CDIP-24, Tube
| 参数名称 | 属性值 |
| Brand Name | Integrated Device Technology |
| 是否无铅 | 含铅 |
| 是否Rohs认证 | 不符合 |
| 厂商名称 | IDT (Integrated Device Technology) |
| 零件包装代码 | CDIP |
| 包装说明 | DIP, DIP24,.3 |
| 针数 | 24 |
| 制造商包装代码 | SD24 |
| Reach Compliance Code | _compli |
| 其他特性 | WITH INDEPENDENT OUTPUT ENABLE FOR EACH DIRECTION; WITH CLOCK ENABLE |
| 控制类型 | INDEPENDENT CONTROL |
| 计数方向 | BIDIRECTIONAL |
| 系列 | FCT |
| JESD-30 代码 | R-GDIP-T24 |
| JESD-609代码 | e0 |
| 长度 | 32.004 mm |
| 逻辑集成电路类型 | REGISTERED BUS TRANSCEIVER |
| 最大I（ol） | 0.048 A |
| 湿度敏感等级 | 1 |
| 位数 | 8 |
| 功能数量 | 1 |
| 端口数量 | 2 |
| 端子数量 | 24 |
| 最高工作温度 | 125 °C |
| 最低工作温度 | -55 °C |
| 输出特性 | 3-STATE |
| 输出极性 | TRUE |
| 封装主体材料 | CERAMIC, GLASS-SEALED |
| 封装代码 | DIP |
| 封装等效代码 | DIP24,.3 |
| 封装形状 | RECTANGULAR |
| 封装形式 | IN-LINE |
| 峰值回流温度（摄氏度） | 240 |
| 电源 | 5 V |
| Prop。Delay @ Nom-Su | 11 ns |
| 传播延迟（tpd） | 11 ns |
| 认证状态 | Not Qualified |
| 筛选级别 | MIL-STD-883 Class B |
| 座面最大高度 | 5.08 mm |
| 最大供电电压 (Vsup) | 5.5 V |
| 最小供电电压 (Vsup) | 4.5 V |
| 标称供电电压 (Vsup) | 5 V |
| 表面贴装 | NO |
| 技术 | CMOS |
| 温度等级 | MILITARY |
| 端子面层 | Tin/Lead (Sn/Pb) |
| 端子形式 | THROUGH-HOLE |
| 端子节距 | 2.54 mm |
| 端子位置 | DUAL |
| 处于峰值回流温度下的最长时间 | NOT SPECIFIED |
| 翻译 | N/A |
| 触发器类型 | POSITIVE EDGE |
| 宽度 | 7.62 mm |
| 29FCT52ATDB | 29FCT2052ATDB | 29FCT2052BTDB | 29FCT2052CTDB | 29FCT52ATLB | 29FCT52BTEB | 29FCT52CTLB | 29FCT52CTEB | 29FCT52BTDB | |
|---|---|---|---|---|---|---|---|---|---|
| 描述 | CDIP-24, Tube | Registered Bus Transceiver, 1-Func, 8-Bit, True Output, CMOS, CDIP24 | Registered Bus Transceiver, 1-Func, 8-Bit, True Output, CMOS, CDIP24 | Registered Bus Transceiver, 1-Func, 8-Bit, True Output, CMOS, CDIP24 | LCC-28, Tube | CPACK-24, Tube | LCC-28, Tube | CPACK-24, Tube | CDIP-24, Tube |
| 是否无铅 | 含铅 | 含铅 | 含铅 | 含铅 | 含铅 | 含铅 | 含铅 | 含铅 | 含铅 |
| 是否Rohs认证 | 不符合 | 不符合 | 不符合 | 不符合 | 不符合 | 不符合 | 不符合 | 不符合 | 不符合 |
| 包装说明 | DIP, DIP24,.3 | DIP, DIP24,.3 | DIP, DIP24,.3 | DIP, DIP24,.3 | QCCN, LCC28,.45SQ | CERPACK-24 | QCCN, LCC28,.45SQ | CERPACK-24 | DIP, DIP24,.3 |
| Reach Compliance Code | _compli | _compli | _compli | _compli | not_compliant | not_compliant | not_compliant | not_compliant | not_compliant |
| 控制类型 | INDEPENDENT CONTROL | INDEPENDENT CONTROL | INDEPENDENT CONTROL | INDEPENDENT CONTROL | INDEPENDENT CONTROL | INDEPENDENT CONTROL | INDEPENDENT CONTROL | INDEPENDENT CONTROL | INDEPENDENT CONTROL |
