4 Megabit 512K x 8 Low Voltage OTP CMOS EPROM
| 参数名称 | 属性值 |
| 是否Rohs认证 | 不符合 |
| 厂商名称 | Atmel (Microchip) |
| 零件包装代码 | TSOP1 |
| 包装说明 | TSOP1, TSSOP32,.8,20 |
| 针数 | 32 |
| Reach Compliance Code | compli |
| ECCN代码 | EAR99 |
| 最长访问时间 | 150 ns |
| 其他特性 | CAN ALSO OPERATE WITH 5V SUPPLY |
| I/O 类型 | COMMON |
| JESD-30 代码 | R-PDSO-G32 |
| JESD-609代码 | e0 |
| 长度 | 18.4 mm |
| 内存密度 | 4194304 bi |
| 内存集成电路类型 | OTP ROM |
| 内存宽度 | 8 |
| 湿度敏感等级 | 3 |
| 功能数量 | 1 |
| 端子数量 | 32 |
| 字数 | 524288 words |
| 字数代码 | 512000 |
| 工作模式 | ASYNCHRONOUS |
| 最高工作温度 | 85 °C |
| 最低工作温度 | -40 °C |
| 组织 | 512KX8 |
| 输出特性 | 3-STATE |
| 封装主体材料 | PLASTIC/EPOXY |
| 封装代码 | TSOP1 |
| 封装等效代码 | TSSOP32,.8,20 |
| 封装形状 | RECTANGULAR |
| 封装形式 | SMALL OUTLINE, THIN PROFILE |
| 并行/串行 | PARALLEL |
| 峰值回流温度（摄氏度） | 240 |
| 电源 | 3.3/5 V |
| 认证状态 | Not Qualified |
| 座面最大高度 | 1.2 mm |
| 最大待机电流 | 0.00002 A |
| 最大压摆率 | 0.03 mA |
| 最大供电电压 (Vsup) | 3.6 V |
| 最小供电电压 (Vsup) | 3 V |
| 标称供电电压 (Vsup) | 3.3 V |
| 表面贴装 | YES |
| 技术 | CMOS |
| 温度等级 | INDUSTRIAL |
| 端子面层 | Tin/Lead (Sn/Pb) |
| 端子形式 | GULL WING |
| 端子节距 | 0.5 mm |
| 端子位置 | DUAL |
| 处于峰值回流温度下的最长时间 | 30 |
| 宽度 | 8 mm |
| AT27LV040A-15TI | AT27LV040A | AT27LV040A-12JC | AT27LV040A-12TC | AT27LV040A-15 | AT27LV040A-12 | AT27LV040A-12JI | AT27LV040A-12TI | AT27LV040A-15JI | AT27LV040A-15TC | |
|---|---|---|---|---|---|---|---|---|---|---|
| 描述 | 4 Megabit 512K x 8 Low Voltage OTP CMOS EPROM | 4 Megabit 512K x 8 Low Voltage OTP CMOS EPROM | 4 Megabit 512K x 8 Low Voltage OTP CMOS EPROM | 4 Megabit 512K x 8 Low Voltage OTP CMOS EPROM | 4 Megabit 512K x 8 Low Voltage OTP CMOS EPROM | 4 Megabit 512K x 8 Low Voltage OTP CMOS EPROM | 4 Megabit 512K x 8 Low Voltage OTP CMOS EPROM | 4 Megabit 512K x 8 Low Voltage OTP CMOS EPROM | 4 Megabit 512K x 8 Low Voltage OTP CMOS EPROM | 4 Megabit 512K x 8 Low Voltage OTP CMOS EPROM |
| 是否Rohs认证 | 不符合 | - | 不符合 | 不符合 | - | - | 不符合 | 不符合 | 不符合 | 不符合 |
| 厂商名称 | Atmel (Microchip) | - | Atmel (Microchip) | Atmel (Microchip) | - | - | Atmel (Microchip) | Atmel (Microchip) | Atmel (Microchip) | Atmel (Microchip) |
| 零件包装代码 | TSOP1 | - | QFJ | TSOP1 | - | - | QFJ | TSOP1 | QFJ | TSOP1 |
