电子工程世界电子工程世界电子工程世界

关键词

搜索

型号

搜索

MMA02045016R5FLF13

产品描述Fixed Resistor, Metal Glaze/thick Film, 0.5W, 16.5ohm, 400V, 1% +/-Tol, 50ppm/Cel, Surface Mount, 1206, ROHS COMPLIANT
产品类别无源元件    电阻器   
文件大小378KB,共3页
制造商TT Electronics plc
官网地址http://www.ttelectronics.com/
标准  
下载文档 详细参数 全文预览

MMA02045016R5FLF13概述

Fixed Resistor, Metal Glaze/thick Film, 0.5W, 16.5ohm, 400V, 1% +/-Tol, 50ppm/Cel, Surface Mount, 1206, ROHS COMPLIANT

MMA02045016R5FLF13规格参数

参数名称属性值
是否无铅不含铅
是否Rohs认证符合
厂商名称TT Electronics plc
包装说明ROHS COMPLIANT
Reach Compliance Codecompli
ECCN代码EAR99
构造Cylindrical
JESD-609代码e1
安装特点SURFACE MOUNT
端子数量2
最高工作温度150 °C
最低工作温度-55 °C
封装直径1.45 mm
封装长度3.25 mm
封装形状CYLINDRICAL PACKAGE
封装形式MELF
包装方法TR, 13 INCH
额定功率耗散 (P)0.5 W
额定温度80 °C
电阻16.5 Ω
电阻器类型FIXED RESISTOR
尺寸代码1206
表面贴装YES
技术METAL GLAZE/THICK FILM
温度系数50 ppm/°C
端子面层Tin/Silver/Copper (Sn/Ag/Cu)
端子形状WRAPAROUND
容差1%
工作电压400 V