| 计数方向 | BIDIRECTIONAL | BIDIRECTIONAL | BIDIRECTIONAL | BIDIRECTIONAL | BIDIRECTIONAL | BIDIRECTIONAL | BIDIRECTIONAL | BIDIRECTIONAL | BIDIRECTIONAL |
| JESD-30 代码 | R-GDIP-T24 | R-XDIP-T24 | R-XDIP-T24 | R-XDIP-T24 | S-CQCC-N28 | R-GDFP-F24 | S-CQCC-N28 | R-GDFP-F24 | R-GDIP-T24 |
| JESD-609代码 | e0 | e0 | e0 | e0 | e0 | e0 | e0 | e0 | e0 |
| 逻辑集成电路类型 | REGISTERED BUS TRANSCEIVER | REGISTERED BUS TRANSCEIVER | REGISTERED BUS TRANSCEIVER | REGISTERED BUS TRANSCEIVER | REGISTERED BUS TRANSCEIVER | REGISTERED BUS TRANSCEIVER | REGISTERED BUS TRANSCEIVER | REGISTERED BUS TRANSCEIVER | REGISTERED BUS TRANSCEIVER |
| 最大I（ol） | 0.048 A | 0.012 A | 0.012 A | 0.012 A | 0.048 A | 0.048 A | 0.048 A | 0.048 A | 0.048 A |
| 位数 | 8 | 8 | 8 | 8 | 8 | 8 | 8 | 8 | 8 |
| 功能数量 | 1 | 1 | 1 | 1 | 1 | 1 | 1 | 1 | 1 |
| 端子数量 | 24 | 24 | 24 | 24 | 28 | 24 | 28 | 24 | 24 |
| 最高工作温度 | 125 °C | 125 °C | 125 °C | 125 °C | 125 °C | 125 °C | 125 °C | 125 °C | 125 °C |
| 最低工作温度 | -55 °C | -55 °C | -55 °C | -55 °C | -55 °C | -55 °C | -55 °C | -55 °C | -55 °C |
| 输出特性 | 3-STATE | 3-STATE | 3-STATE | 3-STATE | 3-STATE | 3-STATE | 3-STATE | 3-STATE | 3-STATE |
| 输出极性 | TRUE | TRUE | TRUE | TRUE | TRUE | TRUE | TRUE | TRUE | TRUE |
| 封装主体材料 | CERAMIC, GLASS-SEALED | CERAMIC | CERAMIC | CERAMIC | CERAMIC, METAL-SEALED COFIRED | CERAMIC, GLASS-SEALED | CERAMIC, METAL-SEALED COFIRED | CERAMIC, GLASS-SEALED | CERAMIC, GLASS-SEALED |
| 封装代码 | DIP | DIP | DIP | DIP | QCCN | QFF | QCCN | QFF | DIP |
| 封装等效代码 | DIP24,.3 | DIP24,.3 | DIP24,.3 | DIP24,.3 | LCC28,.45SQ | FL24,.4 | LCC28,.45SQ | FL24,.4 | DIP24,.3 |
| 封装形状 | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | SQUARE | RECTANGULAR | SQUARE | RECTANGULAR | RECTANGULAR |
| 封装形式 | IN-LINE | IN-LINE | IN-LINE | IN-LINE | CHIP CARRIER | FLATPACK | CHIP CARRIER | FLATPACK | IN-LINE |
| 峰值回流温度（摄氏度） | 240 | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | 260 | 260 | 260 | 260 | 240 |
| 电源 | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V |
| 认证状态 | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified |
| 筛选级别 | MIL-STD-883 Class B | 38535Q/M;38534H;883B | 38535Q/M;38534H;883B | 38535Q/M;38534H;883B | MIL-STD-883 Class B | MIL-STD-883 Class B | MIL-STD-883 Class B | MIL-STD-883 Class B | MIL-STD-883 Class B |
| 标称供电电压 (Vsup) | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V |
| 表面贴装 | NO | NO | NO | NO | YES | YES | YES | YES | NO |
| 技术 | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS |
| 温度等级 | MILITARY | MILITARY | MILITARY | MILITARY | MILITARY | MILITARY | MILITARY | MILITARY | MILITARY |
| 端子面层 | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) |
| 端子形式 | THROUGH-HOLE | THROUGH-HOLE | THROUGH-HOLE | THROUGH-HOLE | NO LEAD | FLAT | NO LEAD | FLAT | THROUGH-HOLE |
| 端子节距 | 2.54 mm | 2.54 mm | 2.54 mm | 2.54 mm | 1.27 mm | 1.27 mm | 1.27 mm | 1.27 mm | 2.54 mm |
| 端子位置 | DUAL | DUAL | DUAL | DUAL | QUAD | DUAL | QUAD | DUAL | DUAL |
| 处于峰值回流温度下的最长时间 | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED |
| 翻译 | N/A | N/A | N/A | N/A | N/A | N/A | N/A | N/A | N/A |
| 触发器类型 | POSITIVE EDGE | POSITIVE EDGE | POSITIVE EDGE | POSITIVE EDGE | POSITIVE EDGE | POSITIVE EDGE | POSITIVE EDGE | POSITIVE EDGE | POSITIVE EDGE |
| Brand Name | Integrated Device Technology | - | - | - | Integrated Device Technology | Integrated Device Technology | Integrated Device Technology | Integrated Device Technology | Integrated Device Technology |
| 厂商名称 | IDT (Integrated Device Technology) | - | - | - | - | IDT (Integrated Device Technology) | IDT (Integrated Device Technology) | IDT (Integrated Device Technology) | IDT (Integrated Device Technology) |
| 零件包装代码 | CDIP | - | - | - | LCC | CPACK | LCC | CPACK | CDIP |
| 针数 | 24 | - | - | - | 28 | 24 | 28 | 24 | 24 |
| 制造商包装代码 | SD24 | - | - | - | LC28 | CP24 | LC28 | CP24 | SD24 |
| 其他特性 | WITH INDEPENDENT OUTPUT ENABLE FOR EACH DIRECTION; WITH CLOCK ENABLE | - | - | - | WITH INDEPENDENT OUTPUT ENABLE FOR EACH DIRECTION; WITH CLOCK ENABLE | WITH INDEPENDENT OUTPUT ENABLE FOR EACH DIRECTION; WITH CLOCK ENABLE | WITH INDEPENDENT OUTPUT ENABLE FOR EACH DIRECTION; WITH CLOCK ENABLE | WITH INDEPENDENT OUTPUT ENABLE FOR EACH DIRECTION; WITH CLOCK ENABLE | WITH INDEPENDENT OUTPUT ENABLE FOR EACH DIRECTION; WITH CLOCK ENABLE |
| 系列 | FCT | - | - | - | FCT | FCT | FCT | FCT | FCT |
| 湿度敏感等级 | 1 | - | - | - | 1 | 1 | 1 | 1 | 1 |
| 端口数量 | 2 | - | - | - | 2 | 2 | 2 | 2 | 2 |
| 传播延迟（tpd） | 11 ns | - | - | - | 11 ns | 8 ns | 7.3 ns | 7.3 ns | 8 ns |
| 座面最大高度 | 5.08 mm | - | - | - | 2.54 mm | 2.286 mm | 2.54 mm | 2.286 mm | 5.08 mm |
| 最大供电电压 (Vsup) | 5.5 V | - | - | - | 5.5 V | 5.5 V | 5.5 V | 5.5 V | 5.5 V |
| 最小供电电压 (Vsup) | 4.5 V | - | - | - | 4.5 V | 4.5 V | 4.5 V | 4.5 V | 4.5 V |
| 宽度 | 7.62 mm | - | - | - | 11.4554 mm | 9.144 mm | 11.4554 mm | 9.144 mm | 7.62 mm |
| Prop。Delay @ Nom-Sup | - | - | - | - | 11 ns | 8 ns | 7.3 ns | 7.3 ns | 8 ns |
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