| 包装说明 | TSOP1, TSSOP32,.8,20 | - | QCCJ, LDCC32,.5X.6 | TSOP1, TSSOP32,.8,20 | - | - | QCCJ, LDCC32,.5X.6 | TSOP1, TSSOP32,.8,20 | QCCJ, LDCC32,.5X.6 | TSOP1, TSSOP32,.8,20 |
| 针数 | 32 | - | 32 | 32 | - | - | 32 | 32 | 32 | 32 |
| Reach Compliance Code | compli | - | compli | compli | - | - | compli | compli | unknow | compli |
| ECCN代码 | EAR99 | - | EAR99 | EAR99 | - | - | EAR99 | EAR99 | EAR99 | EAR99 |
| 最长访问时间 | 150 ns | - | 120 ns | 120 ns | - | - | 120 ns | 120 ns | 150 ns | 150 ns |
| 其他特性 | CAN ALSO OPERATE WITH 5V SUPPLY | - | CAN ALSO OPERATE WITH 5V SUPPLY | CAN ALSO OPERATE WITH 5V SUPPLY | - | - | CAN ALSO OPERATE WITH 5V SUPPLY | CAN ALSO OPERATE WITH 5V SUPPLY | CAN ALSO OPERATE WITH 5V SUPPLY | CAN ALSO OPERATE WITH 5V SUPPLY |
| I/O 类型 | COMMON | - | COMMON | COMMON | - | - | COMMON | COMMON | COMMON | COMMON |
| JESD-30 代码 | R-PDSO-G32 | - | R-PQCC-J32 | R-PDSO-G32 | - | - | R-PQCC-J32 | R-PDSO-G32 | R-PQCC-J32 | R-PDSO-G32 |
| JESD-609代码 | e0 | - | e0 | e0 | - | - | e0 | e0 | e0 | e0 |
| 长度 | 18.4 mm | - | 13.97 mm | 18.4 mm | - | - | 13.97 mm | 18.4 mm | 13.97 mm | 18.4 mm |
| 内存密度 | 4194304 bi | - | 4194304 bi | 4194304 bi | - | - | 4194304 bi | 4194304 bi | 4194304 bi | 4194304 bi |
| 内存集成电路类型 | OTP ROM | - | OTP ROM | OTP ROM | - | - | OTP ROM | OTP ROM | OTP ROM | OTP ROM |
| 内存宽度 | 8 | - | 8 | 8 | - | - | 8 | 8 | 8 | 8 |
| 湿度敏感等级 | 3 | - | 2 | 3 | - | - | 2 | 3 | 2 | 3 |
| 功能数量 | 1 | - | 1 | 1 | - | - | 1 | 1 | 1 | 1 |
| 端子数量 | 32 | - | 32 | 32 | - | - | 32 | 32 | 32 | 32 |
| 字数 | 524288 words | - | 524288 words | 524288 words | - | - | 524288 words | 524288 words | 524288 words | 524288 words |
| 字数代码 | 512000 | - | 512000 | 512000 | - | - | 512000 | 512000 | 512000 | 512000 |
| 工作模式 | ASYNCHRONOUS | - | ASYNCHRONOUS | ASYNCHRONOUS | - | - | ASYNCHRONOUS | ASYNCHRONOUS | ASYNCHRONOUS | ASYNCHRONOUS |
| 最高工作温度 | 85 °C | - | 70 °C | 70 °C | - | - | 85 °C | 85 °C | 85 °C | 70 °C |
| 组织 | 512KX8 | - | 512KX8 | 512KX8 | - | - | 512KX8 | 512KX8 | 512KX8 | 512KX8 |
| 输出特性 | 3-STATE | - | 3-STATE | 3-STATE | - | - | 3-STATE | 3-STATE | 3-STATE | 3-STATE |
| 封装主体材料 | PLASTIC/EPOXY | - | PLASTIC/EPOXY | PLASTIC/EPOXY | - | - | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY |
| 封装代码 | TSOP1 | - | QCCJ | TSOP1 | - | - | QCCJ | TSOP1 | QCCJ | TSOP1 |
