电子工程世界电子工程世界电子工程世界

关键词

搜索

型号

搜索

1808H0250272KFT

产品描述Ceramic Capacitor, Multilayer, Ceramic, 25V, 10% +Tol, 10% -Tol, C0G, 30ppm/Cel TC, 0.0027uF, Surface Mount, 1808, CHIP
产品类别无源元件    电容器   
文件大小414KB,共3页
制造商Syfer
下载文档 详细参数 全文预览

1808H0250272KFT概述

Ceramic Capacitor, Multilayer, Ceramic, 25V, 10% +Tol, 10% -Tol, C0G, 30ppm/Cel TC, 0.0027uF, Surface Mount, 1808, CHIP

1808H0250272KFT规格参数

参数名称属性值
是否无铅含铅
是否Rohs认证不符合
厂商名称Syfer
包装说明, 1808
Reach Compliance Codecompli
ECCN代码EAR99
电容0.0027 µF
电容器类型CERAMIC CAPACITOR
介电材料CERAMIC
JESD-609代码e0
制造商序列号X7R
安装特点SURFACE MOUNT
多层Yes
负容差10%
端子数量2
最高工作温度125 °C
最低工作温度-55 °C
封装形状RECTANGULAR PACKAGE
包装方法TR, 7 INCH
正容差10%
额定(直流)电压(URdc)25 V
参考标准IECQ-CECC
尺寸代码1808
表面贴装YES
温度特性代码C0G
温度系数-/+30ppm/Cel ppm/°C
端子面层Tin/Lead (Sn/Pb) - with Nickel (Ni) barrie
端子形状WRAPAROUND

