8-BIT, 8MHz, MICROPROCESSOR, CDIP40
| 参数名称 | 属性值 |
| 是否Rohs认证 | 不符合 |
| 厂商名称 | Renesas(瑞萨电子) |
| 零件包装代码 | DIP |
| 包装说明 | DIP, DIP40,.6 |
| 针数 | 40 |
| Reach Compliance Code | _compli |
| ECCN代码 | 3A001.A.2.C |
| 地址总线宽度 | 20 |
| 位大小 | 8 |
| 边界扫描 | NO |
| 最大时钟频率 | 8 MHz |
| 外部数据总线宽度 | 8 |
| 格式 | FIXED POINT |
| 集成缓存 | NO |
| JESD-30 代码 | R-CDIP-T40 |
| JESD-609代码 | e0 |
| 低功率模式 | YES |
| DMA 通道数量 | |
| 外部中断装置数量 | 2 |
| 串行 I/O 数 | |
| 端子数量 | 40 |
| 片上数据RAM宽度 | |
| 最高工作温度 | 125 °C |
| 最低工作温度 | -55 °C |
| 封装主体材料 | CERAMIC, METAL-SEALED COFIRED |
| 封装代码 | DIP |
| 封装等效代码 | DIP40,.6 |
| 封装形状 | RECTANGULAR |
| 封装形式 | IN-LINE |
| 电源 | 5 V |
| 认证状态 | Not Qualified |
| RAM（字数） | 0 |
| 筛选级别 | 38535Q/M;38534H;883B |
| 速度 | 8 MHz |
| 最大压摆率 | 80 mA |
| 最大供电电压 | 5.25 V |
| 最小供电电压 | 4.75 V |
| 标称供电电压 | 5 V |
| 表面贴装 | NO |
| 技术 | CMOS |
| 温度等级 | MILITARY |
| 端子面层 | Tin/Lead (Sn/Pb) |
| 端子形式 | THROUGH-HOLE |
| 端子节距 | 2.54 mm |
| 端子位置 | DUAL |
| uPs/uCs/外围集成电路类型 | MICROPROCESSOR |
| MD80C88-2/B | IS80C88-2 | MR80C88/B | IS80C88 | CD80C88-2 | MR80C88-2/B | ID80C88 | |
|---|---|---|---|---|---|---|---|
| 描述 | 8-BIT, 8MHz, MICROPROCESSOR, CDIP40 | 16-BIT, 8MHz, MICROPROCESSOR, PQCC44, PLASTIC, LCC-44 | 16-BIT, 5MHz, MICROPROCESSOR, CQCC44, LCC-44 | 8-BIT, 5MHz, MICROPROCESSOR, PQCC44 | 8-BIT, 8MHz, MICROPROCESSOR, CDIP40 | 16-BIT, 8MHz, MICROPROCESSOR, CQCC44, LCC-44 | 16-BIT, 5MHz, MICROPROCESSOR, CDIP40, CERDIP-40 |
| 是否Rohs认证 | 不符合 | 不符合 | 不符合 | 不符合 | 不符合 | 不符合 | 不符合 |
| 厂商名称 | Renesas(瑞萨电子) | Renesas(瑞萨电子) | Renesas(瑞萨电子) | Renesas(瑞萨电子) | Renesas(瑞萨电子) | Renesas(瑞萨电子) | Renesas(瑞萨电子) |
| 零件包装代码 | DIP | LCC | LCC | LCC | DIP | LCC | DIP |
| 包装说明 | DIP, DIP40,.6 | PLASTIC, LCC-44 | LCC-44 | PLASTIC, LCC-44 | DIP, DIP40,.6 | LCC-44 | DIP, DIP40,.6 |
| 针数 | 40 | 44 | 44 | 44 | 40 | 44 | 40 |
| Reach Compliance Code | _compli | not_compliant | not_compliant | not_compliant | not_compliant | not_compliant | _compli |
| 地址总线宽度 | 20 | 20 | 20 | 20 | 20 | 20 | 20 |
| 位大小 | 8 | 16 | 16 | 8 | 8 | 16 | 16 |
| 边界扫描 | NO | NO | NO | NO | NO | NO | NO |
| 最大时钟频率 | 8 MHz | 8 MHz | 5 MHz | 5 MHz | 8 MHz | 8 MHz | 5 MHz |
| 外部数据总线宽度 | 8 | 8 | 8 | 8 | 8 | 8 | 8 |
| 格式 | FIXED POINT | FIXED POINT | FIXED POINT | FIXED POINT | FIXED POINT | FIXED POINT | FIXED POINT |
| 集成缓存 | NO | NO | NO | NO | NO | NO | NO |
