For RHA product using this option, the
RHA designator shall still be marked. Marking for device classes Q and V shall be in accordance with MIL-PRF-38535.
Marking for device class M shall be in accordance with MIL-PRF-38535, appendix A.
3.5.1 Certification/compliance mark. The certification mark for device classes Q and V shall be a "QML" or "Q" as required in
MIL-PRF-38535. The compliance mark for device class M shall be a "C" as required in MIL-PRF-38535, appendix A.
3.6 Certificate of compliance. For device classes Q and V, a certificate of compliance shall be required from a QML-38535
listed manufacturer in order to supply to the requirements of this drawing (see 6.6.1 herein). For device class M, a certificate of
compliance shall be required from a manufacturer in order to be listed as an approved source of supply in MIL-HDBK-103 (see
6.6.2 herein). The certificate of compliance submitted to DSCC-VA prior to listing as an approved source of supply for this
drawing shall affirm that the manufacturer's product meets, for device classes Q and V, the requirements of MIL-PRF-38535
and herein or for device class M, the requirements of MIL-PRF-38535, appendix A and herein.
3.7 Certificate of conformance. A certificate of conformance as required for device classes Q and V in MIL-PRF-38535 or for
device class M in MIL-PRF-38535, appendix A shall be provided with each lot of microcircuits delivered to this drawing.
3.8 Notification of change for device class M. For device class M, notification to DSCC-VA of change of product (see 6.2
herein) involving devices acquired to this drawing is required for any change as defined in MIL-PRF-38535, appendix A.
3.9 Verification and review for device class M. For device class M, DSCC, DSCC's agent, and the acquiring activity retain
the option to review the manufacturer's facility and applicable required documentation. Offshore documentation shall be made
available onshore at the option of the reviewer.
3.10 Microcircuit group assignment for device class M. Device class M devices covered by this drawing shall be in
microcircuit group number 42 (see MIL-PRF-38535, appendix A).
3.11 Processing options. Since the device is capable of being programmed by either the manufacturer or the user to result
in a wide variety of configurations; two processing options are provided for selection in the contract, using an altered item
drawing.
3.11.1 Unprogrammed device delivered to the user. All testing shall be verified through group A testing as defined in 4.4.1
and table IIA. It is recommended that users perform subgroups 7 and 9 after programming to verify the specific program
configuration.
3.11.2 Manufacturer-programmed device delivered to the user. All testing requirements and quality assurance provisions
herein, including the requirements of the altered item drawing, shall be satisfied by the manufacturer prior to delivery.
4. QUALITY ASSURANCE PROVISIONS
4.1 Sampling and inspection. For device classes Q and V, sampling and inspection procedures shall be in accordance with
MIL-PRF-38535 or as modified in the device manufacturer's Quality Management (QM) plan. The modification in the QM plan
shall not affect the form, fit, or function as described herein. For device class M, sampling and inspection procedures shall be
in accordance with MIL-PRF-38535, appendix A.
4.2 Screening. For device classes Q and V, screening shall be in accordance with MIL-PRF-38535, and shall be conducted
on all devices prior to qualification and technology conformance inspection. For device class M, screening shall be in
accordance with method 5004 of MIL-STD-883, and shall be conducted on all devices prior to quality conformance inspection.
4.2.1 Additional criteria for device class M.
a.
Delete the sequence specified as initial (preburn-in) electrical parameters through interim (postburn-in)
electrical parameters of method 5004 and substitute lines 1 through 6 of table IIA herein.
STANDARD
MICROCIRCUIT DRAWING
DEFENSE SUPPLY CENTER COLUMBUS
COLUMBUS, OHIO 43216-5000
DSCC FORM 2234
APR 97
SIZE
A
REVISION LEVEL
5962-99586
SHEET
B
5
FPGA/CPLD
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