| 封装等效代码 | TSSOP32,.8,20 | - | LDCC32,.5X.6 | TSSOP32,.8,20 | - | - | LDCC32,.5X.6 | TSSOP32,.8,20 | LDCC32,.5X.6 | TSSOP32,.8,20 |
| 封装形状 | RECTANGULAR | - | RECTANGULAR | RECTANGULAR | - | - | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR |
| 封装形式 | SMALL OUTLINE, THIN PROFILE | - | CHIP CARRIER | SMALL OUTLINE, THIN PROFILE | - | - | CHIP CARRIER | SMALL OUTLINE, THIN PROFILE | CHIP CARRIER | SMALL OUTLINE, THIN PROFILE |
| 并行/串行 | PARALLEL | - | PARALLEL | PARALLEL | - | - | PARALLEL | PARALLEL | PARALLEL | PARALLEL |
| 峰值回流温度（摄氏度） | 240 | - | 225 | 240 | - | - | 225 | 240 | 225 | 240 |
| 电源 | 3.3/5 V | - | 3.3/5 V | 3.3/5 V | - | - | 3.3/5 V | 3.3/5 V | 3.3/5 V | 3.3/5 V |
| 认证状态 | Not Qualified | - | Not Qualified | Not Qualified | - | - | Not Qualified | Not Qualified | Not Qualified | Not Qualified |
| 座面最大高度 | 1.2 mm | - | 3.55 mm | 1.2 mm | - | - | 3.55 mm | 1.2 mm | 3.55 mm | 1.2 mm |
| 最大待机电流 | 0.00002 A | - | 0.00002 A | 0.00002 A | - | - | 0.00002 A | 0.00002 A | 0.00002 A | 0.00002 A |
| 最大压摆率 | 0.03 mA | - | 0.03 mA | 0.03 mA | - | - | 0.03 mA | 0.03 mA | 0.03 mA | 0.03 mA |
| 最大供电电压 (Vsup) | 3.6 V | - | 3.6 V | 3.6 V | - | - | 3.6 V | 3.6 V | 3.6 V | 3.6 V |
| 最小供电电压 (Vsup) | 3 V | - | 3 V | 3 V | - | - | 3 V | 3 V | 3 V | 3 V |
| 标称供电电压 (Vsup) | 3.3 V | - | 3.3 V | 3.3 V | - | - | 3.3 V | 3.3 V | 3.3 V | 3.3 V |
| 表面贴装 | YES | - | YES | YES | - | - | YES | YES | YES | YES |
| 技术 | CMOS | - | CMOS | CMOS | - | - | CMOS | CMOS | CMOS | CMOS |
| 温度等级 | INDUSTRIAL | - | COMMERCIAL | COMMERCIAL | - | - | INDUSTRIAL | INDUSTRIAL | INDUSTRIAL | COMMERCIAL |
| 端子面层 | Tin/Lead (Sn/Pb) | - | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | - | - | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) |
| 端子形式 | GULL WING | - | J BEND | GULL WING | - | - | J BEND | GULL WING | J BEND | GULL WING |
| 端子节距 | 0.5 mm | - | 1.27 mm | 0.5 mm | - | - | 1.27 mm | 0.5 mm | 1.27 mm | 0.5 mm |
| 端子位置 | DUAL | - | QUAD | DUAL | - | - | QUAD | DUAL | QUAD | DUAL |
| 处于峰值回流温度下的最长时间 | 30 | - | 30 | 30 | - | - | 30 | 30 | 30 | 30 |
| 宽度 | 8 mm | - | 11.43 mm | 8 mm | - | - | 11.43 mm | 8 mm | 11.43 mm | 8 mm |
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