Analog Circuit, CMOS, PDSO16,
参数名称 | 属性值 |
是否Rohs认证 | 符合 |
厂商名称 | Diodes Incorporated |
包装说明 | SOP, SOP16,.25 |
Reach Compliance Code | compli |
ECCN代码 | EAR99 |
Factory Lead Time | 19 weeks |
模拟集成电路 - 其他类型 | ANALOG CIRCUIT |
JESD-30 代码 | R-PDSO-G16 |
端子数量 | 16 |
最高工作温度 | 70 °C |
最低工作温度 | -20 °C |
封装主体材料 | PLASTIC/EPOXY |
封装代码 | SOP |
封装等效代码 | SOP16,.25 |
封装形状 | RECTANGULAR |
封装形式 | SMALL OUTLINE |
电源 | 5 V |
认证状态 | Not Qualified |
标称供电电压 (Vsup) | 5 V |
表面贴装 | YES |
技术 | CMOS |
温度等级 | COMMERCIAL |
端子形式 | GULL WING |
端子节距 | 1.27 mm |
端子位置 | DUAL |
PT8A2647WE | PT8A2641WE | PT8A2642PE | PT8A2645PE | PT8A2646PE | PT8A2646WE | PT8A2647PE | |
---|---|---|---|---|---|---|---|
描述 | Analog Circuit, CMOS, PDSO16, | Analog Circuit, CMOS, PDSO16, | Analog Circuit, CMOS, PDIP16, | Analog Circuit, CMOS, PDIP16, | Analog Circuit, CMOS, PDIP16, | Analog Circuit, CMOS, PDSO16, | Analog Circuit, CMOS, PDIP16, |
是否Rohs认证 | 符合 | 符合 | 符合 | 符合 | 符合 | 符合 | 符合 |
厂商名称 | Diodes Incorporated | Diodes Incorporated | Diodes Incorporated | Diodes Incorporated | Diodes Incorporated | Diodes Incorporated | Diodes Incorporated |
包装说明 | SOP, SOP16,.25 | SOP, SOP16,.25 | DIP, DIP16,.3 | DIP, DIP16,.3 | DIP, DIP16,.3 | SOP, SOP16,.25 | DIP, DIP16,.3 |
Reach Compliance Code | compli | compli | compli | compli | compli | compli | compli |
ECCN代码 | EAR99 | EAR99 | EAR99 | EAR99 | EAR99 | EAR99 | EAR99 |
Factory Lead Time | 19 weeks | 19 weeks | 19 weeks | 19 weeks | 19 weeks | 19 weeks | 19 weeks |
模拟集成电路 - 其他类型 | ANALOG CIRCUIT | ANALOG CIRCUIT | ANALOG CIRCUIT | ANALOG CIRCUIT | ANALOG CIRCUIT | ANALOG CIRCUIT | ANALOG CIRCUIT |
JESD-30 代码 | R-PDSO-G16 | R-PDSO-G16 | R-PDIP-T16 | R-PDIP-T16 | R-PDIP-T16 | R-PDSO-G16 | R-PDIP-T16 |
端子数量 | 16 | 16 | 16 | 16 | 16 | 16 | 16 |
最高工作温度 | 70 °C | 70 °C | 70 °C | 70 °C | 70 °C | 70 °C | 70 °C |
最低工作温度 | -20 °C | -20 °C | -20 °C | -20 °C | -20 °C | -20 °C | -20 °C |
封装主体材料 | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY |
封装代码 | SOP | SOP | DIP | DIP | DIP | SOP | DIP |
封装等效代码 | SOP16,.25 | SOP16,.25 | DIP16,.3 | DIP16,.3 | DIP16,.3 | SOP16,.25 | DIP16,.3 |
封装形状 | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR |
封装形式 | SMALL OUTLINE | SMALL OUTLINE | IN-LINE | IN-LINE | IN-LINE | SMALL OUTLINE | IN-LINE |
电源 | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V |
认证状态 | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified |
标称供电电压 (Vsup) | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V |
表面贴装 | YES | YES | NO | NO | NO | YES | NO |
技术 | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS |
温度等级 | COMMERCIAL | COMMERCIAL | COMMERCIAL | COMMERCIAL | COMMERCIAL | COMMERCIAL | COMMERCIAL |
端子形式 | GULL WING | GULL WING | THROUGH-HOLE | THROUGH-HOLE | THROUGH-HOLE | GULL WING | THROUGH-HOLE |
端子节距 | 1.27 mm | 1.27 mm | 2.54 mm | 2.54 mm | 2.54 mm | 1.27 mm | 2.54 mm |
端子位置 | DUAL | DUAL | DUAL | DUAL | DUAL | DUAL | DUAL |
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