Standard SRAM, 32KX32, CMOS, PQFP100
参数名称 | 属性值 |
厂商名称 | United Microelectronics Corporation |
包装说明 | QFP, |
Reach Compliance Code | unknow |
ECCN代码 | EAR99 |
JESD-30 代码 | R-PQFP-G100 |
内存密度 | 1048576 bi |
内存集成电路类型 | STANDARD SRAM |
内存宽度 | 32 |
功能数量 | 1 |
端口数量 | 1 |
端子数量 | 100 |
字数 | 32768 words |
字数代码 | 32000 |
工作模式 | SYNCHRONOUS |
最高工作温度 | 70 °C |
最低工作温度 | |
组织 | 32KX32 |
输出特性 | 3-STATE |
可输出 | YES |
封装主体材料 | PLASTIC/EPOXY |
封装代码 | QFP |
封装形状 | RECTANGULAR |
封装形式 | FLATPACK |
并行/串行 | PARALLEL |
认证状态 | Not Qualified |
最大供电电压 (Vsup) | 3.6 V |
最小供电电压 (Vsup) | 3.1 V |
标称供电电压 (Vsup) | 3.3 V |
表面贴装 | YES |
技术 | CMOS |
温度等级 | COMMERCIAL |
端子形式 | GULL WING |
端子位置 | QUAD |
UM61L3232AE-5 | UM61L3232AE-6 | UM61L3232AE-7 | UM61L3232AE-8 | UM61L3232AF-7 | UM61L3232AF-6 | UM61L3232AF-5 | UM61L3232AF-8 | |
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描述 | Standard SRAM, 32KX32, CMOS, PQFP100 | Standard SRAM, 32KX32, CMOS, PQFP100 | Standard SRAM, 32KX32, CMOS, PQFP100 | Standard SRAM, 32KX32, CMOS, PQFP100 | Standard SRAM, 32KX32, CMOS, PQFP100 | Standard SRAM, 32KX32, CMOS, PQFP100 | Standard SRAM, 32KX32, CMOS, PQFP100 | Standard SRAM, 32KX32, CMOS, PQFP100 |
Reach Compliance Code | unknow | unknown | unknown | unknown | unknown | unknown | unknown | unknown |
ECCN代码 | EAR99 | EAR99 | EAR99 | EAR99 | EAR99 | EAR99 | EAR99 | EAR99 |
JESD-30 代码 | R-PQFP-G100 | R-PQFP-G100 | R-PQFP-G100 | R-PQFP-G100 | R-PQFP-G100 | R-PQFP-G100 | R-PQFP-G100 | R-PQFP-G100 |
内存密度 | 1048576 bi | 1048576 bit | 1048576 bit | 1048576 bit | 1048576 bit | 1048576 bit | 1048576 bit | 1048576 bit |
内存集成电路类型 | STANDARD SRAM | STANDARD SRAM | STANDARD SRAM | STANDARD SRAM | STANDARD SRAM | STANDARD SRAM | STANDARD SRAM | STANDARD SRAM |
内存宽度 | 32 | 32 | 32 | 32 | 32 | 32 | 32 | 32 |
功能数量 | 1 | 1 | 1 | 1 | 1 | 1 | 1 | 1 |
端口数量 | 1 | 1 | 1 | 1 | 1 | 1 | 1 | 1 |
端子数量 | 100 | 100 | 100 | 100 | 100 | 100 | 100 | 100 |
字数 | 32768 words | 32768 words | 32768 words | 32768 words | 32768 words | 32768 words | 32768 words | 32768 words |
字数代码 | 32000 | 32000 | 32000 | 32000 | 32000 | 32000 | 32000 | 32000 |
工作模式 | SYNCHRONOUS | SYNCHRONOUS | SYNCHRONOUS | SYNCHRONOUS | SYNCHRONOUS | SYNCHRONOUS | SYNCHRONOUS | SYNCHRONOUS |
最高工作温度 | 70 °C | 70 °C | 70 °C | 70 °C | 70 °C | 70 °C | 70 °C | 70 °C |
组织 | 32KX32 | 32KX32 | 32KX32 | 32KX32 | 32KX32 | 32KX32 | 32KX32 | 32KX32 |
输出特性 | 3-STATE | 3-STATE | 3-STATE | 3-STATE | 3-STATE | 3-STATE | 3-STATE | 3-STATE |
可输出 | YES | YES | YES | YES | YES | YES | YES | YES |
封装主体材料 | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY |
封装代码 | QFP | QFP | QFP | QFP | QFP | QFP | QFP | QFP |
封装形状 | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR |
封装形式 | FLATPACK | FLATPACK | FLATPACK | FLATPACK | FLATPACK | FLATPACK | FLATPACK | FLATPACK |
并行/串行 | PARALLEL | PARALLEL | PARALLEL | PARALLEL | PARALLEL | PARALLEL | PARALLEL | PARALLEL |
认证状态 | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified |
最大供电电压 (Vsup) | 3.6 V | 3.6 V | 3.6 V | 3.6 V | 3.6 V | 3.6 V | 3.6 V | 3.6 V |
最小供电电压 (Vsup) | 3.1 V | 3.1 V | 3.1 V | 3.1 V | 3.1 V | 3.1 V | 3.1 V | 3.1 V |
标称供电电压 (Vsup) | 3.3 V | 3.3 V | 3.3 V | 3.3 V | 3.3 V | 3.3 V | 3.3 V | 3.3 V |
表面贴装 | YES | YES | YES | YES | YES | YES | YES | YES |
技术 | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS |
温度等级 | COMMERCIAL | COMMERCIAL | COMMERCIAL | COMMERCIAL | COMMERCIAL | COMMERCIAL | COMMERCIAL | COMMERCIAL |
端子形式 | GULL WING | GULL WING | GULL WING | GULL WING | GULL WING | GULL WING | GULL WING | GULL WING |
端子位置 | QUAD | QUAD | QUAD | QUAD | QUAD | QUAD | QUAD | QUAD |
厂商名称 | United Microelectronics Corporation | - | United Microelectronics Corporation | - | - | United Microelectronics Corporation | United Microelectronics Corporation | United Microelectronics Corporation |
包装说明 | QFP, | QFP, | QFP, | QFP, | - | QFP, | QFP, | QFP, |
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