文档预览

下载PDF文档
al Glaze
Glaze™ General Purpose
General Purpose
Metal
face
Surface Mount Power Resistor
Mount Power Resistor
es
Metal Glaze
General Purpose
·
Up to 2 watts
Mount Power Resistor
Surface
MM Series
MM Series
watts
00 volts
·
·
·
Up to 1000 volts
0.1 ohm to 2.2 megohm range
150°C maximum operating temperature
Metal Glaze™ thick
film element fired
at 1000°C to solid
ceramic substrate
Metal Glaze™ thick
film element fired
at 1000°C to solid
ceramic substrate
to 2.2 megohm
2
range
Up to watts
0.1 ohm to 2.2 megohm range
150°C maximum operating temperature
Up to 1000 volts
aximum operating temperature
60/40 Solder
temperature
dielectric
over nickel barrier
coating
60/40 Solder
over nickel barrier
High
High
temperature
dielectric
coating
ical Data
Electrical Data
Industry
Footprint
Maximum
Resistance
Maximum
Resistance
IRC
Working
Size
Industry
Power
IRC
Working
Range
Power
Range
Type
Voltage
Code Footprint
Type
Voltage
(ohms)²
Rating
Rating
(ohms)²
MMA0204
F
B
1206
MMA0204
Tolerance
(+%)³
(+%)³
1, 2, 5
1, 2, 5
Tolerance
1, 2, 5
5
0.5
5
TCR
Product
(ppm/°C)³
(ppm/°C)³
Category
100
50, 100
50, 100
100
50, 100
50, 100
100
50, 100
TCR
100
Product
Category
1206
1/2
1/2
400
400
0.1 to 0.99
0.1 to 0.99
Low Range
Standard
1.0
20 to 348K
to 1.0M
0.1 to 0.99
20 to 348K
1.0 to 1.0M
Low Range
Standard
1, 2,
0.25, 0.5
1, 2, 5
0.25,
1, 2, 5
0.25, 0.5
1, 2, 5
50, 100
Tolerance
Tight
100
Standard
Low
50, 100
Range
Tight Toleran
Tight Tolerance
2512
MMB0207
1
700
0.1 to 0.99
1.0 to 2.21M
20 to 348K
1, 2, 5
Low Range
Standard
2512
MMB0207
H
3610
MMC0310
1
2
700
1000
1.0 to 2.21M
0.1 to 0.99
20
1.0 to 2.21M
to 348K
0.1 to 0.99
1.0 to 2.21M
1,
1, 2, 5
2,
50, 100
Range
Low
100
50, 100
¹Not to exceed
P x R
0.25, 0.5
1, 2, 5
1, 2, 5
50, 100
Standard
Tight Toleran
Standard
²Consult factory for tighter TCR, tolerance, or resistance values.
3610
MMC0310
2
1000
Low Range
ceed
P x R
Environmental Data
Temperature Coefficient
Thermal Shock
²Consult
ri
factory for tighter
i
TCR, tolerance, or resistance values.
ethod
Characte stics
Max mum Change
Test M
As specified
±0.5% +0.01
±0.25% +0.01
±1% for R>100K
MIL-R-55342E Par 4.7.9 (-55°C +125°C)
MIL-R-55342E Par 4.7.3 (-65°C +150°C, 5 cycles)
MIL-R-55342E Par 4.7.4 (-65°C @ working voltage)
MIL-R-55342E Par 4.7.5
2.5 x
P x R for 5 seconds
onmental Data
Low Temperature Operation
Characte
Short
cs
Overload
risti
Time
Maxim
±0.5%
Change
um
+0.01
Test Method
ture Coefficient
As
High Temperature Exposure
specified
+0.01
±0.5%
Resistance to Bonding Exposure
+0.01
+0.01
±0.5%
±0.25%
Solderability
Moisture Resistance
MIL-R-55342E Par 4.7.9 (-55°C +125°C)
MIL-R-55342E Par 4.7.6 (+150°C for 100 hours)
MIL-R-55342E Par 4.7.7
(Reflow
(-65°C +150°C, 5 cycles)
MIL-R-55342E Par 4.7.3
soldered to board at 260°C for 10 seconds)
Shock
perature Operation
Life Test
±0.25% +0.01
95% minimum coverage MIL-STD-202, Method 208 (245°C for 5 seconds)
±0.5% +0.01
MIL-R-55342E Par 4.7.4 (-65°C @ working voltage)
MIL-R-55342E Par 4.7.8 (10 cycles, total 240 hours)
me Overload
mperature Exposure
Terminal Adhesion Strength
±0.5% +0.01
+0.01
±0.5%
±1% for R>100K
±1% +0.01
±0.5% +0.01
no mechanical damage
±0.5% +0.01
MIL-R-55342E Par 4.7.5
hours @ 70°C intermittent)
MIL-R-55342E Par 4.7.10 (2000
2.5 x
P x
push from underside of mounted chip for
1200 gram
R for 5 seconds
MIL-R-55342E Par 4.7.6 (+150°C for 100 hours)
Chip mounted in center of 90mm long board, deflected 5mm
60 seconds
ce to Bonding Exposure
General Note
General Note
Resistance to Board Bending
no mechanical damage
MIL-R-55342E Par 4.7.7
(Reflow
10 seconds
board at 260°C for 10 seconds
so as to exert pull on chip contacts for
soldered to
±0.25% +0.01
ility
95% minimum coverage MIL-STD-202, Method 208 (245°C for 5 seconds)
Facsimile:
Website: www.irctt.com
rpus Christi Te
r
A subsidiary of
Resistance
±0.5% +0.01
MIL-R-55342E
www.bitechnologies.com
cycles, total 240 hours)
Par 4.7.8 (10
www.irctt.com www.welwyn-tt.com
All information is subject to TT electronics’ own data and is considered accurate at time of going to print.
TT electronics plc
IRC reserves the right to make changes in product specification without notice or liability.
TT electronics reserves the right
and is considered accurate at time of going to print.
All information is subject to IRC’s own data
to make changes in product specification without notice or liability.
Wire and Film Technologies Division
Telephone:
© TT electronics plc
±0.5% +0.01
MIL-R-55342E Par 4.7.10 (2000 hours @ 70°C intermittent
09.12
TI秀+我买的开发板
本帖最后由 led2015 于 2014-2-23 23:56 编辑 这两块是我在淘宝花了400块买的DSP2812开发板和M3 LM3S6911开发板,都是用在自学上的。这两块板子都是自学开发的基础,值得研究一下的。 DSP28 ......
led2015 微控制器 MCU
WM输入法的问题,能不能把拼音输入删掉或者进入编辑框是默认是英文
总是默认拼音,搞的很郁闷,我只用字母和数字,不打汉字 。。 ...
wyh121w 嵌入式系统
msp430F169当程序中都使用TimeA与P1口的中断服务程序
msp430F169当程序中都使用TimeA与P1口的中断服务程序,为什么跳转不到P0口的中断服务函数...
叶子。。。 微控制器 MCU
TPS55340 和 LM5122 的 TI-PMLK 升压实验板
本帖最后由 Jacktang 于 2020-4-24 22:57 编辑 此 LDO 实验板是五块板的其中一块,是电源管理实验室套件 (PMLK) 的一部分。此 LDO 实验板有两个不同部分采用两种不同的 IC:TPS7A4901 和 TPS ......
Jacktang 模拟与混合信号
预编译处理/程序格式命名
预编译处理/程序格式命名 2010-05-03 13:11 第九章 c/c++编译预处理 一、文件包含#include <头文件名称>#include "头文件名称" 第一种形式 : 用来包含开发环境提供的库头文 ......
安_然 DSP 与 ARM 处理器
手机PCB设计指南
123118 天线的设计 1, PIFA双频天线高度≥7mm,面积≥600mm2,有效容积≥5000mm3 PIFA 2, 三频天线高度≥7.5mm,面积≥700mm2,有效容积≥5500mm3 3, PIFA天线与连接器之间的压紧 ......
error_echo PCB设计

 
EEWorld订阅号

 
EEWorld服务号

 
汽车开发圈

 
机器人开发圈

About Us 关于我们 客户服务 联系方式 器件索引 网站地图 最新更新 手机版

站点相关: 大学堂 TI培训 Datasheet 电子工程 索引文件: 960  1863  2665  1571  285  45  42  40  38  6 

器件索引   0 1 2 3 4 5 6 7 8 9 A B C D E F G H I J K L M N O P Q R S T U V W X Y Z

北京市海淀区中关村大街18号B座15层1530室 电话:(010)82350740 邮编:100190

电子工程世界版权所有 京B2-20211791 京ICP备10001474号-1 电信业务审批[2006]字第258号函 京公网安备 11010802033920号 Copyright © 2005-2026 EEWORLD.com.cn, Inc. All rights reserved