High Voltage
Chip Resistors
HVC Series
•
•
•
•
•
Continuous voltages up to 3KV
Resistance Values from 100KW to 100MW
Tolerances of ±0.5% to ±10%
Sn/Pb or Matte Sn wrap-around terminations
Standard chip sizes available from 1206 to 2512
•
Robust thick film construction
Electrical Data
Characteristic
Maximum Rated Voltage
1
Voltage Coefficient of Resistance
1206
1000V
-25 ppm/V Max.
-15 ppm/V Typ.
2010
2000V
-15 ppm/V Max.
-5 ppm/V Typ.
10MW to 100MW (±5%, ±10%)
300mW
500mW
-55°C to +155°C
200°C/W
80°C/W
±100ppm/°C
Wrap-around Sn/Pb or matte Sn with leach resistant Ni barrier
70°C/W
1000mW
2512
3000V
-5 ppm/V Max.
-1.5 ppm/V Typ.
Resistance Range (Tolerance)
Power @ 70°C
Operating Temperature
Thermal Impedance
TCR
Termination
Notes: 1. Voltage Limited to √PxR
2. ±0.5% in 2512 package only
100KW to 10M (±0.5%
2
,±1%, ±2% ,±5%, ±10%)
Environmental Data
Test
Load life at rated power (1000 hours @ 70°C)
Overload (6.25 X rated power for 2 seconds)
High temperature storage (1000 hours @ 155°C)
Moisture resistance
Thermal shock
Resistance to soldering heat
Maximum
∆R
0.50%
0.50%
0.50%
0.50%
0.25%
0.25%
Typical
∆R
0.25%
0.10%
0.20%
0.25%
0.05%
0.05%
General Note
IRC reserves the right to make changes in product specification without notice or liability.
All information is subject to IRC’s own data and is considered accurate at time of going to print.
Advanced Film Division
• 4222 South Staples Street • Corpus Christi Texas 78411 USA
Telephone: 361 992 7900 • Facsimile: 361 992 3377 • Website: www.irctt.com
A subsidiary of
TTelectronics plc
PWC Series Issue July 2008
High Voltage
Chip Resistors
Physical Data
L
(mm)
1206
3.2±0.2
W
(mm)
1.6±0.2
T max
(mm)
0.6
A
(mm)
0.5±0.2
C
(mm)
0.5±0.2
Weight
(grams)
0.010
L
W
C
2010
5.3±0.2
2.5±0.2
0.7
0.5±0.2
0.5±0.2
0.035
T
2512
6.6±0.2
3.2±0.2
0.7
0.5±0.2
0.5±0.2
0.055
A
Maximum Continuous Voltage
10000
Power Derating Data
100
Voltage (Volts)
2512
2010
1000
1206
% Of Rated P ower
50
10
100
0.1
1
10
100
25°
70°
155°
Resistance (Megohms)
Temperature in °C
Construction:
Thick film resistor material, overglaze and
organic protection are screen printed on a 96% alumina
substrate. Wrap-around terminations have an electroplated
nickel barrier and tin-lead solder or matte-tin finish, ensur-
ing excellent `leach´ resistance properties and solderability.
Wrap around terminations ensure reliable contact. This ro-
bust construction enables the resistor to be mounted on one
side of a printed circuit board and a wire-leaded component
applied on the opposite side.
Marking:
Components are not marked. Reels are marked
with type, value, tolerance, date code and quantity.
Solvent resistance:
The body protection is resistance to
all normal industrial cleaning solvents suitable for printed
circuits.
PCB Layout Recommendation:
Avoid running conduct-
ing traces between the HVC mounting pads, as this would
compromise the rated voltage.
Advanced Film Division
• 4222 South Staples Street • Corpus Christi Texas 78411 USA
Telephone: 361 992 7900 • Facsimile: 361 992 3377 • Website: www.irctt.com
Ordering Data
Prefix
Chip Type
TKC - HVC
2512LF - 3M30 - F
HVC
Size and Termination
1206 = Sn/Pb solder termination
1206LF = 100% Tin (pb-free) termination
2010 = Sn/Pb solder termination
2010LF = 100% Tin (pb-free) termination
2512 = Sn/Pb solder termination
2512LF = 100% Tin (pb-free) termination
Resistance Value
4 digit code: 100K=100,000 ohms, 1M20=1,200,000 ohms
Tolerance Code
K = ±10%; J = ±5%; G = ±2%; F = ±1%; D = ±0.5%
For additional information or to discuss your specific requirements,
please contact our Applications Team using the contact details below.
PWC Series Issue July 2008
微控制器 MCU
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