文档预览

下载PDF文档
Open Mode and Tandem capacitors
X7R
Speciality High Rel. and approved parts
IECQ-CECC ranges
Open Mode capacitors have been designed specifically
for use in applications where mechanical cracking is a
severe problem and short circuits due to cracking are
unacceptable.
Open Mode capacitors use inset electrode margins,
which prevent any mechanical cracks which may form
during board assembly from connecting to the internal
electrodes.
When combined with Syfer’s FlexiCap™ termination, Syfer
Open Mode capacitors provide a robust component with the
assurance that if a part becomes cracked, the crack will be
unlikely to result in short circuit failure.
A range of specialist high reliability MLCC’s for use in
critical or high reliability environments. All fully tested
/ approved and available with a range of suitable
termination options, including tin/lead plating and
Syfer Flexicap™.
Ranges include :-
1. Range tested and approved in accordance with
IECQ-CECC QC32100.
2. Range qualified to the requirements of AEC-Q200.
3. Range qualified to the requirements of ESCC 3009
European Space Specification.
Open Mode max capacitance
(X7R only)
0603 0805 1206 1210 1812 2220 2225
16V
25V
50/63V
100V
200/
250V
Open Mode capacitor -
IECQ-CECC - maximum capacitance values
Qualification included cracking the components by severe bend tests.
Following the bend tests cracked components were subjected to
endurance / humidity tests, with no failures evident due to short circuits.
Note: Depending on the severity of the crack, capacitance loss was
between 0% and 70%.
39nF
33nF
22nF
6.8nF
2.7nF
150nF
120nF
100nF
27nF
15nF
470nF
330nF
220nF
100nF
68nF
680nF
560nF
470nF
220nF
100nF
1.5µF
1.2µF
1.0µF
680nF
330nF
3.3µF
2.2µF
1.5µF
1.0µF
680nF
4.7µF
3.9µF
2.7µF
1.8µF
1.0µF
0603
16V
25V
50/63V
C0G/NP0
X7R
C0G/NP0
X7R
C0G/NP0
X7R
C0G/NP0
X7R
C0G/NP0
X7R
C0G/NP0
X7R
C0G/NP0
X7R
1.5nF
100nF
1.0nF
56nF
470pF
47nF
330pF
10nF
100pF
5.6nF
n/a
n/a
n/a
n/a
0805
6.8nF
330nF
4.7nF
220nF
2.7nF
220nF
1.8nF
47nF
680pF
27nF
330pF
8.2nF
n/a
n/a
1206
22nF
1.0µF
15nF
820nF
10nF
470nF
6.8nF
150nF
2.2nF
100nF
1.5nF
33nF
470pF
4.7nF
1210
33nF
1.5µF
22nF
1.2µF
18nF
1.0µF
12nF
470nF
4.7nF
220nF
3.3nF
100nF
1.0nF
15nF
1808
33nF
1.5µF
27nF
1.2µF
18nF
680nF
12nF
330nF
4.7nF
180nF
3.3nF
100nF
1.2nF
18nF
1812
100nF
3.3µF
68nF
2.2µF
33nF
1.5µF
27nF
1.0µF
12nF
470nF
10nF
270nF
3.3nF
56nF
2220
150nF
5.6µF
100nF
4.7µF
68nF
2.2µF
47nF
1.5µF
22nF
1.0µF
15nF
560nF
8.2nF
120nF
2225
220nF
6.8µF
150nF
5.6µF
100nF
3.3µF
68nF
1.5µF
27nF
1.0µF
22nF
820nF
10nF
150nF
Tandem Capacitors have been designed as a fail
safe range using a series section internal design, for
use in any application where short circuits would be
unacceptable.
When combined with Syfer’s FlexiCap™ termination, Syfer
Tandem capacitors provide an ultra robust and reliable
component, for use in the most demanding applications.
100V
200V
500V
Tandem max capacitance
(X7R only)
0603 0805 1206 1210 1812 2220 2225
16V
25V
50/63V
100V
200/
250V
1kV
1.2µF
1.0µF
680nF
470nF
220nF
1.5µF
1.2µF
1.0µF
680nF
330nF
Qualification included cracking the components by severe bend tests.
Following the bend tests cracked components were subjected to
endurance / humidity tests, with no failures evident due to short circuits.
Note: Depending on the severity of the crack, capacitance loss was
between 0% and 50%.
Chip
size
12nF
10nF
6.8nF
2.2nF
1.0nF
47nF
39nF
33nF
10nF
4.7nF
150nF
120nF
100nF
47nF
22nF
270nF
220nF
180nF
82nF
47nF
560nF
470nF
390nF
220nF
100nF
Tandem capacitor -
Ordering information - IECQ-CECC ranges
1210
Y
Termination
100
Voltage
0103
Capacitance in
picofarads (pF)
First digit is 0.
Second and third
digits are significant
figures of capacitance
code.
The fourth digit is
number of zeros
following
Example:
0103 = 10nF
J
Capacitance
tolerance
<10pF
B = ±0.1pF
C = ±0.25pF
D = ±0.5pF
> 10pF
F = ±1%
G = ±2%
J = ±5%
K = ±10%
M = ±20%
D
Dielectric
Release codes
D
= X7R
(2R1) with IECQ-
CECC release
F
= C0G/NP0
(1B/NP0) with IECQ-
CECC release
B
= 2X1/
BX released in
accordance with
IECQ-CECC
R
= 2C1/
BZ released in
accordance with
IECQ-CECC
T
Packaging
___
Suffix
code
Used for
specific
customer
require-
ments
Y
= FlexiCap
TM
termination base with Ni
barrier (100% matte tin
plating). RoHS compliant.
H
= FlexiCap
TM
termination base with Ni
barrier (Tin/lead plating
with min. 10% lead).
F
= Silver Palladium. RoHS
compliant.
J
= Silver base with nickel
barrier (100% matte tin
plating). RoHS compliant.
A
= Silver base with nickel
barrier (Tin/lead plating
with min. 10% lead).
Ordering information - Open Mode and Tandem capacitors
1206
Chip
size
0603
0805
1206
1210
1812
2220
2225
Y
Termination
Y
= Polymer
Termination
FlexiCap™
050
Voltage
016 = 16V
025 = 25V
050 = 50V
063 = 63V
100 = 100V
200 = 200V
250 = 250V
0224
Capacitance in
picofarads (pF)
First digit is 0. Second
and third digits are
significant figures of
capacitance code.
The fourth digit is
number of zeros
following.
Example:
0224 = 220000pF
K
Capacitance
tolerance
K = ±10%
X
Dielectric
codes
X
= X7R
E
= X7R
(AEC-Q200
product)
T
Packaging
T
= 178mm
(7”) reel
R
= 330mm
(13”) reel
___
Suffix
M01
=
Syfer
Open Mode
capacitor
T01
=
Syfer
Tandem
capacitor
016 = 16V
025 = 25V
050 = 50V
063 = 63V
100 = 100V
200 = 200V
250 = 250V
500 = 500V
630 = 630V
1K0 = 1kV
T
= 178mm
(7”) reel
R
= 330mm
(13”) reel
B
= Bulk
pack - tubs
26
27
传说中很神的Wince6怎么这么慢?
传说中Wince6做了很多重大改进,效率大幅度提升。但是我最近从wince5转到Wince6之后,发现: 在PXA270平台上,直接从wince6的MainStoneIII改来的BSP,速度明显比wince5慢很多。在板子上慢吧, ......
KKKK111 嵌入式系统
ADI流式细胞分析仪解决方案
422104 此内容由EEWORLD论坛网友liubingyue原创,如需转载或用于商业用途需征得作者同意并注明出处 ...
liubingyue 医疗电子
两个ARM9板子要进行网络通信,如何设置?
如题,WinCE6.0下,两个ARM9板子,一个做服务器端,一个做客户端。在局域网内,一个ARM9板子用网线和一台PC相连,另一个也用网线和一台PC机相连。服务器端的IP为192.168.0.2。在客户端连接服务 ......
mingdi ARM技术
带有DMA和中断的驱动程序该如何调试,DM可以吗?
能在模拟器上进行调试吗,还是必须得下到板子上?...
bg7jw 嵌入式系统
求教CCS5.5生成.bin文件的问题
我用CCS5.5生成C6000的.bin文件, (1)选择工程,右键选择配置:(2)选择Build,在右侧中选择steps选项;(3)在post build的command下添加以下命令:"${CCE_INSTALL_ROOT}/utils/tiobj2bin/ ......
julycan DSP 与 ARM 处理器
怎样判断PCI设备是PCI还是PCI Express设备
我以穷举的方式获得了所有PCI设备,但是也包含了PCI Express设备。怎么区分一个PCI设备是不是PCI Express设备啊?...
86814429 嵌入式系统

 
EEWorld订阅号

 
EEWorld服务号

 
汽车开发圈

 
机器人开发圈

About Us 关于我们 客户服务 联系方式 器件索引 网站地图 最新更新 手机版

站点相关: 大学堂 TI培训 Datasheet 电子工程 索引文件: 2685  2347  2058  2582  1785  55  48  42  52  36 

器件索引   0 1 2 3 4 5 6 7 8 9 A B C D E F G H I J K L M N O P Q R S T U V W X Y Z

北京市海淀区中关村大街18号B座15层1530室 电话:(010)82350740 邮编:100190

电子工程世界版权所有 京B2-20211791 京ICP备10001474号-1 电信业务审批[2006]字第258号函 京公网安备 11010802033920号 Copyright © 2005-2026 EEWORLD.com.cn, Inc. All rights reserved