MCC
Features
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omponents
21201 Itasca Street Chatsworth
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$
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SMCJ5.0
THRU
SMCJ170CA
Transient
Voltage Suppressor
5.0 to 170 Volts
1500 Watt
DO-214AB
(SMCJ) (LEAD FRAME)
G
For surface mount application in order to optimize board space
Low inductance
Low profile package
Built-in strain relief
Glass passivated junction
Excellent clamping capability
Repetition Rate( duty cycle): 0.05%
Fast response time: typical less than 1ps from 0V to BV min
Typical I
D
less than 1uA above 10V
High temperature soldering: 260 C/10 seconds at terminals
Plastic package has Underwrites Laboratory Flammability
Classification 94V-O
o
H
Mechanical Data
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D
CASE: JEDEC DO-214AB molded plastic body over
passivated junction
E
A
C
B
F
DIMENSIONS
INCHES
MIN
.079
.108
.002
.006
.030
..305
.260
.220
MM
MIN
2.00
2.75
0.051
0.152
0.76
7.75
6.60
5.59
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Terminals: solderable per MIL-STD-750, Method 2026
Polarity: Color band denotes positive end( cathode) except
Bi-directional types.
DIM
A
B
C
D
E
F
G
H
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Standard packaging: 16mm tape per ( EIA 481).
Weight: 0.007 ounce, 0.21 gram
Maximum Ratings @ 25
o
C Unless Otherwise Specified
Peak Pulse Current on
I
PPM
See Table 1 Amps
10/1000us
waveform(Note1, Fig3)
Peak Pulse Power
P
PPM
Minimum Watts
Disspation on 10/1000us
1500
waveform(Note1,2,Fig1)
Peak forward surge
I
FSM)
200.0
Amps
current (JEDEC
Method) (Note 2,3)
Operation And Storage
T
J
,
-55
o
C to
Temperature Range
T
STG
+150
o
C
MAX
.103
.128
.008
.012
.050
.320
.280
.245
MAX
2.62
3.25
0.203
0.305
1.27
8.13
7.11
6.22
NOTE
SUGGESTED SOLDER
PAD LAYOUT
0.185
0.121”
0.060”
NOTES:
o
1.
Non-repetitive current pulse per Fig.3 and derated above TA=25 C per Fig.2.
2
2.
Mounted on 8.0mm copper pads to each terminal.
3.
8.3ms, single half sine-wave or equivalent square wave, duty cycle=4 pulses per. Minutes maximum.
Version: 3
www.mccsemi.com
2003/01/01
SMCJ5.0 THRU SMCJ170CA
PEAK PULSE POWER(pppm) OR CURRENT
(Ipp)DERATING IN PERCENTAGE %
100
MCC
P
PPM
, PEAK PULSE POWER, KW
100
NON-REPETITIVE
PULSE WAVEFORM
SHOWN IN FIGURE 3
TA = 25
¢J
75
10
50
1.0
2
MOUNTED ON 5.0mm
COPPER LAND AREAS
25
0.1
0.1
£gs
1.0
£gs
10
£gs
100
£gs
1.0ms
10ms
0
0
25
50
75
100
125
150
175
200
td, PULSE WIDTH, SEC
T
A
, AMBIENT TEMPERATURE,
¢J
Fig. 1-PEAK PULSE POWER RATING CURVE
150
Fig. 2-PULSE DERATING CURVE
20,000
Ippm, PEAK PULSE CURRENT, %
TA = 25
¢J
tf = 10
£g
sec
Peak Value Ippm
100
Half Value-Ipp
2
Pulse Width(td) is Defined as the
Point Where the Peak Current
Decays to 50% of lpp
10,000
MEASURED AT
ZERO BIAS
CJ, CAPACITANCE, pF
1,000
TJ = 25
¢J
f = 1.0MHz
Vsig = 50mVp-p
MEASURED AT
STAND-OFF
VOLTAGE(VMW)
50
10/1000
£g
sec Waveform
as Defined by R.E.A.
e-kt
100
0
0
td
1.0
2.0
3.0
10
1.0
2.0
10
20
200
400
t, TIME , ms
Fig. 3-PULSE WAVEFORM
V(WM), REVERSE STAND-OFF VOLTAGE, VOLTS
Fig. 4-TYPICAL JUNCTION CAPACITANCE
400
I
FSM
, PEAK FORWARD SURGE
CURRENT, AMPERES
200
100
70
TJ = TJ max
8.3ms SINGLE HALF
SINCE-WAVE JEDEC
METHOD
0
1
2
4
6
8 10
20
60 80 100
NUMBER OF CYCLES AT 60Hz
Fig. 5-MAXIMUM NON-REPETITIVE PEAK FORWARD
SURGE CURRENT
Version: 3
www.mccsemi.com
2003/01/01
FPGA/CPLD
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