| JESD-30 代码 | R-CDIP-T40 | S-PQCC-J44 | S-CQCC-N44 | S-PQCC-J44 | R-CDIP-T40 | S-CQCC-N44 | R-GDIP-T40 |
| JESD-609代码 | e0 | e0 | e0 | e0 | e0 | e0 | e0 |
| 低功率模式 | YES | YES | YES | YES | YES | YES | YES |
| 端子数量 | 40 | 44 | 44 | 44 | 40 | 44 | 40 |
| 最高工作温度 | 125 °C | 85 °C | 125 °C | 85 °C | 70 °C | 125 °C | 85 °C |
| 最低工作温度 | -55 °C | -40 °C | -55 °C | -40 °C | - | -55 °C | -40 °C |
| 封装主体材料 | CERAMIC, METAL-SEALED COFIRED | PLASTIC/EPOXY | CERAMIC, METAL-SEALED COFIRED | PLASTIC/EPOXY | CERAMIC, METAL-SEALED COFIRED | CERAMIC, METAL-SEALED COFIRED | CERAMIC, GLASS-SEALED |
| 封装代码 | DIP | QCCJ | QCCN | QCCJ | DIP | QCCN | DIP |
| 封装等效代码 | DIP40,.6 | LDCC44,.7SQ | LCC44,.65SQ | LDCC44,.7SQ | DIP40,.6 | LCC44,.65SQ | DIP40,.6 |
| 封装形状 | RECTANGULAR | SQUARE | SQUARE | SQUARE | RECTANGULAR | SQUARE | RECTANGULAR |
| 封装形式 | IN-LINE | CHIP CARRIER | CHIP CARRIER | CHIP CARRIER | IN-LINE | CHIP CARRIER | IN-LINE |
| 电源 | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V |
| 认证状态 | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified |
| 速度 | 8 MHz | 8 MHz | 5 MHz | 5 MHz | 8 MHz | 8 MHz | 5 MHz |
| 最大压摆率 | 80 mA | 80.5 mA | 50.5 mA | 50 mA | 80 mA | 80.5 mA | 50.5 mA |
| 最大供电电压 | 5.25 V | 5.5 V | 5.5 V | 5.5 V | 5.5 V | 5.25 V | 5.5 V |
| 最小供电电压 | 4.75 V | 4.5 V | 4.5 V | 4.5 V | 4.5 V | 4.75 V | 4.5 V |
| 标称供电电压 | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V |
| 表面贴装 | NO | YES | YES | YES | NO | YES | NO |
| 技术 | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS |
| 温度等级 | MILITARY | INDUSTRIAL | MILITARY | INDUSTRIAL | COMMERCIAL | MILITARY | INDUSTRIAL |
| 端子面层 | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) |
| 端子形式 | THROUGH-HOLE | J BEND | NO LEAD | J BEND | THROUGH-HOLE | NO LEAD | THROUGH-HOLE |
| 端子节距 | 2.54 mm | 1.27 mm | 1.27 mm | 1.27 mm | 2.54 mm | 1.27 mm | 2.54 mm |
| 端子位置 | DUAL | QUAD | QUAD | QUAD | DUAL | QUAD | DUAL |
| uPs/uCs/外围集成电路类型 | MICROPROCESSOR | MICROPROCESSOR | MICROPROCESSOR | MICROPROCESSOR | MICROPROCESSOR | MICROPROCESSOR | MICROPROCESSOR |
| 峰值回流温度（摄氏度） | - | NOT SPECIFIED | NOT SPECIFIED | - | - | NOT SPECIFIED | NOT SPECIFIED |
| 座面最大高度 | - | 4.57 mm | 3.05 mm | - | - | 3.05 mm | 5.72 mm |
| 处于峰值回流温度下的最长时间 | - | NOT SPECIFIED | NOT SPECIFIED | - | - | NOT SPECIFIED | NOT SPECIFIED |
| 宽度 | - | 16.585 mm | 16.535 mm | - | - | 16.535 mm | 15.24 mm |
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