18A, 60V, 0.06ohm, N-CHANNEL, Si, POWER, MOSFET, CASE 369C-01, DPAK-3
参数名称 | 属性值 |
是否无铅 | 含铅 |
是否Rohs认证 | 不符合 |
厂商名称 | Rochester Electronics |
包装说明 | CASE 369C-01, DPAK-3 |
针数 | 3 |
制造商包装代码 | CASE 369C-01 |
Reach Compliance Code | unknow |
雪崩能效等级(Eas) | 72 mJ |
外壳连接 | DRAIN |
配置 | SINGLE WITH BUILT-IN DIODE |
最小漏源击穿电压 | 60 V |
最大漏极电流 (ID) | 18 A |
最大漏源导通电阻 | 0.06 Ω |
FET 技术 | METAL-OXIDE SEMICONDUCTOR |
JESD-30 代码 | R-PSSO-G2 |
JESD-609代码 | e0 |
湿度敏感等级 | 1 |
元件数量 | 1 |
端子数量 | 2 |
工作模式 | ENHANCEMENT MODE |
封装主体材料 | PLASTIC/EPOXY |
封装形状 | RECTANGULAR |
封装形式 | SMALL OUTLINE |
峰值回流温度(摄氏度) | 235 |
极性/信道类型 | N-CHANNEL |
最大脉冲漏极电流 (IDM) | 54 A |
认证状态 | COMMERCIAL |
表面贴装 | YES |
端子面层 | TIN LEAD |
端子形式 | GULL WING |
端子位置 | SINGLE |
处于峰值回流温度下的最长时间 | NOT SPECIFIED |
晶体管应用 | SWITCHING |
晶体管元件材料 | SILICON |
NTD18N06 | NTD18N06-1G | NTD18N06T4 | NTD18N06T4G | NTD18N06G | |
---|---|---|---|---|---|
描述 | 18A, 60V, 0.06ohm, N-CHANNEL, Si, POWER, MOSFET, CASE 369C-01, DPAK-3 | 18A, 60V, 0.06ohm, N-CHANNEL, Si, POWER, MOSFET, LEAD FREE, CASE 369D-01, DPAK-3 | 18A, 60V, 0.06ohm, N-CHANNEL, Si, POWER, MOSFET, CASE 369C-01, DPAK-3 | 18A, 60V, 0.06ohm, N-CHANNEL, Si, POWER, MOSFET, LEAD FREE, CASE 369C-01, DPAK-3 | 18A, 60V, 0.06ohm, N-CHANNEL, Si, POWER, MOSFET, LEAD FREE, CASE 369C-01, DPAK-3 |
是否无铅 | 含铅 | 不含铅 | 不含铅 | 不含铅 | 不含铅 |
是否Rohs认证 | 不符合 | 符合 | 不符合 | 符合 | 符合 |
厂商名称 | Rochester Electronics | Rochester Electronics | Rochester Electronics | Rochester Electronics | Rochester Electronics |
包装说明 | CASE 369C-01, DPAK-3 | LEAD FREE, CASE 369D-01, DPAK-3 | CASE 369C-01, DPAK-3 | LEAD FREE, CASE 369C-01, DPAK-3 | LEAD FREE, CASE 369C-01, DPAK-3 |
针数 | 3 | 3 | 3 | 3 | 3 |
制造商包装代码 | CASE 369C-01 | CASE 369D-01 | CASE 369C-01 | CASE 369C-01 | CASE 369C-01 |
Reach Compliance Code | unknow | unknown | unknown | unknown | unknow |
雪崩能效等级(Eas) | 72 mJ | 72 mJ | 72 mJ | 72 mJ | 72 mJ |
外壳连接 | DRAIN | DRAIN | DRAIN | DRAIN | DRAIN |
配置 | SINGLE WITH BUILT-IN DIODE | SINGLE WITH BUILT-IN DIODE | SINGLE WITH BUILT-IN DIODE | SINGLE WITH BUILT-IN DIODE | SINGLE WITH BUILT-IN DIODE |
最小漏源击穿电压 | 60 V | 60 V | 60 V | 60 V | 60 V |
最大漏极电流 (ID) | 18 A | 18 A | 18 A | 18 A | 18 A |
最大漏源导通电阻 | 0.06 Ω | 0.06 Ω | 0.06 Ω | 0.06 Ω | 0.06 Ω |
FET 技术 | METAL-OXIDE SEMICONDUCTOR | METAL-OXIDE SEMICONDUCTOR | METAL-OXIDE SEMICONDUCTOR | METAL-OXIDE SEMICONDUCTOR | METAL-OXIDE SEMICONDUCTOR |
JESD-30 代码 | R-PSSO-G2 | R-PSIP-T3 | R-PSSO-G2 | R-PSSO-G2 | R-PSSO-G2 |
JESD-609代码 | e0 | e3 | e0 | e3 | e3 |
元件数量 | 1 | 1 | 1 | 1 | 1 |
端子数量 | 2 | 3 | 2 | 2 | 2 |
工作模式 | ENHANCEMENT MODE | ENHANCEMENT MODE | ENHANCEMENT MODE | ENHANCEMENT MODE | ENHANCEMENT MODE |
封装主体材料 | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY |
封装形状 | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR |
封装形式 | SMALL OUTLINE | IN-LINE | SMALL OUTLINE | SMALL OUTLINE | SMALL OUTLINE |
峰值回流温度(摄氏度) | 235 | NOT SPECIFIED | 240 | NOT SPECIFIED | 260 |
极性/信道类型 | N-CHANNEL | N-CHANNEL | N-CHANNEL | N-CHANNEL | N-CHANNEL |
最大脉冲漏极电流 (IDM) | 54 A | 54 A | 54 A | 54 A | 54 A |
认证状态 | COMMERCIAL | COMMERCIAL | COMMERCIAL | COMMERCIAL | COMMERCIAL |
表面贴装 | YES | NO | YES | YES | YES |
端子面层 | TIN LEAD | MATTE TIN | TIN LEAD | MATTE TIN | MATTE TIN |
端子形式 | GULL WING | THROUGH-HOLE | GULL WING | GULL WING | GULL WING |
端子位置 | SINGLE | SINGLE | SINGLE | SINGLE | SINGLE |
处于峰值回流温度下的最长时间 | NOT SPECIFIED | NOT SPECIFIED | 30 | NOT SPECIFIED | 40 |
晶体管应用 | SWITCHING | SWITCHING | SWITCHING | SWITCHING | SWITCHING |
晶体管元件材料 | SILICON | SILICON | SILICON | SILICON | SILICON |
湿度敏感等级 | 1 | NOT SPECIFIED | - | NOT SPECIFIED | 1 |
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